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2-1542006-2 — HEATSINK BGA 5 FIN RADIAL

Manufacturer: Tyco Electronics  •  RoHS/pb-free: RoHS   Pb-free  •  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  •  Attachment Method: Clip  •  Outline: 34.93mm Dia  •  Height: 0.678" (17.22mm)  •  Material: Aluminum  •  Thermal Resistance @ Forced Air Flow: 4.4°C/W @ 200 LFM  •  Thermal Resistance @ Natural: 9.9°C/W
Datasheet

  Sure Technology  


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