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Part Number DS92CK16

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DS92CK16
3V BLVDS 1 to 6 Clock Buffer/Bus Transceiver
General Description
The DS92CK16 1 to 6 Clock Buffer/Bus Transceiver is a one
to six CMOS differential clock distribution device utilizing Bus
Low Voltage Differential Signaling (BLVDS) technology. This
clock distribution device is designed for applications requir-
ing ultra low power dissipation, low noise, and high data
rates. The BLVDS side is a transceiver with a separate chan-
nel acting as a return/source clock.
The DS92CK16 accepts BLVDS (300 mV typical) differential
input levels, and translates them to 3V CMOS output levels.
An output enable pin OE , when high, forces all CLK
OUT
pins
high.
The device can be used a source synchronous driver. The
selection of the source driving is controlled by the CrdCLK
IN
and DE pins. This device can be the master clock, driving the
inputs of other clock I/O pins in a multipoint environment.
Easy master/slave clock selection is achieved along a back-
plane.
Features
n
Master/Slave clock selection in a backplane application
n
125 MHz operation (typical)
n
100 ps duty cycle distortion (typical)
n
50 ps channel to channel skew (typical)
n
3.3V power supply design
n
Glitch-free power on at CLKI/O pins
n
Low Power design (20 mA
@
3.3V static)
n
Accepts small swing (300 mV typical) differential signal
levels
n
Industrial temperature operating range (-40°C to +85°C)
n
Available in 24-pin TSSOP Packaging
Function Diagram and Truth Table
Receive Mode Truth Table
INPUT
OUTPUT
OE
DE
CrdCLK
IN
(CLKI/O+)­(CLKI/O-)
CLK
OUT
H
H
X
X
H
L
H
X
VID
0.07V
H
L
H
X
VID
-0.07V
L
L = Low Logic State
H = High Logic State
X = Irrelevant
Z = TRI-STATE
Driver Mode Truth Table
INPUT
OUTPUT
OE
DE
CrdCLK
IN
CLK/I/O+
CLKI/O-
CLK
OUT
L
L
L
L
H
L
L
L
H
H
L
H
H
L
L
L
H
H
H
L
H
H
L
H
H
H
X
Z
Z
H
TRI-STATE
®
is a registered trademark of National Semiconductor Corporation.
DS101082-1
November 1999
DS92CK16
3V
BL
VDS
1
t
o
6
Clock
Buffer/Bus
T
ransceiver
© 1999 National Semiconductor Corporation
DS101082
www.national.com
Connection Diagram
TSSOP Package Pin Description
Pin Name
Pin #
Type
Description
CLKI/O+
6
I/O
True (Positive) side of the differential clock input.
CLKI/O-
7
I/O
Complementary (Negative) side of the differential clock input.
OE
2
I
OE; this pin is active Low. When High, this pin forces all CLK
OUT
pins High. When Low, CLK
OUT
pins logic state is determined by
either the CrdCLK
IN
or the VID at the CLK/I/O pins with respect to
the logic level at the DE pin. This pin has a weak pullup device to
V
CC
. If OE is floating, then all CLK
OUT
pins will be High.
DE
11
I
DE; this pin is active LOW. When Low, this pin enables the
CardCLK
IN
signal to the CLKI/O pins and CLK
OUT
pins. When High,
the Driver is TRI-STATE
®
, the CLKI/O pins are inputs and determine
the state of the CLK
OUT
pins. This pin has a weak pullup device to
V
CC
. If DE is floating, then CLKI/O pins are TRI-STATE.
CLK
OUT
13, 15, 17, 19, 21,
23
O
6 Buffered clock (CMOS) outputs.
CrdCLK
IN
9
I
Input clock from Card (CMOS level or TTL level).
V
CC
16, 20, 24
Power
V
CC
; Analog V
CCA
(Internally separate from V
CC
, connect externally
or use separate power supplies). No special power sequencing
required. Either V
CCA
or V
CC
can be applied first, or simultaneously
apply both power supplies.
GND
1, 12, 14, 18, 22
Ground
GND
V
CCA
4
Power
Analog V
CCA
(Internally separate from V
CC
, connect externally or use
separate power supplies). No special power sequencing required.
Either V
CCA
or V
CC
can be applied first, or simultaneously apply both
power supplies.
