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Fans, Thermal Management  ·  Heat Sinks
 

013224 — HEATSINK EXTRUSION ALUM 8FT

ManufacturerWakefield Thermal Solutions
Harmful substancesRoHS   Lead-free
MaterialAluminum
Found under nameQ4146974
Analogous by characteristics
PhotoNameManufacturerTechnical parametersPrices (rub.)Buy
628-65AB628-65ABWakefield Thermal SolutionsHEATSINK CPU 43MM SQ BLK H=.65
Series: 628  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Not Included)  ·  Outline: 44.45mm x 43.18mm  ·  Height: 0.65" (16.5mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 4.5W @ 30°C  ·  Thermal Resistance @ Forced Air Flow: 1.5°C/W @ 400 LFM
from 1,00
from 2,40		Additional information
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641A641AWakefield Thermal SolutionsHEATSINK TO-3 PWR HORZ MT BLK
Series: 641  ·  Package Cooled: TO-3  ·  Attachment Method: Bolt On  ·  Outline: 104.77mm x 76.20mm  ·  Height: 1" (25.4mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 15W @ 36°C  ·  Thermal Resistance @ Forced Air Flow: 0.9°C/W @ 250 LFM  ·  Thermal Resistance @ Natural: 2.4°C/W
from 4,54
from 10,89		Additional information
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658-60AB658-60ABWakefield Thermal SolutionsHEATSINK CPU 28MM SQ BLK W/OTAPE
Series: 658  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Not Included)  ·  Outline: 27.94mm x 27.94mm  ·  Height: 0.6" (15.24mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2.5W @ 30°C  ·  Thermal Resistance @ Forced Air Flow: 3°C/W @ 300 LFM
from 0,73
from 2,00		Additional information
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258Wakefield Thermal Solutions.5X.25X.34 HEATSINK FOR DIODE
Series: 258  ·  Attachment Method: Thermal Tape, Adhesive (Not Included)  ·  Outline: 12.70mm x 6.35mm  ·  Height: 0.34" (8.64mm)  ·  Material: Aluminum
from 20,98Additional information
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392-180AB392-180ABWakefield Thermal SolutionsHEATSINK EXTRUSION IGBT/SSR BLK
Series: 392  ·  Attachment Method: Press Fit  ·  Outline: 180.01mm x 124.97mm  ·  Height: 5.34" (135.64mm)  ·  Material: Aluminum  ·  Thermal Resistance @ Forced Air Flow: 0.1°C/W @ 100 LFM  ·  Thermal Resistance @ Natural: 0.43°C/W
from 60,06
from 120,13		Additional information
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623KWakefield Thermal SolutionsHEAT SINK PWR NO MNT HOLES BLK
Series: 623  ·  Package Cooled: TO-3  ·  Attachment Method: Press Fit  ·  Outline: 120.65mm x 76.20mm  ·  Height: 0.43" (11mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 15W @ 52°C  ·  Thermal Resistance @ Forced Air Flow: 1.5°C/W @ 250 LFM  ·  Thermal Resistance @ Natural: 3.5°C/W
from 6,24Additional information
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289AB289ABWakefield Thermal SolutionsHEATSINK TO-220 VERT/HORZ BLK
Series: 289  ·  Package Cooled: TO-218, TO-202, TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 25.40mm x 18.03mm  ·  Height: 0.5" (12.7mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 50°C  ·  Thermal Resistance @ Forced Air Flow: 44°C/W @ 400 LFM  ·  Thermal Resistance @ Natural: 25°C/W
from 0,15
from 0,42		Additional information
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637-10ABP637-10ABPWakefield Thermal SolutionsHEATSINK TO-220 VERT MT BLK 1
Series: 637  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 34.92mm x 12.70mm  ·  Height: 1" (25.4mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 6W @ 76°C  ·  Thermal Resistance @ Forced Air Flow: 5.8°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 12.7°C/W
from 0,84
from 2,31		Additional information
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274-1AB274-1ABWakefield Thermal SolutionsHEATSINK TO-220 LOW HEIGHT BLK
Series: 274  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 19.05mm x 13.21mm  ·  Height: 0.375" (9.53mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 56°C  ·  Thermal Resistance @ Forced Air Flow: 8.0°C/W @ 400 LFM  ·  Thermal Resistance @ Natural: 28°C/W
from 0,13
from 0,35		Additional information
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401K401KWakefield Thermal SolutionsHEATSINK POWER NO MNT HOLES BLK
Series: 401  ·  Package Cooled: TO-3  ·  Attachment Method: Bolt On  ·  Outline: 120.65mm x 38.10mm  ·  Height: 1.25" (31.75mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 30W @ 80°C  ·  Thermal Resistance @ Forced Air Flow: 1.5°C/W @ 250 LFM  ·  Thermal Resistance @ Natural: 3°C/W
from 5,31
from 12,75		Additional information
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658-45ABT4658-45ABT4Wakefield Thermal SolutionsHEATSINK CPU 28MM SQ BLK W/TAPE
Series: 658  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 27.94mm x 27.94mm  ·  Height: 0.45" (11.43mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 3W @ 50°C  ·  Thermal Resistance @ Forced Air Flow: 6.0°C/W @ 200 LFM
from 1,45
from 3,48		Additional information
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637-15ABP637-15ABPWakefield Thermal SolutionsHEATSINK TO-220 VERT MT BLK 1.5
Series: 637  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 34.92mm x 12.70mm  ·  Height: 1.5" (38.1mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 6W @ 65°C  ·  Thermal Resistance @ Forced Air Flow: 5.5°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 10.8°C/W
from 0,87
from 2,38		Additional information
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287-1AB287-1ABWakefield Thermal SolutionsHEATSINK TO-220 VERT W/TABS BLK
