Äîêóìåíòàöèÿ è îïèñàíèÿ www.docs.chipfind.ru

General description

The GTL2014 is a 4-bit translating transceiver designed for 3.3 V LVTTL system interface
with a GTL

/GTL/GTL+ bus.

The direction pin allows the part to function as either a GTL to LVTTL sampling receiver or
as a LVTTL to GTL interface.

The GTL2014 LVTTL inputs (only) are tolerant up to 5.5 V allowing direct access to TTL or
5 V CMOS inputs. The LVTTL outputs are not 5.5 V tolerant.

The GTL2014 GTL inputs and outputs operate up to 3.6 V, allowing the device to be used
in higher voltage open-drain output applications.

Features

Operates as a 4-bit GTL

/GTL/GTL+ sampling receiver or as a LVTTL to

GTL

/GTL/GTL+ driver

3.0 V to 3.6 V operation with 5 V tolerant LVTTL input

GTL input and output 3.6 V tolerant

ref

adjustable from 0.5 V to V

Partial power-down permitted

ESD protection exceeds 2000 V HBM per JESD22-A114, 200 V MM per
JESD22-A115, and 1000 V CDM per JESD22-CC101

Latch-up protection exceeds 500 mA per JESD78

Package offered: TSSOP14

Quick reference data

GTL2014

4-bit LVTTL to GTL transceiver

Rev. 01 -- 19 May 2005

Product data sheet

Table 1:

Quick reference data

amb

= 25

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

PLH

propagation delay; An-to-Bn

= 50 pF; V

= 3.3 V

2.8

PHL

3.4

PLH

propagation delay; Bn-to-An

= 50 pF; V

= 3.3 V

5.2

PHL

4.9

input capacitance on pin DIR;
A-to-B or B-to-A

= 0 V or V

2.5

input/output capacitance; A-to-B

outputs disabled;
V

and V

= 0 V or 3.0 V

4.6

6.0

input/output capacitance; B-to-A

3.4

4.3

9397 750 13534

Product data sheet

Rev. 01 -- 19 May 2005

2 of 15

Philips Semiconductors

GTL2014

4-bit LVTTL to GTL transceiver

Ordering information

Standard packing quantities and other packaging data are available at
www.standardics.philips.com/packaging.

4.1 Ordering options

Functional diagram

Table 2:

Ordering information

Type number

Package

Name

Description

Version

GTL2014PW

TSSOP14

plastic thin shrink small outline package; 14 leads;
body width 4.4 mm

SOT402-1

Table 3:

Ordering options

Type number

Topside mark

Temperature range

GTL2014PW

GTL2014

amb

C to +85

Fig 1.

Logic diagram for GTL2014

002aab139

GTL2014

VREF

DIR

9397 750 13534

Product data sheet

Rev. 01 -- 19 May 2005

3 of 15

Philips Semiconductors

GTL2014

4-bit LVTTL to GTL transceiver

Pinning information

6.1 Pinning

6.2 Pin description

Functional description

Refer to

Figure 1 "Logic diagram for GTL2014" on page 2

7.1 Function table

Fig 2.

Pin configuration for TSSOP14

GTL2014PW

DIR

VREF

GND

002aab138

Table 4:

Pin description

Symbol

Pin

Description

DIR

direction control input (LVTTL)

data inputs/outputs (GTL)

data inputs/outputs (LVTTL)

VREF

GTL reference voltage

GND

7, 8, 11

ground (0 V)

positive supply voltage

Table 5:

Function table

H = HIGH voltage level; L = LOW voltage level.

Input

Input/output

DIR

A (LVTTL)

B (GTL)

input

Bn = An

An = Bn

input

9397 750 13534

Product data sheet

Rev. 01 -- 19 May 2005

4 of 15

Philips Semiconductors

GTL2014

4-bit LVTTL to GTL transceiver

Limiting values

[1]

Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only
and functional operation of the device at these or any other conditions beyond those indicated under

Section 9 "Recommended operating conditions"

is not implied. Exposure to absolute-maximum-rated

conditions for extended periods may affect device reliability.

[2]

The input and output negative voltage ratings may be exceeded if the input and output clamp current ratings
are observed.

[3]

The performance capability of a high-performance integrated circuit in conjunction with its thermal
environment can create junction temperatures which are detrimental to reliability. The maximum junction
temperature of this integrated circuit should not exceed 150

Table 6:

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

[1]

Voltages are referenced to GND (ground = 0 V).

