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016304-81 — ALUMINUM EXTRUSION FLATBACK

ManufacturerWakefield Thermal Solutions
Harmful substancesRoHS   Lead-free
Found under nameQ4125634A
Analogous by characteristics
PhotoNameManufacturerTechnical parametersPrices (rub.)Buy
658-35AB658-35ABWakefield Thermal SolutionsHEATSINK CPU 28MM SQBLK W/O TAPE
Series: 658  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Not Included)  ·  Outline: 27.94mm x 27.94mm  ·  Height: 0.35" (9mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 50°C  ·  Thermal Resistance @ Forced Air Flow: 8.0°C/W @ 200 LFM
from 0,60
from 1,65		Additional information
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658-25ABT4658-25ABT4Wakefield Thermal SolutionsHEATSINK CPU 28MM SQ BLK W/TAPE
Series: 658  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 27.94mm x 27.94mm  ·  Height: 0.25" (6.35mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 4W @ 70°C  ·  Thermal Resistance @ Forced Air Flow: 5°C/W @ 500 LFM
from 1,34
from 3,21		Additional information
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013224Wakefield Thermal SolutionsHEATSINK EXTRUSION ALUM 8FT
Material: Aluminum
from 91,62Additional information
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262-75AB-05262-75AB-05Wakefield Thermal SolutionsHEATSINK VERT/HORIZ BLACK TO-220
Series: 262  ·  Package Cooled: TO-220  ·  Attachment Method: Press Fit and PC Pin  ·  Outline: 14.48mm x 12.70mm  ·  Height: 0.75" (19.05mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 3W @ 80°C  ·  Thermal Resistance @ Forced Air Flow: 10.0°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 26.7°C/W
from 0,24
from 0,67		Additional information
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625-25ABT4625-25ABT4Wakefield Thermal SolutionsHEATSINK CPU 25MM SQ W/DBL TAPE
Series: 625  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 25.00mm x 25.00mm  ·  Height: 0.25" (6.35mm)  ·  Material: Aluminum  ·  Thermal Resistance @ Forced Air Flow: 12°C/W @ 500 LFM
from 1,35
from 3,71		Additional information
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658-45AB658-45ABWakefield Thermal SolutionsHEATSINK CPU 28MM SQBLK W/O TAPE
Series: 658  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Not Included)  ·  Outline: 27.94mm x 27.94mm  ·  Height: 0.45" (11.43mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 3W @ 50°C  ·  Thermal Resistance @ Forced Air Flow: 6.0°C/W @ 200 LFM
from 0,62
from 1,72		Additional information
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658-60ABT3658-60ABT3Wakefield Thermal SolutionsHEATSINK CPU 28MM SQ BLK W/TAPE
Series: 658  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 27.94mm x 27.94mm  ·  Height: 0.6" (15.24mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2.5W @ 30°C  ·  Thermal Resistance @ Forced Air Flow: 3°C/W @ 300 LFM
from 1,48
from 3,54		Additional information
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657-20ABP657-20ABPWakefield Thermal SolutionsHEATSINK TO-220 W/PINS BLK 2
Series: 657  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 41.91mm x 25.40mm  ·  Height: 2" (50.8mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 6W @ 32°C  ·  Thermal Resistance @ Forced Air Flow: 2.9°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 5.3°C/W
from 1,08
from 2,98		Additional information
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634-15ABP634-15ABPWakefield Thermal SolutionsHEATSINK SLIM VERT BLACK TO-220
Series: 634  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 16.25mm x 16.25mm  ·  Height: 1.5" (38.1mm)  ·  Material: Aluminum
from 1,06
from 2,91		Additional information
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658-25ABT3658-25ABT3Wakefield Thermal SolutionsHEATSINK CPU 28MM SQ BLK W/TAPE
Series: 658  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 27.94mm x 27.94mm  ·  Height: 0.25" (6.35mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 40°C  ·  Thermal Resistance @ Forced Air Flow: 5°C/W @ 500 LFM
from 1,36
from 3,27		Additional information
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273-AB273-ABWakefield Thermal SolutionsHEATSINK TO-220 LOW HEIGHT BLK
Series: 273  ·  Package Cooled: TO-220, TO-218  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 19.05mm x 19.05mm  ·  Height: 0.375" (9.53mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 49°C  ·  Thermal Resistance @ Forced Air Flow: 7.2°C/W @ 400 LFM  ·  Thermal Resistance @ Natural: 24.5°C/W
from 0,20
from 0,56		Additional information
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6933-72Wakefield Thermal SolutionsHEATSINK EXTRUSIONfrom 50,76Additional information
