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Fans, Thermal Management  ·  Heat Sinks
 

XX7116 — HEATSINK EXTRUSION 6'

ManufacturerWakefield Thermal Solutions
Harmful substancesRoHS   Lead-free
Found under nameQ3436668
Analogous by characteristics
PhotoNameManufacturerTechnical parametersPrices (rub.)Buy
634-10ABP634-10ABPWakefield Thermal SolutionsHEATSINK TO-220 VERT MT BLK 1
Series: 634  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 16.25mm x 16.25mm  ·  Height: 1" (25.4mm)  ·  Material: Aluminum
from 0,98
from 2,70		Additional information
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243-3PAB243-3PABWakefield Thermal SolutionsHEATSINK TO-220 CLIP-ON BLK
Series: 243  ·  Package Cooled: TO-220  ·  Attachment Method: Clip  ·  Outline: 20.32mm x 6.86mm  ·  Height: 0.8" (20.32mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 78°C  ·  Thermal Resistance @ Forced Air Flow: 8.2°C/W @ 400 LFM  ·  Thermal Resistance @ Natural: 39°C/W
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476W476WWakefield Thermal SolutionsHEATSINK NATURAL CONVECTIONC2025
Series: 476  ·  Attachment Method: Bolt On  ·  Outline: 152.40mm x 127.00mm  ·  Height: 5" (127 mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 50W @ 25°C  ·  Thermal Resistance @ Forced Air Flow: 0.2°C/W @ 500 LFM  ·  Thermal Resistance @ Natural: 0.50°C/W
from 62,25Additional information
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233-60AB-10Wakefield Thermal SolutionsHEATSINK TO-220 VERT BLK W/TABS
Series: 233  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On  ·  Outline: 14.48mm x 12.70mm  ·  Height: 0.725" (18.415mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 58°C  ·  Thermal Resistance @ Forced Air Flow: 11.0°C/W @ 400 LFM  ·  Thermal Resistance @ Natural: 29°C/W
from 0,33Additional information
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657-15ABPN657-15ABPNWakefield Thermal SolutionsHEATSINK TO-220 W/PINS BLK 1.5
Series: 657  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 41.91mm x 25.40mm  ·  Height: 1.5" (38.1mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 6W @ 38°C  ·  Thermal Resistance @ Forced Air Flow: 3.3°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 6.3°C/W
from 0,89
from 2,45		Additional information
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423K423KWakefield Thermal SolutionsHEATSINK POWER NO MNT HOLES BLK
Series: 423  ·  Package Cooled: TO-3  ·  Attachment Method: Press Fit  ·  Outline: 139.70mm x 120.65mm  ·  Height: 2.62" (66.55mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 50W @ 47°C  ·  Thermal Resistance @ Forced Air Flow: 0.5°C/W @ 250 LFM  ·  Thermal Resistance @ Natural: 0.96°C/W
from 9,66
from 19,33		Additional information
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658-60ABT4658-60ABT4Wakefield Thermal SolutionsHEATSINK CPU 27.9MM SQ W/ADH BLK
Series: 658  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 27.94mm x 27.94mm  ·  Height: 0.6" (15.24mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2.5W @ 30°C  ·  Thermal Resistance @ Forced Air Flow: 3°C/W @ 300 LFM
from 1,50
from 3,60		Additional information
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518-95AB518-95ABWakefield Thermal SolutionsHEATSINK DC/DC HALF BRICK VERT
Series: 518  ·  Package Cooled: Half Brick DC/DC Converter  ·  Attachment Method: Bolt On  ·  Outline: 61.00mm x 57.90mm  ·  Height: 0.95" (24.13mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 11W @ 60°C  ·  Thermal Resistance @ Forced Air Flow: 2.0°C/W @ 300 LFM
from 1,65
from 3,96		Additional information
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D10850-40D10850-40Wakefield Thermal SolutionsHEATSINK 128PQFP COMPOSITE
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Not Included)  ·  Outline: 21.60mm x 21.60mm  ·  Height: 0.4" (10.16mm)  ·  Material: Composite  ·  Power Dissipation @ Temperature Rise: 2W @ 80°C  ·  Thermal Resistance @ Forced Air Flow: 10°C/W @ 500 LFM
from 0,92
from 2,52		Additional information
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667-10ABPP667-10ABPPWakefield Thermal SolutionsHEATSINK TO-220 W/PINS
Series: 667  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 34.92mm x 12.70mm  ·  Height: 1" (25.4mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 6W @ 76°C  ·  Thermal Resistance @ Forced Air Flow: 5.8°C/W @ 200 LFM
from 1,15
from 3,15		Additional information
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647-10ABP647-10ABPWakefield Thermal SolutionsHEATSINK TO-220 W/PINS BLK 1
Series: 647  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 41.91mm x 25.40mm  ·  Height: 1" (25.4mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 6W @ 42°C  ·  Thermal Resistance @ Forced Air Flow: 3.8°C/W @ 200 LFM
from 0,98
from 2,70		Additional information
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401A401AWakefield Thermal SolutionsHEATSINK POWER TO-3 BLK
Series: 401  ·  Package Cooled: TO-3  ·  Attachment Method: Bolt On  ·  Outline: 120.65mm x 38.10mm  ·  Height: 1.25" (31.75mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 30W @ 80°C  ·  Thermal Resistance @ Forced Air Flow: 1.5°C/W @ 250 LFM  ·  Thermal Resistance @ Natural: 2.6°C/W
from 5,31
from 12,75		Additional information
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667-10ABSPWakefield Thermal SolutionsHEATSINK TO-220 W/S/O PINS BLK