Symbol

Parameter

Conditions

Min

Max

Unit

DC supply voltage

0.5

+4.6

input clamping diode current

< 0 V

DC input voltage

A port

0.5

[2]

+7.0

B port

0.5

[2]

+4.6

output diode clamping current

A port; V

< 0 V

DC output voltage

output in OFF or
HIGH state; A port

0.5

[2]

+7.0

output in OFF or
HIGH state; B port

0.5

[2]

+4.6

current into any output in
the LOW state

A port

B port

current into any output in
the HIGH state

A port

stg

storage temperature range

[3]

+150

9397 750 13534

Product data sheet

Rev. 01 -- 19 May 2005

5 of 15

Philips Semiconductors

GTL2014

4-bit LVTTL to GTL transceiver

Recommended operating conditions

[1]

Unused inputs must be held HIGH or LOW to prevent them from floating.

[2]

maximum of 3.6 V with resistor sized so I

maximum is not exceeded.

[3]

A0, A1, A2, A3 V

I(max)

is 3.6 V if configured as outputs (DIR = L).

Table 7:

Operating conditions

[1]

Symbol Parameter

Conditions

Min

Typ

Max

Unit

supply voltage

3.0

3.6

termination
voltage

[2]

GTL

0.85

0.9

0.95

GTL

1.14

1.2

1.26

GTL+

1.35

1.5

1.65

ref

reference voltage

overall

0.5

GTL

0.5

0.6

0.63

GTL

0.76

0.8

0.84

GTL+

0.87

1.0

1.10

input voltage

B port

3.6

except B port

3.3

5.5

[3]

HIGH-level input
voltage

B port

ref

+ 0.050

except B port

LOW-level input
voltage

B port

ref

0.050

except B port

0.8

HIGH-level output
current

A port

LOW-level output
current

B port

A port

amb

operating ambient
temperature

in free-air

+85

9397 750 13534

Product data sheet

Rev. 01 -- 19 May 2005

6 of 15

Philips Semiconductors

GTL2014

4-bit LVTTL to GTL transceiver

10. Static characteristics

[1]

All typical values are measured at V

= 3.3 V and T

amb

= 25

[2]

The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

[3]

This is the increase in supply current for each input that is at the specified TTL voltage level rather than V

or GND.

Table 8:

Static characteristics

Recommended operating conditions; voltages are referenced to GND (ground = 0 V). T

amb

C to +85

Symbol

Parameter

Conditions

Min

Typ

[1]

Max

Unit

HIGH-level output
voltage

A port; V

= 3.0 V to 3.6 V; I

100

[2]

0.2

A port; V

= 3.0 V; I

16 mA

[2]

2.0

LOW-level output
voltage

B port; V

= 3.0 V; I

= 40 mA

[2]

0.23

0.4

A port; V

= 3.0 V; I

= 8 mA

[2]

0.28

0.4

A port; V

= 3.0 V; I

= 12 mA

[2]

0.40

0.55

A port; V

= 3.0 V; I

= 16 mA

[2]

0.55

0.8

input current

control inputs; V

= 3.6 V;

= V

or GND

B port; V

= 3.6 V; V

= V

or GND

A port; V

= 0 V or 3.6 V; V

= 5.5 V

A port; V

= 3.6 V; V

= V

A port; V

= 3.6 V; V

= 0 V

off-state output
current

A port; V

= 0 V; V

or V

= 0 V to 3.6 V

100

quiescent supply
current

A port; V

= 3.6 V; V

= V

or GND;

= 0 mA

B port; V

= 3.6 V; V

= V

or GND;

= 0 mA

[3]

additional quiescent
current (per input)

A port or control inputs; V

= 3.6 V;

= V

0.6 V

500

input capacitance

control inputs; V

= 3.0 V or 0 V

2.5

input/output
capacitance

A port; V

= 3.0 V or 0 V

4.6

B port; V

= V

or 0 V

3.4

4.3

9397 750 13534

Product data sheet

Rev. 01 -- 19 May 2005

7 of 15

Philips Semiconductors

GTL2014

4-bit LVTTL to GTL transceiver

11. Dynamic characteristics

[1]

All typical values are at V

= 3.3 V and T

amb

= 25

Table 9:

Dynamic characteristics

= 3.3 V

0.3 V

Symbol

Parameter

Conditions

Min

Typ

[1]

