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Part Number 855PM

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Intel
®
855PM Chipset Memory
Controller Hub (MCH) DDR 200/266
MHz

Datasheet
March 2003




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Order Number:
252613-001
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2
Intel
®
855PM Chipset Memory Controller Hub (MCH)
DDR 200/266 MHz Datasheet
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definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
The Intel
®
855PM Memory Controller Hub (MCH) may contain design defects or errors known as errata which may cause the product to deviate from
published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
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2
C is a 2-wire communications bus/protocol developed by Philips*. SMBus is a subset of the I
2
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2
C bus/protocol may require licenses from various entities, including Philips Electronics N.V. and North American Philips
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Copyright © Intel Corporation 2003
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Intel
®
855PM Chipset Memory Controller Hub (MCH)
3
DDR 200/266 MHz Datasheet
Contents
1.
Introduction .................................................................................................................................15
1.1.
Reference Documents ...................................................................................................16
1.2.
Terminology ...................................................................................................................17
1.3.
System Architecture.......................................................................................................18
1.4.
Processor Host Interface ...............................................................................................18
1.4.1.
Host Bus Error Checking ..................................................................................19
1.5.
DRAM Interface .............................................................................................................19
1.6.
AGP Interface ................................................................................................................21
1.7.
Hub Interface .................................................................................................................21
1.8.
MCH Clocking ................................................................................................................21
1.9.
System Interrupts...........................................................................................................22
2.
Signal Description.......................................................................................................................23
2.1.
Host Interface Signals....................................................................................................24
2.2.
DDR Interface ................................................................................................................26
2.3.
Hub Interface Signals.....................................................................................................27
2.4.
AGP Interface Signals....................................................................................................27
2.4.1.
AGP Addressing Signals ..................................................................................27
2.4.2.
AGP Flow Control Signals ................................................................................28
2.4.3.
AGP Status Signals ..........................................................................................28
2.4.4.
AGP Strobes .....................................................................................................29
2.4.5.
AGP/PCI Signals-Semantics ............................................................................30
2.5.
Clocks, Reset, and Miscellaneous.................................................................................32
2.6.
Voltage References, PLL Power....................................................................................33
2.7.
Reset States and Pull-up/Pull-downs ............................................................................34
3.
Register Description ...................................................................................................................39
3.1.
Conceptual Overview of the Platform Configuration Structure......................................39
3.2.
Standard PCI Bus Configuration Mechanism ................................................................39
3.3.
Routing Configuration Accesses....................................................................................40
3.3.1.
PCI Bus #0 Configuration Mechanism..............................................................40
3.3.2.
Primary PCI and Downstream Configuration Mechanism ................................40
3.3.3.
AGP Configuration Mechanism ........................................................................41
3.4.
MCH Register Introduction ............................................................................................41
3.5.
I/O Mapped Registers ....................................................................................................42
3.5.1.
CONFIG_ADDRESS ­ Configuration Address Register ..................................42
3.5.2.
CONFIG_DATA - Configuration Data Register ................................................44
3.6.
Memory Mapped Register Space ..................................................................................44
3.6.1.
SMRCTL ­ System Memory RCOMP Control Register­ Device #0 ................45
3.6.2.
DRAMWIDTH ­ DRAM Width Register ............................................................46
3.6.3.
DCLKDIS ­ DRAM Clock Control Disable Register .........................................46
3.6.4.
DQCMDSTR ­ Strength Control Register for DQ and CMD Signal Groups ....49
3.6.5.
CKESTR ­ Strength Control Register for CKE Signal Group...........................50
3.6.6.
CSBSTR ­ Strength Control Register for CS# Signal Group ...........................51
3.6.7.
CKSTR ­ Strength Control Register for CK Signal Group (CK / CK#) .............52
3.6.8.
RCVENSTR ­ Strength Control Register for RCVENOUT# Signals................53
3.6.9.
CGREDSTR ­ Strength Control Register for CMD Group Reduced Strength
Signals ..............................................................................................................54
3.7.
Host-Hub Interface Bridge Device Registers ­ Device #0.............................................54
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4
Intel
®
855PM Chipset Memory Controller Hub (MCH)
DDR 200/266 MHz Datasheet
3.7.1.
VID ­ Vendor Identification Register ­ Device#0............................................. 57
3.7.2.
DID ­ Device Identification Register ­ Device#0 ............................................. 57
3.7.3.
PCICMD ­ PCI Command Register ­ Device #0............................................. 58
3.7.4.
PCISTS ­ PCI Status Register ­ Device #0..................................................... 59
3.7.5.
RID ­ Revision Identification Register ­ Device #0 ......................................... 60
3.7.6.
SUBC ­ Sub-Class Code Register ­ Device #0............................................... 60
3.7.7.