Series: 667  ·  Package Cooled: TO-220  ·  Attachment Method: Clip and PC Pin  ·  Outline: 34.92mm x 12.70mm  ·  Height: 1" (25.4mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 6W @ 76°C  ·  Thermal Resistance @ Forced Air Flow: 5.8°C/W @ 200 LFM
from 1,90Additional information
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287-1AB287-1ABWakefield Thermal SolutionsHEATSINK TO-220 VERT W/TABS BLK
Series: 287  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 25.40mm x 12.70mm  ·  Height: 1.18" (29.97mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 4W @ 65°C  ·  Thermal Resistance @ Forced Air Flow: 7.8°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 16.2°C/W
from 0,69
from 1,89		Additional information
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677-10ABPWakefield Thermal SolutionsHEATSINK MULTIWATT 1.0" BLK
Series: 677  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 41.91mm x 25.40mm  ·  Height: 1" (25.4mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 6W @ 76°C  ·  Thermal Resistance @ Forced Air Flow: 5.8°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 8.7°C/W
from 1,43Additional information
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680-125A680-125AWakefield Thermal SolutionsHEATSINK POWER TO-3 BLK
Series: 680  ·  Package Cooled: TO-3  ·  Attachment Method: Bolt On  ·  Outline: 45.97mm x 45.97mm  ·  Height: 1.25" (31.75mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 8W @ 45°C  ·  Thermal Resistance @ Forced Air Flow: 1.5°C/W @ 400 LFM  ·  Thermal Resistance @ Natural: 6°C/W
from 5,18
from 12,42		Additional information
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637-20ABP637-20ABPWakefield Thermal SolutionsHEATSINK TO-220 VERT MT BLK 2
Series: 637  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 34.92mm x 12.70mm  ·  Height: 2" (50.8mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 6W @ 55°C  ·  Thermal Resistance @ Forced Air Flow: 4.7°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 9.2°C/W
from 1,03
from 2,84		Additional information
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270-AB270-ABWakefield Thermal SolutionsHEATSINK TO-220 SM FOOTPRINT BLK
Series: 270  ·  Package Cooled: TO-220, TO-202  ·  Attachment Method: Bolt On  ·  Outline: 44.45mm x 17.78mm  ·  Height: 0.375" (9.53mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 4W @ 70°C  ·  Thermal Resistance @ Forced Air Flow: 6.0°C/W @ 400 LFM  ·  Thermal Resistance @ Natural: 17.5°C/W
from 0,18
from 0,49		Additional information
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230-75AB230-75ABWakefield Thermal SolutionsHEATSINK TO-220 VERT/HORZ BLK
Series: 230  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On  ·  Outline: 14.48mm x 12.70mm  ·  Height: 0.75" (19.05mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 57°C  ·  Thermal Resistance @ Forced Air Flow: 7.5°C/W @ 400 LFM  ·  Thermal Resistance @ Natural: 28.5°C/W
from 0,20
from 0,56		Additional information
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233-60ABWakefield Thermal SolutionsHEATSINK TO-220 VERT/HORZ BLK
Series: 233  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On  ·  Outline: 14.48mm x 12.70mm  ·  Height: 0.600" (15.20mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 58°C  ·  Thermal Resistance @ Forced Air Flow: 11.0°C/W @ 400 LFM  ·  Thermal Resistance @ Natural: 29°C/W
from 0,22Additional information
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658-35ABT4E658-35ABT4EWakefield Thermal SolutionsHEATSINK CPU 28MM SQ BLK W/TAPE
Series: 658  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 27.94mm x 27.94mm  ·  Height: 0.35" (9mm)  ·  Material: Aluminum  ·  Thermal Resistance @ Forced Air Flow: 8.0°C/W @ 200 LFM
from 1,39
from 3,33		Additional information
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657-20ABPE657-20ABPEWakefield Thermal SolutionsHEATSINK TO-220 W/PINS BLK 2
Series: 657  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 41.91mm x 25.40mm  ·  Height: 2" (50.8mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 6W @ 32°C  ·  Thermal Resistance @ Forced Air Flow: 2.9°C/W @ 200 LFM
from 1,19Additional information
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528-45AB-MS4528-45AB-MS4Wakefield Thermal SolutionsHEATSINK BXB50,75,100,150.45"VRT
Series: 528  ·  Package Cooled: Half Brick DC/DC Converter  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 61.00mm x 57.90mm  ·  Height: 0.45" (11.43mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 7W @ 60°C  ·  Thermal Resistance @ Forced Air Flow: 3.2°C/W @ 300 LFM
from 6,94Additional information
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642-45AB642-45ABWakefield Thermal SolutionsHEATSINK CPU 35MM SQ H=.45" BLK
Series: 642  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Not Included)  ·  Outline: 35.00mm x 35.00mm  ·  Height: 0.45" (11.43mm)  ·  Material: Aluminum
from 0,83
from 2,28		Additional information
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260-6SH5EWakefield Thermal SolutionsHEAT SINK FOR TO-5 PKG
Series: 260  ·  Package Cooled: TO-5  ·  Attachment Method: Bolt On  ·  Outline: 9.40mm x 9.40mm  ·  Height: 0.550" (14.00mm)  ·  Material: Beryllium Copper
from 13,04Additional information
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