GNDA
5, 8
Ground
Analog Ground (Internally separate from Ground must be connected
externally).
NC
3, 10
No Connects
DS101082-2
Order Number DS92CK16TMTC
See NS Package Number MTC24
DS92CK16
www.national.com
2
Absolute Maximum Ratings
(Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage (V
CC
)
-0.3V to +4V
Enable Input Voltage
(DE, OE, CrdCLK
IN
)
-0.3V to +4V
Voltage (CLK
OUT
)
-0.3V to (V
CC
+ 0.3V)
Voltage (CLKI/O
±
)
-0.3V to +4V
Driver Short Circuit Current
momentary
Receiver Short Circuit Current
momentary
Maximum Package Power Dissipation at +25°C
TSSOP Package
1500 mW
Derate TSSOP Package
8.2 mW/°C above +25°C
JA
95°C/W
JC
30°C/W
Storage Temperature Range
-65°C to +150°C
Lead Temperature Range
(Soldering, 4 sec.)
260°C
ESD Ratings: HBM (Note 2)
>
3000V
CDM (Note 2)
>
1000V
Machine Model (Note 2)
>
200V
Recommended Operating
Conditions
Min
Typ
Max
Units
Supply Voltage (V
CC
)
+3.0
+3.3
+3.6
V
CrdCLK
IN
, DE, OE
Input Voltage
0
V
CC
V
Operating Free Air
Temperature (T
A
)
-40
25
+85
°C
DC Electrical Characteristics
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified (Notes 3, 4).
Symbol
Parameter
Conditions
Pin
Min
Typ
Max
Units
V
TH
Input Threshold High
CLKI/O+,
CLKI/O-
25
+70
mV
V
TL
Input Threshold Low
-70
-35
mV
VCMR
Common Mode Voltage
Range (Note 5)
VID = 250 mV pk to pk
|VID|/2
2.4 -
|VID|/2
V
I
IN
Input Current
V
IN
= 0V to V
CC
, DE = V
CC
, OE =
V
CC
, Other Input = 1.2V
±
50 mV
-20
±
5
+20
µA
V
OH1R
Output High Voltage
VID = 250 mV, I
OH
= -1.0 mA
CLK
OUT
V
CC
-0.4
2.9
V
V
OH2R
Output High Voltage
VID = 250 mV, I
OH
= -6 mA
V
CC
-0.8
2.5
V
V
OL1R
Output Low Voltage
I
OL
= 1.0 mA, VID = -250 mV
0.06
0.3
V
V
OL2R
Output Low Voltage
I
OL
= 6 mA, VID = -250 mV
0
0.4
V
I
ODHR
CLK
OUT
Dynamic
Output Current (Note 6)
VID = +250 mV, V
OUT
= V
CC
-1V
-8
-16
-30
mA
I
ODLR
CLK
OUT
Dynamic
Output Current (Note 6)
VID = -250 mV, V
OUT
= 1V
10
21
35
mA
V
IH
Input High Voltage
DE, OE,
CrdCLK
IN
2.0
V
CC
V
V
IL
Input Low Voltage
GND
0.8
V
I
IH
Input High Current
V
IN
= V
CC
or 2.4V
OE, DE
-10
-2
+10
µA
I
IL
Input Low Current
V
IN
= GND or 0.4V
-20
-5
+20
µA
I
INCRD
Input Current
V
IN
= 0V to V
CC
, OE = V
CC
CrdCLK
IN
-5
+5
µA
V
CL
Input Voltage Clamp
I
OUT
= -1.5 mA
OE, DE,
CrdCLK
IN
-0.8
V
I
CC
No Load Supply Current
Outputs Enabled, No
VID Applied
OE = DE = 0V,
CrdCLK
IN
= V
CC
or GND,
CLKI/O (
±
) = Open
CLK
OUT
(0:5) = Open Circuit
V
CC
13
mA
I
CC1
No Load Supply Current
Outputs Enabled, VID
over Common Mode
Voltage Range
OE = GND
DE = V
CC
CrdCLK
IN
= V
CC
or GND,
VID = 250 mV
(0.125V VCM 2.275V),
CLK
OUT
(0:5) = Open Circuit
10
mA
I
CCD
Driver Loaded Supply
Current
DE = OE = 0V,
CrdCLK
IN
= V
CC
or GND,
R
L
= 37.5
between CLKI/O+ and
CLKI/O-,
CLK
OUT
(0:5) = Open Circuit
20
25
mA
DS92CK16
www.national.com
3
DC Electrical Characteristics
(Continued)
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified (Notes 3, 4).
