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016304-81 — ALUMINUM EXTRUSION FLATBACK

ManufacturerWakefield Thermal Solutions
Harmful substancesRoHS   Lead-free
Found under nameQ4125634A
Analogous by characteristics
PhotoNameManufacturerTechnical parametersPrices (rub.)Buy
677-10ABPWakefield Thermal SolutionsHEATSINK MULTIWATT 1.0" BLK
Series: 677  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 41.91mm x 25.40mm  ·  Height: 1" (25.4mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 6W @ 76°C  ·  Thermal Resistance @ Forced Air Flow: 5.8°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 8.7°C/W
from 1,43Additional information
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680-125A680-125AWakefield Thermal SolutionsHEATSINK POWER TO-3 BLK
Series: 680  ·  Package Cooled: TO-3  ·  Attachment Method: Bolt On  ·  Outline: 45.97mm x 45.97mm  ·  Height: 1.25" (31.75mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 8W @ 45°C  ·  Thermal Resistance @ Forced Air Flow: 1.5°C/W @ 400 LFM  ·  Thermal Resistance @ Natural: 6°C/W
from 5,18
from 12,42		Additional information
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287-1AB287-1ABWakefield Thermal SolutionsHEATSINK TO-220 VERT W/TABS BLK
Series: 287  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 25.40mm x 12.70mm  ·  Height: 1.18" (29.97mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 4W @ 65°C  ·  Thermal Resistance @ Forced Air Flow: 7.8°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 16.2°C/W
from 0,69
from 1,89		Additional information
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270-AB270-ABWakefield Thermal SolutionsHEATSINK TO-220 SM FOOTPRINT BLK
Series: 270  ·  Package Cooled: TO-220, TO-202  ·  Attachment Method: Bolt On  ·  Outline: 44.45mm x 17.78mm  ·  Height: 0.375" (9.53mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 4W @ 70°C  ·  Thermal Resistance @ Forced Air Flow: 6.0°C/W @ 400 LFM  ·  Thermal Resistance @ Natural: 17.5°C/W
from 0,18
from 0,49		Additional information
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658-35ABT4E658-35ABT4EWakefield Thermal SolutionsHEATSINK CPU 28MM SQ BLK W/TAPE
Series: 658  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 27.94mm x 27.94mm  ·  Height: 0.35" (9mm)  ·  Material: Aluminum  ·  Thermal Resistance @ Forced Air Flow: 8.0°C/W @ 200 LFM
from 1,39
from 3,33		Additional information
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233-60ABWakefield Thermal SolutionsHEATSINK TO-220 VERT/HORZ BLK
Series: 233  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On  ·  Outline: 14.48mm x 12.70mm  ·  Height: 0.600" (15.20mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 58°C  ·  Thermal Resistance @ Forced Air Flow: 11.0°C/W @ 400 LFM  ·  Thermal Resistance @ Natural: 29°C/W
from 0,22Additional information
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230-75AB230-75ABWakefield Thermal SolutionsHEATSINK TO-220 VERT/HORZ BLK
Series: 230  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On  ·  Outline: 14.48mm x 12.70mm  ·  Height: 0.75" (19.05mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 57°C  ·  Thermal Resistance @ Forced Air Flow: 7.5°C/W @ 400 LFM  ·  Thermal Resistance @ Natural: 28.5°C/W
from 0,20
from 0,56		Additional information
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637-20ABP637-20ABPWakefield Thermal SolutionsHEATSINK TO-220 VERT MT BLK 2
Series: 637  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 34.92mm x 12.70mm  ·  Height: 2" (50.8mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 6W @ 55°C  ·  Thermal Resistance @ Forced Air Flow: 4.7°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 9.2°C/W
from 1,03
from 2,84		Additional information
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642-45AB642-45ABWakefield Thermal SolutionsHEATSINK CPU 35MM SQ H=.45" BLK
Series: 642  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Not Included)  ·  Outline: 35.00mm x 35.00mm  ·  Height: 0.45" (11.43mm)  ·  Material: Aluminum
from 0,83
from 2,28		Additional information
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657-20ABPE657-20ABPEWakefield Thermal SolutionsHEATSINK TO-220 W/PINS BLK 2
Series: 657  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 41.91mm x 25.40mm  ·  Height: 2" (50.8mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 6W @ 32°C  ·  Thermal Resistance @ Forced Air Flow: 2.9°C/W @ 200 LFM
from 1,19Additional information
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528-45AB-MS4528-45AB-MS4Wakefield Thermal SolutionsHEATSINK BXB50,75,100,150.45"VRT
Series: 528  ·  Package Cooled: Half Brick DC/DC Converter  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 61.00mm x 57.90mm  ·  Height: 0.45" (11.43mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 7W @ 60°C  ·  Thermal Resistance @ Forced Air Flow: 3.2°C/W @ 300 LFM
from 6,94Additional information
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260-6SH5EWakefield Thermal SolutionsHEAT SINK FOR TO-5 PKG
