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374724B60024G — HEATSINK BGA W/O SOLDER ANCHORS

Manufacturer: Aavid Thermalloy  •  RoHS/pb-free: RoHS   Pb-free  •  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  •  Attachment Method: Solder Anchor  •  Outline: 35.00mm x 35.00mm  •  Height: 0.709" (18mm)  •  Material: Aluminum  •  Power Dissipation @ Temperature Rise: 3W @ 50°C  •  Thermal Resistance @ Forced Air Flow: 5.2°C/W @ 200 LFM  •  Thermal Resistance @ Natural: 15.3°C/W  •  Other PartNo: 374724B60024, HS326
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Suppliers of «374724B60024G»

SupplierPart NoManufacturerPriceStock
Aspect374724B60024G from 7 days
ООО "Интегральные схемы"374724B60024G from 7 days
BETTLINK ELECTRONIC LIMITED374724B60024G
AAVID THERMALLOY 374724B60024GHeat Sink, For Ball Grid Array, BGA, 15.3 C/W, 18 mm, 35 mm, 35 mm Подробнее
Aavid, Thermal Division of Boyd Corporation5.7314$1465


Company Information

CompanyOfficePhoneE-mailFeedback 
BETTLINK ELECTRONIC LIMITEDHong Kong(852) 8191 18020  0 Hide
AspectSt. Petersburg+7 (812) 309-89-320  0 Hide
ООО "Интегральные схемы"St. Petersburg+7 (812) 448-53-820  0 Hide
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