Series: 287  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 25.40mm x 12.70mm  ·  Height: 1.18" (29.97mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 4W @ 65°C  ·  Thermal Resistance @ Forced Air Flow: 7.8°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 16.2°C/W
from 0,69
from 1,89		Additional information
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677-10ABPWakefield Thermal SolutionsHEATSINK MULTIWATT 1.0" BLK
Series: 677  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 41.91mm x 25.40mm  ·  Height: 1" (25.4mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 6W @ 76°C  ·  Thermal Resistance @ Forced Air Flow: 5.8°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 8.7°C/W
from 1,43Additional information
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680-125A680-125AWakefield Thermal SolutionsHEATSINK POWER TO-3 BLK
Series: 680  ·  Package Cooled: TO-3  ·  Attachment Method: Bolt On  ·  Outline: 45.97mm x 45.97mm  ·  Height: 1.25" (31.75mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 8W @ 45°C  ·  Thermal Resistance @ Forced Air Flow: 1.5°C/W @ 400 LFM  ·  Thermal Resistance @ Natural: 6°C/W
from 5,18
from 12,42		Additional information
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270-AB270-ABWakefield Thermal SolutionsHEATSINK TO-220 SM FOOTPRINT BLK
Series: 270  ·  Package Cooled: TO-220, TO-202  ·  Attachment Method: Bolt On  ·  Outline: 44.45mm x 17.78mm  ·  Height: 0.375" (9.53mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 4W @ 70°C  ·  Thermal Resistance @ Forced Air Flow: 6.0°C/W @ 400 LFM  ·  Thermal Resistance @ Natural: 17.5°C/W
from 0,18
from 0,49		Additional information
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637-20ABP637-20ABPWakefield Thermal SolutionsHEATSINK TO-220 VERT MT BLK 2
Series: 637  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 34.92mm x 12.70mm  ·  Height: 2" (50.8mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 6W @ 55°C  ·  Thermal Resistance @ Forced Air Flow: 4.7°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 9.2°C/W
from 1,03
from 2,84		Additional information
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233-60ABWakefield Thermal SolutionsHEATSINK TO-220 VERT/HORZ BLK
Series: 233  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On  ·  Outline: 14.48mm x 12.70mm  ·  Height: 0.600" (15.20mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 58°C  ·  Thermal Resistance @ Forced Air Flow: 11.0°C/W @ 400 LFM  ·  Thermal Resistance @ Natural: 29°C/W
from 0,22Additional information
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658-35ABT4E658-35ABT4EWakefield Thermal SolutionsHEATSINK CPU 28MM SQ BLK W/TAPE
Series: 658  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 27.94mm x 27.94mm  ·  Height: 0.35" (9mm)  ·  Material: Aluminum  ·  Thermal Resistance @ Forced Air Flow: 8.0°C/W @ 200 LFM
from 1,39
from 3,33		Additional information
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230-75AB230-75ABWakefield Thermal SolutionsHEATSINK TO-220 VERT/HORZ BLK
Series: 230  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On  ·  Outline: 14.48mm x 12.70mm  ·  Height: 0.75" (19.05mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 57°C  ·  Thermal Resistance @ Forced Air Flow: 7.5°C/W @ 400 LFM  ·  Thermal Resistance @ Natural: 28.5°C/W
from 0,20
from 0,56		Additional information
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657-20ABPE657-20ABPEWakefield Thermal SolutionsHEATSINK TO-220 W/PINS BLK 2
Series: 657  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 41.91mm x 25.40mm  ·  Height: 2" (50.8mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 6W @ 32°C  ·  Thermal Resistance @ Forced Air Flow: 2.9°C/W @ 200 LFM
from 1,19Additional information
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528-45AB-MS4528-45AB-MS4Wakefield Thermal SolutionsHEATSINK BXB50,75,100,150.45"VRT
Series: 528  ·  Package Cooled: Half Brick DC/DC Converter  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 61.00mm x 57.90mm  ·  Height: 0.45" (11.43mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 7W @ 60°C  ·  Thermal Resistance @ Forced Air Flow: 3.2°C/W @ 300 LFM
from 6,94Additional information
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642-45AB642-45ABWakefield Thermal SolutionsHEATSINK CPU 35MM SQ H=.45" BLK
Series: 642  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Not Included)  ·  Outline: 35.00mm x 35.00mm  ·  Height: 0.45" (11.43mm)  ·  Material: Aluminum
from 0,83
from 2,28		Additional information
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235-85AB235-85ABWakefield Thermal SolutionsHEATSINK TO-220 CLIP-ON BLK
Series: 235  ·  Package Cooled: TO-220  ·  Attachment Method: Clip  ·  Outline: 25.40mm x 12.70mm  ·  Height: 0.85" (21.59mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 40°C  ·  Thermal Resistance @ Forced Air Flow: 6.8°C/W @ 400 LFM  ·  Thermal Resistance @ Natural: 20°C/W
from 0,24
from 0,67		Additional information
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206-1PABH206-1PABHWakefield Thermal SolutionsHEATSINK VERT ALUM BLK TO-220
Series: 206  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 25.40mm x 12.70mm  ·  Height: 1.18" (29.97mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 4W @ 56°C  ·  Thermal Resistance @ Natural: 14°C/W
from 0,23
from 0,63		Additional information
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