BCC ­ Base Class Code Register ­ Device #0 ............................................... 60
3.7.8.
MLT ­ Master Latency Timer Register ­ Device #0......................................... 61
3.7.9.
HDR ­ Header Type Register ­ Device #0 ...................................................... 61
3.7.10.
APBASE ­ Aperture Base Configuration Register ­ Device #0....................... 62
3.7.11.
SMRBASE ­ System Memory RCOMP Base Address Register ­ Device #0 . 63
3.7.12.
SVID ­ Subsystem Vendor ID ­ Device #0...................................................... 63
3.7.13.
SID ­ Subsystem ID ­ Device #0..................................................................... 64
3.7.14.
CAPPTR ­ Capabilities Pointer ­ Device #0.................................................... 64
3.7.15.
AGPM ­ AGP Miscellaneous Configuration ­ Device #0................................. 64
3.7.16.
DQSMRG ­ DQS Margining Control Register ­ Device #0 ............................. 65
3.7.17.
DRB ­ DRAM Row Boundary Register ­ Device #0........................................ 65
3.7.18.
DRA ­ DRAM Row Attribute Register ­ Device #0.......................................... 66
3.7.19.
DRT ­ DRAM Timing Register ­ Device #0 ..................................................... 67
3.7.20.
DRC ­ DRAM Controller Mode Register ­ Device #0...................................... 71
3.7.21.
DRDCTL ­ DRAM Read Timing Control Register ­ Device #0 ....................... 73
3.7.22.
DORC ­ DRAM Opportunistic Refresh Control Register ­ Device #0............. 74
3.7.23.
DQSCTL ­ DQS Control Register ­ Device #0................................................ 74
3.7.24.
ECCDIAG - ECC Diagnostic Control Register ­ Device #0 ............................. 75
3.7.25.
DERRSYN ­ DRAM Error Syndrome Register ­ Device #0 ............................ 75
3.7.26.
DES ­ DRAM Error Status Register ­ Device #0............................................. 76
3.7.27.
DEAP ­ DRAM Error Address Pointer Register ­ Device #0........................... 77
3.7.28.
PAM[0:6] ­ Programmable Attribute Map Registers ­ Device #0 .................... 78
3.7.29.
FDHC ­ Fixed DRAM Hole Control Register ­ Device #0 ............................... 82
3.7.30.
SMRAM ­ System Management RAM Control Register ­ Device #0 ............. 83
3.7.31.
ESMRAMC ­ Extended System Mgmt RAM Control Register ­ Device #0 .... 84
3.7.32.
ACAPID ­ AGP Capability Identifier Register ­ Device #0 .............................. 85
3.7.33.
AGPSTAT ­ AGP Status Register ­ Device #0 ............................................... 86
3.7.34.
AGPCMD ­ AGP Command Register ­ Device #0.......................................... 87
3.7.35.
AGPCTRL ­ AGP Control Register.................................................................. 88
3.7.36.
APSIZE ­ Aperture Size ­ Device #0............................................................... 89
3.7.37.
ATTBASE ­ Aperture Translation Table Base Register ­ Device #0 .............. 90
3.7.38.
AMTT ­ AGP Interface Multi-Transaction Timer Register ­ Device #0 ........... 91
3.7.39.
LPTT ­ AGP Low Priority Transaction Timer Register ­ Device #0 ................ 92
3.7.40.
TOM ­ Top of Low Memory Register ­ Device #0........................................... 92
3.7.41.
MCHCFG ­ MCH Configuration Register ­ Device #0 .................................... 93
3.7.42.
ERRSTS ­ Error Status Register ­ Device #0 ................................................. 94
3.7.43.
ERRCMD ­ Error Command Register ­ Device #0 ......................................... 96
3.7.44.
SMICMD ­ SMI Command Register ­ Device #0 ............................................ 98
3.7.45.
SCICMD ­ SCI Command Register ­ Device #0............................................. 99
3.7.46.
WCCTL ­ Write Cache Control Register ­ Device #0 ................................... 100
3.7.47.
SKPD ­ Scratchpad Data ­ Device #0........................................................... 101
3.7.48.
CAPID ­ Product Specific Capability register ­ Device #0 ............................ 101
3.7.49.
MCHTST ­ MCH Test Register ­ Device #0.................................................. 102
3.8.
AGP Bridge Registers ­ Device #1 ............................................................................. 102
3.8.1.
VID1 ­ Vendor Identification Register ­ Device #1........................................ 105
3.8.2.
DID1 ­ Device Identification Register ­ Device #1 ........................................ 105
3.8.3.
PCICMD1 ­ PCI-PCI Command Register ­ Device #1.................................. 106
3.8.4.