Symbol
Parameter
Conditions
Pin
Min
Typ
Max
Units
V
OD
Driver Output Differential
Voltage
R
L
= 37.5
,
Figure 5
DE = 0V
CLKI/O+,
CLKI/O-
250
350
450
mV
V
OD
Driver V
OD
Magnitude
Change
10
20
mV
V
OS
Driver Offset Voltage
1.1
1.29
1.5
V
V
OS
Driver Offset Voltage
Magnitude Change
5
20
mV
V
OHD
Driver Output High
1.35
1.8
V
V
OLD
Driver Output Low
0.80
1.05
V
I
OS1D
Driver Differential Short
Circuit Current (Note 6)
CrdCLK
IN
= V
CC
or GND, VOD =
0V, (outputs shorted together)
DE = 0V
|30|
|50|
mA
I
OS2D
Driver Output Short
Circuit Current to V
CC
(Note 6)
CrdCLK
IN
= GND, DE = 0V,
CLKI/O+ = V
CC
36
70
mA
I
OS3D
Driver Output Short
Circuit Current to V
CC
(Note 6)
CrdCLK
IN
= V
CC
, DE = 0V,
CLKI/O- = V
CC
34
70
mA
I
OS4D
Driver Output Short
Circuit Current to GND
(Note 6)
CrdCLK
IN
= V
CC
, DE = 0V,
CLKI/O+ = 0V
-47
-70
mA
I
OS5D
Driver Output Short
Circuit Current to GND
(Note 6)
CrdCLK
IN
= GND, DE = 0V,
CLKI/O- = 0V
-50
-70
mA
I
OFF
Power Off Leakage
Current
V
CC
= 0V or Open,
V
APPLIED
= 3.6V
±
20
µA
Switching Characteristics
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified (Notes 7, 8).
Symbol
Parameter
Conditions
Min
Typ
Max
Units
DIFFERENTIAL RECEIVER CHARACTERISTICS
t
PHLDR
Differential Propagation Delay High to Low. CLKI/O to
CLK
OUT
C
L
= 15 pF
VID = 250 mV
Figures 1, 2
1.3
2.8
3.8
ns
t
PLHDR
Differential Propagation Delay Low to High. CLKI/O to
CLK
OUT
1.3
2.9
3.8
ns
t
SK1R
Duty Cycle Distortion(Note 10)
(pulse skew)
|t
PLH
­t
PHL
|
100
400
ps
t
SK2R
Channel to Channel Skew; Same Edge (Note 11)
30
80
ps
t
SK3R
Part to Part Skew (Note 12)
2.5
ns
t
TLHR
Transition Time Low to High (Note 9)
(20% to 80% )
0.4
1.4
2.4
ns
t
THLR
Transition Time High to Low(Note 9)
(80% to 20% )
0.4
1.3
2.2
ns
t
PLHOER
Propagation Delay Low to High
( OEto CLK
OUT
)
C
L
= 15 pF
Figures 3, 4
1.0
3
4.5
ns
t
PHLOER
Propagation Delay High to Low
(OE to CLK
OUT
)
1.0
3
4.5
ns
f
MAX
Maximum Operating Frequency (Note 15)
100
125
MHz
DS92CK16
www.national.com
4
Switching Characteristics
(Continued)
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified (Notes 7, 8).