Series: 260  ·  Package Cooled: TO-5  ·  Attachment Method: Bolt On  ·  Outline: 9.40mm x 9.40mm  ·  Height: 0.550" (14.00mm)  ·  Material: Beryllium Copper
from 13,04Additional information
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235-85AB235-85ABWakefield Thermal SolutionsHEATSINK TO-220 CLIP-ON BLK
Series: 235  ·  Package Cooled: TO-220  ·  Attachment Method: Clip  ·  Outline: 25.40mm x 12.70mm  ·  Height: 0.85" (21.59mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 40°C  ·  Thermal Resistance @ Forced Air Flow: 6.8°C/W @ 400 LFM  ·  Thermal Resistance @ Natural: 20°C/W
from 0,24
from 0,67		Additional information
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206-1PABH206-1PABHWakefield Thermal SolutionsHEATSINK VERT ALUM BLK TO-220
Series: 206  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 25.40mm x 12.70mm  ·  Height: 1.18" (29.97mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 4W @ 56°C  ·  Thermal Resistance @ Natural: 14°C/W
from 0,23
from 0,63		Additional information
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XX7116Wakefield Thermal SolutionsHEATSINK EXTRUSION 6'from 426,93Additional information
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647-15ABP647-15ABPWakefield Thermal SolutionsHEATSINK TO-220 W/PINS BLK 1.5
Series: 647  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 41.91mm x 25.40mm  ·  Height: 1.5" (38.1mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 6W @ 37°C  ·  Thermal Resistance @ Forced Air Flow: 3.5°C/W @ 200 LFM
from 1,08
from 2,98		Additional information
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537-95ABWakefield Thermal SolutionsHEATSINK DC DC 1/4 BRICK VERT
Series: 537  ·  Attachment Method: Bolt On  ·  Outline: 57.91mm x 36.83mm  ·  Height: 0.95" (24.13mm)  ·  Material: Aluminum  ·  Thermal Resistance @ Forced Air Flow: 2.1°C/W @ 300 LFM
from 3,64Additional information
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658-45ABT2Wakefield Thermal SolutionsHEATSINK CPU 28MM SQ BLK W/TAPE
Series: 658  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 27.94mm x 27.94mm  ·  Height: 0.45" (11.43mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 3W @ 50°C  ·  Thermal Resistance @ Forced Air Flow: 6.0°C/W @ 200 LFM
Additional information
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287-1ABH287-1ABHWakefield Thermal SolutionsHEATSINK VERT MT HOLE BLK TO-220
Series: 287  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 25.40mm x 12.70mm  ·  Height: 1.18" (29.97mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 4W @ 65°C  ·  Thermal Resistance @ Forced Air Flow: 7.8°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 16.2°C/W
from 0,69Additional information
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658-35ABT3658-35ABT3Wakefield Thermal SolutionsHEATSINK CPU 28MM SQ BLK W/TAPE
Series: 658  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 27.94mm x 27.94mm  ·  Height: 0.35" (9mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 50°C
from 1,36
from 3,27		Additional information
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630-45ABWakefield Thermal SolutionsHEATSINK FOR BGAS FIN HGT .45
Series: 630  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Not Included)  ·  Outline: 35.00mm x 35.00mm  ·  Height: 0.45" (11.43mm)  ·  Material: Aluminum  ·  Thermal Resistance @ Forced Air Flow: 4°C/W @ 400 LFM
from 1,26Additional information
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291-H36AB291-H36ABWakefield Thermal SolutionsHEATSINK TO-220 CLIP-ON BLK
Series: 291  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On  ·  Outline: 27.94mm x 9.14mm  ·  Height: 0.86" (21.84mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 68°C  ·  Thermal Resistance @ Forced Air Flow: 16.0°C/W @ 600 LFM  ·  Thermal Resistance @ Natural: 34°C/W
from 0,32
from 0,88		Additional information
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624-45ABWakefield Thermal SolutionsHEATSINK CPU 21MM SQ W/OUT ADH
Series: 624  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Not Included)  ·  Outline: 21.00mm x 21.00mm  ·  Height: 0.45" (11.43mm)  ·  Material: Aluminum
from 1,20Additional information
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265-118ABH-22Wakefield Thermal SolutionsHEATSINK VERT ALUM BLACK TO-220
Series: 265  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 25.40mm x 12.70mm  ·  Height: 1.18" (29.97mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 4W @ 56°C  ·  Thermal Resistance @ Forced Air Flow: 7.0°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 14°C/W
from 0,23Additional information
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624-35ABT4Wakefield Thermal SolutionsHEATSINK CPU 25MM SQUARE W/TAPE
Series: 624  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 25.00mm x 25.00mm  ·  Height: 0.35" (9mm)  ·  Material: Aluminum
from 2,00Additional information
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