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335214B00032G — BGA HEAT SINK

Manufacturer: Aavid Thermalloy  •  RoHS/pb-free: RoHS   Pb-free  •  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  •  Attachment Method: Thermal Tape, Adhesive (Included)  •  Outline: 25.00mm x 25.00mm  •  Height: 0.39" (9.9mm)  •  Material: Aluminum  •  Other PartNo: 043314
Datasheet

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Suppliers of «335214B00032G»

SupplierPart NoManufacturerPriceStock
Kontest335214B00032G
BGA HEAT SINK Подробнее		Aavid Thermalloy
CHIP DIGGER LIMITEDFresh data!335214B00032G
BGA HEAT SINK		Aavid, Thermal Division of Boyd Corporation4.69$17303
"SINERGY-DISTRIBUTION" LLC335214B00032G
BGA HEAT SINK		Aavid, Thermal Division of Boyd Corporation
Aspect335214B00032G from 7 days
ООО "Интегральные схемы"335214B00032G from 7 days


Company Information

CompanyOfficePhoneE-mailFeedback 
CHIP DIGGER LIMITEDShenZhen(86) 134228976960  0 Hide
KontestMoscow+7 (495) 150-88-73, Fax: (495) 150-88-736  27 Hide
Voronez+7 (473) 239-22-32
AspectSt. Petersburg+7 (812) 309-89-320  0 Hide
ООО "Интегральные схемы"St. Petersburg+7 (812) 448-53-820  0 Hide
"SINERGY-DISTRIBUTION" LLCSt. Petersburg+7 (812) 409-49-130  1 Hide
Moscow+7 (499) 322-80-72
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