Symbol
Parameter
Conditions
Min
Typ
Max
Units
DIFFERENTIAL DRIVER TIMING REQUIREMENTS
t
PHLDD
Differential Propagation Delay High to Low. CrdCLK
IN
to CLKI/O
C
L
= 15 pF
R
L
= 37.5
Figures 6, 7
0.5
1.8
2.5
ns
t
PLHDD
Differential Propagation Delay Low to High. CrdCLK
IN
to CLKI/O
0.5
1.8
2.5
ns
t
PHLCrd
CrdCLK
IN
to CLK
OUT
Propagation Delay High to Low
C
L
= 15 pF
Figures 8, 9
2.0
4.5
6.0
ns
t
PLHCrd
CrdCLK
IN
to CLK
OUT
Propagation Delay Low to High
2.0
4.5
6.0
ns
t
SK1D
Duty Cycle Distortion (pulse skew)
|t
PLH
­t
PHL
| (Note 13)
600
ps
t
SK2D
Differential Part-to-Part Skew (Note 14)
2.0
ns
t
TLHD
Differential Transition Time (Note 9)
(20% to 80% )
0.4
0.75
1.4
ns
t
THLD
Differential Transition Time (Note 9)
(80% to 20% )
0.4
0.75
1.4
ns
t
PHZD
Transition Time High to TRI-STATE. DE to CLKI/O
10
ns
t
PLZD
Transition Time Low to TRI-STATE. DE to CLKI/O
V
IN
= 0V to V
CC
C
L
= 15 pF,
R
L
= 37.5
Figures 10, 11
10
ns
t
PZHD
Transition Time TRI-STATE to High. DE to CLKI/O
32
ns
t
PZLD
Transition Time TRI-STATE to Low. DE to CLKI/O
32
ns
f
MAX
Maximum Operating Frequency (Note 15)
100
125
MHz
Note 1: "Absolute Maximum Ratings" are those values beyond which the safety of the device cannot be guaranteed. These ratings are not meant to imply that the
devices should be operated at these limits. The table of "Electrical Characteristics" specifies conditions of device operation.
Note 2: ESD Rating: ESD qualification is performed per the following: HBM (1.5 k
, 100 pF), Machine Model (250V, 0
), IEC 1000-4-2. All VCC pins connected to-
gether, all ground pins connected together.
Note 3: Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground except VID, VOD, VTH,
and VTL.
Note 4: All typicals are given for: V
CC
= +3.3V and T
A
= +25°C.
Note 5: The VCMR range is reduced for larger VID. Example: If VID=400 mV, then VCMR is 0.2V to 2.2V A VID up to |V
CC
­0V| may be applied between the CLKI/O+
and CLKI/O- inputs, with the Common Mode set to V
CC
/2.
Note 6: Only one output should be momentarily shorted at a time. Do not exceed package power dissipation rating.
Note 7: C
L
includes probe and fixture capacitance.
Note 8: Generator waveform for all tests unless otherwise specified: f = 25 MHz, Zo = 50
, t
r
= 1 ns, t
f
= 1 ns (10%­90%). To ensure fastest propagation delay and
minimum skew, clock input edge rates should not be slower than 1 ns/V; control signals not slower than 3 ns/V. In general, the faster the input edge rate, the better
the AC performance.
Note 9: All device output transition times are based on characterization measurements and are guaranteed by design.
Note 10: t
SK1R
is the difference in receiver propagation delay (|t
PLH
­t
PHL
|) of one device, and is the duty cycle distortion of the output at any given temperature and
V
CC
. The propagation delay specification is a device to device worst case over process, voltage and temperature.
Note 11: t
SK2R
is the difference in receiver propagation delay between channels in the same device of any outputs switching in the same direction. This parameter
is guaranteed by design and characterization.
Note 12: t
SK3R,
part-to-part skew, is the difference in receiver propagation delay between devices of any outputs switching in the same direction. This specification
applies to devices over recommended operating temperature and voltage ranges, and across process distribution. T
SK3R
is defined as Max­Min differential propa-
gation delay.This parameter is guaranteed by design and characterization.
Note 13: t
SK1D
is the difference in driver propagation delay (|t
PLH
­t
PHL
|) and is the duty cycle distortion of the CLKI/O outputs.
Note 14: t
SK2D
part-to-part skew, is the difference in driver propagation delay between devices of any outputs switching in the same direction. This specification ap-
plies to devices over recommended operating temperature and voltage ranges, and across process distribution. t
SK2D
is defined as Max­Min differential propagation
delay.
Note 15: Generator input conditions: t
r
/t
f
<
1 ns, 50% duty cycle, differential (1.10V to 1.35V pk-pk). Output Criteria: 60%/40% duty cycle, V
OL
(max) 0.4V, V
OH
(min)
2.7V, Load = 7 pF (stray plus probes).
DS92CK16
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5