Max

Unit

GTL

; V

ref

= 0.6 V; V

= 0.9 V

PLH

propagation delay, An to Bn

see

Figure 3

2.8

PHL

3.3

PLH

propagation delay, Bn to An

see

Figure 4

5.3

PHL

5.2

GTL; V

ref

= 0.8 V; V

= 1.2 V

PLH

propagation delay, An to Bn

see

Figure 3

2.8

PHL

3.4

PLH

propagation delay, Bn to An

see

Figure 4

5.2

PHL

4.9

GTL+; V

ref

= 1.0 V; V

= 1.5 V

PLH

propagation delay, An to Bn

see

Figure 3

2.8

PHL

3.4

PLH

propagation delay, Bn to An

see

Figure 4

5.1

PHL

4.7

9397 750 13534

Product data sheet

Rev. 01 -- 19 May 2005

8 of 15

Philips Semiconductors

GTL2014

4-bit LVTTL to GTL transceiver

11.1 Waveforms

= 1.5 V at V

3.0 V; V

= V

/2 at V

2.7 V for A ports and control pins;

= V

ref

for B ports.

= 1.5 V for A port and V

ref

for

B port

B port to A port

a. Pulse duration

b. Propagation delay times

Fig 3.

Voltage waveforms

PRR

10 MHz; Z

= 50

; t

2.5 ns; t

2.5 ns

Fig 4.

Propagation delay, Bn to An

002aab140

3.0 V

0 V

pulse

002aab141

3.0 V

0 V

PLH

PHL

ref

1.5 V

input

output

002aab142

PLH

PHL

1.5 V

ref

input

output

9397 750 13534

Product data sheet

Rev. 01 -- 19 May 2005

10 of 15

Philips Semiconductors

GTL2014

4-bit LVTTL to GTL transceiver

13. Package outline

Fig 7.

Package outline SOT402-1 (TSSOP14)

UNIT

(1)

(2)

(1)

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

0.15
0.05

0.95
0.80

0.30
0.19

0.2
0.1

5.1
4.9

4.5
4.3

0.65

6.6
6.2

0.4
0.3

0.72
0.38

8
0

0.13

0.1

0.2

DIMENSIONS (mm are the original dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

0.75
0.50

SOT402-1

MO-153

99-12-27
03-02-18

0.25

detail X

(A )

2.5

5 mm

scale

TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm

SOT402-1

max.

1.1

pin 1 index

9397 750 13534

Product data sheet

Rev. 01 -- 19 May 2005

11 of 15

Philips Semiconductors

GTL2014

4-bit LVTTL to GTL transceiver

14. Soldering

14.1 Introduction to soldering surface mount packages

This text gives a very brief insight to a complex technology. A more in-depth account of
soldering ICs can be found in our

Data Handbook IC26; Integrated Circuit Packages

(document order number 9398 652 90011).

There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is recommended.

14.2 Reflow soldering

Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.

Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)
vary between 100 seconds and 200 seconds depending on heating method.

Typical reflow peak temperatures range from 215

C to 270

C depending on solder paste

material. The top-surface temperature of the packages should preferably be kept:

below 225

C (SnPb process) or below 245

C (Pb-free process)

for all BGA, HTSSON..T and SSOP..T packages

for packages with a thickness

2.5 mm

for packages with a thickness < 2.5 mm and a volume

350 mm

so called

thick/large packages.

below 240

C (SnPb process) or below 260

C (Pb-free process) for packages with a

thickness < 2.5 mm and a volume < 350 mm

so called small/thin packages.

Moisture sensitivity precautions, as indicated on packing, must be respected at all times.

14.3 Wave soldering

Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging and
non-wetting can present major problems.

To overcome these problems the double-wave soldering method was specifically
developed.

If wave soldering is used the following conditions must be observed for optimal results:

Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.

For packages with leads on two sides and a pitch (e):

larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be

parallel to the transport direction of the printed-circuit board;

9397 750 13534

Product data sheet

Rev. 01 -- 19 May 2005

12 of 15

Philips Semiconductors

GTL2014

4-bit LVTTL to GTL transceiver

smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the

transport direction of the printed-circuit board.

The footprint must incorporate solder thieves at the downstream end.

For packages with leads on four sides, the footprint must be placed at a 45

angle to

the transport direction of the printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.

During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.

Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250

or 265

C, depending on solder material applied, SnPb or Pb-free respectively.

A mildly-activated flux will eliminate the need for removal of corrosive residues in most
applications.

14.4 Manual soldering

Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage
(24 V or less) soldering iron applied to the flat part of the lead. Contact time must be
limited to 10 seconds at up to 300

When using a dedicated tool, all other leads can be soldered in one operation within
2 seconds to 5 seconds between 270

C and 320

14.5 Package related soldering information

[1]

For more detailed information on the BGA packages refer to the

(LF)BGA Application Note (AN01026);

order a copy from your Philips Semiconductors sales office.