PCISTS1 ­ PCI-PCI Status Register ­ Device #1 ......................................... 107
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Intel
®
855PM Chipset Memory Controller Hub (MCH)
5
DDR 200/266 MHz Datasheet
3.8.5.
RID1 ­ Revision Identification Register ­ Device #1 ......................................108
3.8.6.
SUBC1- Sub-Class Code Register ­ Device #1.............................................108
3.8.7.
BCC1 ­ Base Class Code Register ­ Device #1............................................109
3.8.8.
MLT1 ­ Master Latency Timer Register ­ Device #1 .....................................109
3.8.9.
HDR1 ­ Header Type Register ­ Device #1...................................................109
3.8.10.
PBUSN1 ­ Primary Bus Number Register ­ Device #1 .................................110
3.8.11.
SBUSN1 ­ Secondary Bus Number Register ­ Device #1 ............................110
3.8.12.
SUBUSN1 ­ Subordinate Bus Number Register ­ Device #1........................110
3.8.13.
SMLT1 ­ Secondary Master Latency Timer Register ­ Device #1 ................111
3.8.14.
IOBASE1 ­ I/O Base Address Register ­ Device #1......................................112
3.8.15.
IOLIMIT1 ­ I/O Limit Address Register ­ Device #1.......................................112
3.8.16.
SSTS1 ­ Secondary PCI-PCI Status Register ­ Device #1 ...........................113
3.8.17.
MBASE1 ­ Memory Base Address Register ­ Device #1 ..............................114
3.8.18.
MLIMIT1 ­ Memory Limit Address Register ­ Device #1 ...............................115
3.8.19.
PMBASE1 ­ Prefetchable Memory Base Address Register ­ Device #1 ......116
3.8.20.
PMLIMIT1 ­ Prefetchable Memory Limit Address Register ­ Device #1 .......117
3.8.21.
BCTRL1 ­ PCI-PCI Bridge Control Register ­ Device #1 ..............................118
3.8.22.
ERRCMD1 ­ Error Command Register ­ Device #1......................................119
3.8.23.
DWTC ­ DRAM Write Throttling Control Register ­ Device #1......................120
3.8.24.
DRTC ­ DRAM Read Throttling Control Register ­ Device #1 ......................122
3.8.25.
TSCR ­ Thermal Sensor Control Register ­ Device #1 .................................124
3.8.26.
TSSR ­ Thermal Sensor Status Register ­ Device #1...................................125
3.8.27.
THTS ­ Thermal Sensor High Temperature Setting Register ­ Device #1....125
3.8.28.
TCTS ­ Thermal Sensor Catastrophic Temperature Setting Register ­ Device
#1 ...................................................................................................................126
3.8.29.
TCOR ­ Thermal Calibration Offset Register ­ Device #1.............................126
3.8.30.
TSHTC ­ Thermal Sensor Hardware Throttling Control Register ­ Device
#1
...................................................................................................................127
3.9.
Power Management Registers ­ Device #6 ................................................................128
3.9.1.
VID6 ­ Vendor Identification Register ­ Device #6 ........................................129
3.9.2.
DID6 ­ Device Identification Register ­ Device #6.........................................130
3.9.3.
PCICMD6 ­ PCI Command Register ­ Device #6 .........................................130
3.9.4.
PCISTS6 ­ PCI Status Register ­ Device #6 .................................................131
3.9.5.
RID6 ­ Revision Identification Register ­ Device #6 ......................................131
3.9.6.
SUBC6- Sub-Class Code Register ­ Device #6.............................................132
3.9.7.
BCC6 ­ Base Class Code Register ­ Device #6............................................132
3.9.8.
HDR6 ­ Header Type Register ­ Device #6...................................................132
3.9.9.
BAR6 ­ Base Address Register ­ Device #6 .................................................133
3.9.10.
PMCR ­ Power Management Control Register ­ Device #6..........................134
3.9.11.
PMCER ­ Power Management Control Extension Register ­ Device #6 ......135
4.
System Address Map ...............................................................................................................137
4.1.
Memory Address Ranges ............................................................................................137
4.1.1.
VGA and MDA Memory Space .......................................................................138
4.1.2.
PAM Memory Spaces .....................................................................................139
4.1.3.
ISA Hole Memory Space ................................................................................140
4.1.4.
TSEG SMM Memory Space ...........................................................................140
4.1.5.
IOAPIC Memory Space ..................................................................................141
4.1.6.
System Bus Interrupt Memory Space.............................................................141
4.1.7.
High SMM Memory Space..............................................................................141
4.1.8.
AGP Aperture Space (Device #0 BAR) ..........................................................141
4.1.9.
AGP Memory and Prefetchable Memory........................................................142
4.1.10.
Hub Interface A Subtractive Decode ..............................................................142
4.2.
AGP Memory Address Ranges....................................................................................142