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658-60ABT3

- Dimensional Drawing

658-60ABT3 — HEATSINK CPU 28MM SQ BLK W/TAPE

ManufacturerWakefield Thermal Solutions
Harmful substancesRoHS   Lead-free
Series658
Package CooledAssorted (BGA, LGA, CPU, ASIC...)
Attachment MethodThermal Tape, Adhesive (Included)
Outline27.94mm x 27.94mm
Height0.6" (15.24mm)
MaterialAluminum
Power Dissipation @ Temperature Rise2.5W @ 30°C
Thermal Resistance @ Forced Air Flow3°C/W @ 300 LFM
Found under name345-1075
Analogous by characteristics
PhotoNameManufacturerTechnical parametersPrices (rub.)Buy
658-60ABT2658-60ABT2Wakefield Thermal SolutionsHEATSINK CPU 28MM SQ BLK W/TAPE
Series: 658  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 27.94mm x 27.94mm  ·  Height: 0.6" (15.24mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2.5W @ 30°C  ·  Thermal Resistance @ Forced Air Flow: 3°C/W @ 300 LFM
Additional information
Find at suppliers
658-60ABT4658-60ABT4Wakefield Thermal SolutionsHEATSINK CPU 27.9MM SQ W/ADH BLK
Series: 658  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 27.94mm x 27.94mm  ·  Height: 0.6" (15.24mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2.5W @ 30°C  ·  Thermal Resistance @ Forced Air Flow: 3°C/W @ 300 LFM
from 1,50
from 3,60		Additional information
Find at suppliers
658-60ABT1658-60ABT1Wakefield Thermal SolutionsHEATSINK CPU 28MM SQ BLK W/TAPE
Series: 658  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 27.94mm x 27.94mm  ·  Height: 0.6" (15.24mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2.5W @ 30°C  ·  Thermal Resistance @ Forced Air Flow: 3°C/W @ 300 LFM
from 1,36
from 3,27		Additional information
Find at suppliers
658-60ABT4E658-60ABT4EWakefield Thermal SolutionsHEATSINK CPU 27.9MM SQ W/ADH BLK
Series: 658  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 27.94mm x 27.94mm  ·  Height: 0.6" (15.24mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2.5W @ 30°C  ·  Thermal Resistance @ Forced Air Flow: 3°C/W @ 300 LFM
from 1,53
from 4,20		Additional information
Find at suppliers

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