[2]

All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal or
external package cracks may occur due to vaporization of the moisture in them (the so called popcorn
effect). For details, refer to the Drypack information in the

Data Handbook IC26; Integrated Circuit

Packages; Section: Packing Methods.

[3]

These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no
account be processed through more than one soldering cycle or subjected to infrared reflow soldering with
peak temperature exceeding 217

C measured in the atmosphere of the reflow oven. The package

body peak temperature must be kept as low as possible.

Table 10:

Suitability of surface mount IC packages for wave and reflow soldering methods

Package

[1]

Soldering method

Wave

Reflow

[2]

BGA, HTSSON..T

[3]

, LBGA, LFBGA, SQFP,

SSOP..T

[3]

, TFBGA, VFBGA, XSON

not suitable

suitable

DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP,
HSQFP, HSSON, HTQFP, HTSSOP, HVQFN,
HVSON, SMS

not suitable

[4]

suitable

PLCC

[5]

, SO, SOJ

suitable

LQFP, QFP, TQFP

not recommended

[5] [6]

suitable

SSOP, TSSOP, VSO, VSSOP

not recommended

[7]

suitable

CWQCCN..L

[8]

, PMFP

[9]

, WQCCN..L

[8]

not suitable

9397 750 13534

Product data sheet

Rev. 01 -- 19 May 2005

13 of 15

Philips Semiconductors

GTL2014

4-bit LVTTL to GTL transceiver

[4]

These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.

[5]

If wave soldering is considered, then the package must be placed at a 45

angle to the solder wave

direction. The package footprint must incorporate solder thieves downstream and at the side corners.

[6]

Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

[7]

Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

[8]

Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.

[9]

Hot bar soldering or manual soldering is suitable for PMFP packages.

15. Abbreviations

16. Revision history

Table 11:

Abbreviations

Acronym

Description

CDM

Charged Device Model

CMOS

Complementary Metal Oxide Silicon

ESD

ElectroStatic Discharge

GTL

Gunning Transceiver Logic

HBM

Human Body Model

LVTTL

Low Voltage Transistor-Transistor Logic

Machine Model

PRR

Pulse Rate Repetition

TTL

Transistor-Transistor Logic

Table 12:

Revision history

Document ID

Release date

Data sheet status

Change notice

Doc. number

Supersedes

GTL2014_1

20050519

Product data sheet

9397 750 13534

Philips Semiconductors

GTL2014

4-bit LVTTL to GTL transceiver

9397 750 13534

Product data sheet

Rev. 01 -- 19 May 2005

14 of 15

17. Data sheet status

[1]

Please consult the most recently issued data sheet before initiating or completing a design.

[2]

The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.

[3]

For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.

18. Definitions

Short-form specification -- The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.

Limiting values definition -- Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.

Application information -- Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.

19. Disclaimers

Life support -- These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors

customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.

Right to make changes -- Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status `Production'),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.

20. Trademarks

Notice -- All referenced brands, product names, service names and
trademarks are the property of their respective owners.

21. Contact information

For additional information, please visit: http://www.semiconductors.philips.com

For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com

Level

Data sheet status

[1]

Product status

[2] [3]

Definition

Objective data

Development

This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.

Preliminary data

Qualification

This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.

III

Product data

Production

This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).

All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.

Date of release: 19 May 2005

Document number: 9397 750 13534

Published in The Netherlands

Philips Semiconductors

GTL2014

4-bit LVTTL to GTL transceiver

22. Contents

General description . . . . . . . . . . . . . . . . . . . . . . 1

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Quick reference data . . . . . . . . . . . . . . . . . . . . . 1

Ordering information . . . . . . . . . . . . . . . . . . . . . 2

4.1

Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2

Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2

Pinning information . . . . . . . . . . . . . . . . . . . . . . 3

6.1

Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

6.2

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3

Functional description . . . . . . . . . . . . . . . . . . . 3

7.1

Function table . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4

Recommended operating conditions. . . . . . . . 5

Static characteristics. . . . . . . . . . . . . . . . . . . . . 6

Dynamic characteristics . . . . . . . . . . . . . . . . . . 7

11.1

Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Test information . . . . . . . . . . . . . . . . . . . . . . . . . 9

Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10

Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

14.1

Introduction to soldering surface mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

14.2

Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 11

14.3

Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 11

14.4

Manual soldering . . . . . . . . . . . . . . . . . . . . . . 12

14.5

Package related soldering information . . . . . . 12

Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Revision history . . . . . . . . . . . . . . . . . . . . . . . . 13

Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 14

Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Contact information . . . . . . . . . . . . . . . . . . . . 14

Part Number GTL2014

Document Outline