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Fans, Thermal Management  ·  Heat Sinks
 

1327 — ALUM EXTR - 6FT LENGTH

ManufacturerWakefield Thermal Solutions
Harmful substancesRoHS   Lead-free
MaterialAluminum
Found under nameQ4227706
Analogous by characteristics
PhotoNameManufacturerTechnical parametersPrices (rub.)Buy
628-65AB628-65ABWakefield Thermal SolutionsHEATSINK CPU 43MM SQ BLK H=.65
Series: 628  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Not Included)  ·  Outline: 44.45mm x 43.18mm  ·  Height: 0.65" (16.5mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 4.5W @ 30°C  ·  Thermal Resistance @ Forced Air Flow: 1.5°C/W @ 400 LFM
from 1,00
from 2,40		Additional information
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641A641AWakefield Thermal SolutionsHEATSINK TO-3 PWR HORZ MT BLK
Series: 641  ·  Package Cooled: TO-3  ·  Attachment Method: Bolt On  ·  Outline: 104.77mm x 76.20mm  ·  Height: 1" (25.4mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 15W @ 36°C  ·  Thermal Resistance @ Forced Air Flow: 0.9°C/W @ 250 LFM  ·  Thermal Resistance @ Natural: 2.4°C/W
from 4,54
from 10,89		Additional information
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658-60AB658-60ABWakefield Thermal SolutionsHEATSINK CPU 28MM SQ BLK W/OTAPE
Series: 658  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Not Included)  ·  Outline: 27.94mm x 27.94mm  ·  Height: 0.6" (15.24mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2.5W @ 30°C  ·  Thermal Resistance @ Forced Air Flow: 3°C/W @ 300 LFM
from 0,73
from 2,00		Additional information
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258Wakefield Thermal Solutions.5X.25X.34 HEATSINK FOR DIODE
Series: 258  ·  Attachment Method: Thermal Tape, Adhesive (Not Included)  ·  Outline: 12.70mm x 6.35mm  ·  Height: 0.34" (8.64mm)  ·  Material: Aluminum
from 20,98Additional information
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392-180AB392-180ABWakefield Thermal SolutionsHEATSINK EXTRUSION IGBT/SSR BLK
Series: 392  ·  Attachment Method: Press Fit  ·  Outline: 180.01mm x 124.97mm  ·  Height: 5.34" (135.64mm)  ·  Material: Aluminum  ·  Thermal Resistance @ Forced Air Flow: 0.1°C/W @ 100 LFM  ·  Thermal Resistance @ Natural: 0.43°C/W
from 60,06
from 120,13		Additional information
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289AB289ABWakefield Thermal SolutionsHEATSINK TO-220 VERT/HORZ BLK
Series: 289  ·  Package Cooled: TO-218, TO-202, TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 25.40mm x 18.03mm  ·  Height: 0.5" (12.7mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 50°C  ·  Thermal Resistance @ Forced Air Flow: 44°C/W @ 400 LFM  ·  Thermal Resistance @ Natural: 25°C/W
from 0,15
from 0,42		Additional information
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623KWakefield Thermal SolutionsHEAT SINK PWR NO MNT HOLES BLK
Series: 623  ·  Package Cooled: TO-3  ·  Attachment Method: Press Fit  ·  Outline: 120.65mm x 76.20mm  ·  Height: 0.43" (11mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 15W @ 52°C  ·  Thermal Resistance @ Forced Air Flow: 1.5°C/W @ 250 LFM  ·  Thermal Resistance @ Natural: 3.5°C/W
from 6,24Additional information
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637-10ABP637-10ABPWakefield Thermal SolutionsHEATSINK TO-220 VERT MT BLK 1
Series: 637  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 34.92mm x 12.70mm  ·  Height: 1" (25.4mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 6W @ 76°C  ·  Thermal Resistance @ Forced Air Flow: 5.8°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 12.7°C/W
from 0,84
from 2,31		Additional information
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274-1AB274-1ABWakefield Thermal SolutionsHEATSINK TO-220 LOW HEIGHT BLK
Series: 274  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 19.05mm x 13.21mm  ·  Height: 0.375" (9.53mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 56°C  ·  Thermal Resistance @ Forced Air Flow: 8.0°C/W @ 400 LFM  ·  Thermal Resistance @ Natural: 28°C/W
from 0,13
from 0,35		Additional information
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401K401KWakefield Thermal SolutionsHEATSINK POWER NO MNT HOLES BLK
Series: 401  ·  Package Cooled: TO-3  ·  Attachment Method: Bolt On  ·  Outline: 120.65mm x 38.10mm  ·  Height: 1.25" (31.75mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 30W @ 80°C  ·  Thermal Resistance @ Forced Air Flow: 1.5°C/W @ 250 LFM  ·  Thermal Resistance @ Natural: 3°C/W
from 5,31
from 12,75		Additional information
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658-45ABT4658-45ABT4Wakefield Thermal SolutionsHEATSINK CPU 28MM SQ BLK W/TAPE
Series: 658  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 27.94mm x 27.94mm  ·  Height: 0.45" (11.43mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 3W @ 50°C  ·  Thermal Resistance @ Forced Air Flow: 6.0°C/W @ 200 LFM
from 1,45
from 3,48		Additional information
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637-15ABP637-15ABPWakefield Thermal SolutionsHEATSINK TO-220 VERT MT BLK 1.5
Series: 637  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 34.92mm x 12.70mm  ·  Height: 1.5" (38.1mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 6W @ 65°C  ·  Thermal Resistance @ Forced Air Flow: 5.5°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 10.8°C/W