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287-1ABH287-1ABHWakefield Thermal SolutionsHEATSINK VERT MT HOLE BLK TO-220
Series: 287  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 25.40mm x 12.70mm  ·  Height: 1.18" (29.97mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 4W @ 65°C  ·  Thermal Resistance @ Forced Air Flow: 7.8°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 16.2°C/W
from 0,69Additional information
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537-95ABWakefield Thermal SolutionsHEATSINK DC DC 1/4 BRICK VERT
Series: 537  ·  Attachment Method: Bolt On  ·  Outline: 57.91mm x 36.83mm  ·  Height: 0.95" (24.13mm)  ·  Material: Aluminum  ·  Thermal Resistance @ Forced Air Flow: 2.1°C/W @ 300 LFM
from 3,64Additional information
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658-45ABT2Wakefield Thermal SolutionsHEATSINK CPU 28MM SQ BLK W/TAPE
Series: 658  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 27.94mm x 27.94mm  ·  Height: 0.45" (11.43mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 3W @ 50°C  ·  Thermal Resistance @ Forced Air Flow: 6.0°C/W @ 200 LFM
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291-H36AB291-H36ABWakefield Thermal SolutionsHEATSINK TO-220 CLIP-ON BLK
Series: 291  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On  ·  Outline: 27.94mm x 9.14mm  ·  Height: 0.86" (21.84mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 68°C  ·  Thermal Resistance @ Forced Air Flow: 16.0°C/W @ 600 LFM  ·  Thermal Resistance @ Natural: 34°C/W
from 0,32
from 0,88		Additional information
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624-45ABWakefield Thermal SolutionsHEATSINK CPU 21MM SQ W/OUT ADH
Series: 624  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Not Included)  ·  Outline: 21.00mm x 21.00mm  ·  Height: 0.45" (11.43mm)  ·  Material: Aluminum
from 1,20Additional information
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658-35ABT3658-35ABT3Wakefield Thermal SolutionsHEATSINK CPU 28MM SQ BLK W/TAPE
Series: 658  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 27.94mm x 27.94mm  ·  Height: 0.35" (9mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 50°C
from 1,36
from 3,27		Additional information
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265-118ABH-22Wakefield Thermal SolutionsHEATSINK VERT ALUM BLACK TO-220
Series: 265  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 25.40mm x 12.70mm  ·  Height: 1.18" (29.97mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 4W @ 56°C  ·  Thermal Resistance @ Forced Air Flow: 7.0°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 14°C/W
from 0,23Additional information
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630-45ABWakefield Thermal SolutionsHEATSINK FOR BGAS FIN HGT .45
Series: 630  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Not Included)  ·  Outline: 35.00mm x 35.00mm  ·  Height: 0.45" (11.43mm)  ·  Material: Aluminum  ·  Thermal Resistance @ Forced Air Flow: 4°C/W @ 400 LFM
from 1,26Additional information
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624-35ABT4Wakefield Thermal SolutionsHEATSINK CPU 25MM SQUARE W/TAPE
Series: 624  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 25.00mm x 25.00mm  ·  Height: 0.35" (9mm)  ·  Material: Aluminum
from 2,00Additional information
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658-60ABT1658-60ABT1Wakefield Thermal SolutionsHEATSINK CPU 28MM SQ BLK W/TAPE
Series: 658  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 27.94mm x 27.94mm  ·  Height: 0.6" (15.24mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2.5W @ 30°C  ·  Thermal Resistance @ Forced Air Flow: 3°C/W @ 300 LFM
from 1,36
from 3,27		Additional information
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634-20ABP634-20ABPWakefield Thermal SolutionsHEATSINK TO-220 VERT MT BLK 2.0
Series: 634  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 16.25mm x 16.25mm  ·  Height: 2" (50.8mm)  ·  Material: Aluminum
from 1,11
from 3,05		Additional information
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274-2AB274-2ABWakefield Thermal SolutionsHEATSINK LOW HEIGHT BLK TO-220
Series: 274  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On  ·  Outline: 19.05mm x 12.70mm  ·  Height: 0.5" (12.7mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 50°C  ·  Thermal Resistance @ Forced Air Flow: 7.0°C/W @ 400 LFM  ·  Thermal Resistance @ Natural: 25°C/W
from 0,13
from 0,35		Additional information
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5079-72Wakefield Thermal SolutionsHEAT SINK EXTRUSION 6 FOOTfrom 71,98Additional information
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