from 0,87
from 2,38		Additional information
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658-25ABT4658-25ABT4Wakefield Thermal SolutionsHEATSINK CPU 28MM SQ BLK W/TAPE
Series: 658  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 27.94mm x 27.94mm  ·  Height: 0.25" (6.35mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 4W @ 70°C  ·  Thermal Resistance @ Forced Air Flow: 5°C/W @ 500 LFM
from 1,34
from 3,21		Additional information
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658-35AB658-35ABWakefield Thermal SolutionsHEATSINK CPU 28MM SQBLK W/O TAPE
Series: 658  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Not Included)  ·  Outline: 27.94mm x 27.94mm  ·  Height: 0.35" (9mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 50°C  ·  Thermal Resistance @ Forced Air Flow: 8.0°C/W @ 200 LFM
from 0,60
from 1,65		Additional information
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013224Wakefield Thermal SolutionsHEATSINK EXTRUSION ALUM 8FT
Material: Aluminum
from 91,62Additional information
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262-75AB-05262-75AB-05Wakefield Thermal SolutionsHEATSINK VERT/HORIZ BLACK TO-220
Series: 262  ·  Package Cooled: TO-220  ·  Attachment Method: Press Fit and PC Pin  ·  Outline: 14.48mm x 12.70mm  ·  Height: 0.75" (19.05mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 3W @ 80°C  ·  Thermal Resistance @ Forced Air Flow: 10.0°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 26.7°C/W
from 0,24
from 0,67		Additional information
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625-25ABT4625-25ABT4Wakefield Thermal SolutionsHEATSINK CPU 25MM SQ W/DBL TAPE
Series: 625  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 25.00mm x 25.00mm  ·  Height: 0.25" (6.35mm)  ·  Material: Aluminum  ·  Thermal Resistance @ Forced Air Flow: 12°C/W @ 500 LFM
from 1,35
from 3,71		Additional information
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658-60ABT3658-60ABT3Wakefield Thermal SolutionsHEATSINK CPU 28MM SQ BLK W/TAPE
Series: 658  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 27.94mm x 27.94mm  ·  Height: 0.6" (15.24mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2.5W @ 30°C  ·  Thermal Resistance @ Forced Air Flow: 3°C/W @ 300 LFM
from 1,48
from 3,54		Additional information
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658-45AB658-45ABWakefield Thermal SolutionsHEATSINK CPU 28MM SQBLK W/O TAPE
Series: 658  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Not Included)  ·  Outline: 27.94mm x 27.94mm  ·  Height: 0.45" (11.43mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 3W @ 50°C  ·  Thermal Resistance @ Forced Air Flow: 6.0°C/W @ 200 LFM
from 0,62
from 1,72		Additional information
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657-20ABP657-20ABPWakefield Thermal SolutionsHEATSINK TO-220 W/PINS BLK 2
Series: 657  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 41.91mm x 25.40mm  ·  Height: 2" (50.8mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 6W @ 32°C  ·  Thermal Resistance @ Forced Air Flow: 2.9°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 5.3°C/W
from 1,08
from 2,98		Additional information
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634-15ABP634-15ABPWakefield Thermal SolutionsHEATSINK SLIM VERT BLACK TO-220
Series: 634  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 16.25mm x 16.25mm  ·  Height: 1.5" (38.1mm)  ·  Material: Aluminum
from 1,06
from 2,91		Additional information
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658-25ABT3658-25ABT3Wakefield Thermal SolutionsHEATSINK CPU 28MM SQ BLK W/TAPE
Series: 658  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 27.94mm x 27.94mm  ·  Height: 0.25" (6.35mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 40°C  ·  Thermal Resistance @ Forced Air Flow: 5°C/W @ 500 LFM
from 1,36
from 3,27		Additional information
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273-AB273-ABWakefield Thermal SolutionsHEATSINK TO-220 LOW HEIGHT BLK
Series: 273  ·  Package Cooled: TO-220, TO-218  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 19.05mm x 19.05mm  ·  Height: 0.375" (9.53mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 49°C  ·  Thermal Resistance @ Forced Air Flow: 7.2°C/W @ 400 LFM  ·  Thermal Resistance @ Natural: 24.5°C/W
from 0,20
from 0,56		Additional information
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287-1AB287-1ABWakefield Thermal SolutionsHEATSINK TO-220 VERT W/TABS BLK
Series: 287  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 25.40mm x 12.70mm  ·  Height: 1.18" (29.97mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 4W @ 65°C  ·  Thermal Resistance @ Forced Air Flow: 7.8°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 16.2°C/W
from 0,69
from 1,89		Additional information
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677-10ABPWakefield Thermal SolutionsHEATSINK MULTIWATT 1.0" BLK
Series: 677  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 41.91mm x 25.40mm  ·  Height: 1" (25.4mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 6W @ 76°C  ·  Thermal Resistance @ Forced Air Flow: 5.8°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 8.7°C/W
from 1,43Additional information
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