MPXV5004G SERIES
1
Sensor Device Data
Freescale Semiconductor
Integrated Silicon Pressure Sensor
On- Chip Signal Conditioned,
Temperature Compensated
and Calibrated
The MPXV5004G series piezoresistive transducer is a state--of--the--art monolithic
silicon pressure sensor designed for a wide range of applications, but particularly those
employing a microcontroller or microprocessor with A/D inputs. This sensor combines a
highly sensitive implanted strain gauge with advanced micromachining techniques,
thin--film metallization, and bipolar processing to provide an accurate, high level analog
output signal that is proportional to the applied pressure.
Features
· Temperature Compensated over 10° to 60°C
· Available in Gauge Surface Mount (SMT) or Through--
hole (DIP) Configurations
· Durable Thermoplastic (PPS) Package
Application Examples
· Washing Machine Water Level
· Ideally Suited for Microprocessor or Microcontroller--
Based Systems
Figure 1. Fully Integrated Pressure Sensor
Schematic
V
S
SENSING
ELEMENT
V
out
GND
THIN FILM
TEMPERATURE
COMPENSATION
AND
GAIN STAGE #1
GAIN STAGE #2
AND
GROUND
REFERENCE
SHIFT CIRCUITRY
PINS 1, 5, 6, 7, AND 8 ARE NO CONNECTS
FOR SMALL OUTLINE PACKAGE DEVICE
MPXV5004G
Rev. 6, 10/2004
Freescale Semiconductor
Technical Data
© Freescale Semiconductor, Inc., 2004. All rights reserved.
PIN NUMBER
1
2
3
N/C
V
S
Gnd
5
6
7
N/C
N/C
N/C
4
V
out
8
N/C
MPXV5004G
SERIES
INTEGRATED
PRESSURE SENSOR
0 to 3.92 kPa
(0 to 400 mm H
2
O)
1.0 to 4.9 V OUTPUT
MPXV5004GC7U
CASE 482C
SMALL OUTLINE PACKAGE
THROUGH--HOLE
MPXV5004G7U
CASE 482B
J
MPXV5004G6U
CASE 482
MPXV5004GC6U
CASE 482A
NOTE: Pins 1, 5, 6, 7, and 8 are
internal device connections. Do not
connect to external circuitry or
ground. Pin 1 is noted by the notch in
the lead.
SMALL OUTLINE PACKAGE
SURFACE MOUNT
MPXV5004DP
CASE 1351
MPXV5004GVP
CASE 1368
MPXV5004GP
CASE 1369
2
Sensor Device Data
Freescale Semiconductor
MPXV5004G SERIES
MAXIMUM RATINGS
(NOTE)
Parametrics
Symbol
Value
Unit
Maximum Pressure (P1 > P2)
P
max
16
kPa
Storage Temperature
T
stg
--30 to +100
°C
Operating Temperature
T
A
0 to +85
°C
NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device.
OPERATING CHARACTERISTICS
(V
S
= 5.0 Vdc, T
A
= 25°C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 3
required to meet electrical specifications)
Characteristic
Symbol
Min
Typ
Max
Unit
Pressure Range
P
OP
0
--
3.92
400
kPa
mm H
2
O
Supply Voltage
(1)
V
S
4.75
5.0
5.25
Vdc
Supply Current
I
S
--
--
10
mAdc
Span at 306 mm H
2
O (3 kPa)
(2)
V
FSS
--
3.0
--
V
Offset
(3)(5)
V
off
0.75
1.00
1.25
V
Sensitivity
V/P
--
1.0
9.8
--
V/kPa
mV/mm H
2
O
Accuracy
(4)(5)
0 to 100 mm H
2
O
(10 to 60°C)
100 to 400 mm H
2
O
(10 to 60°C)
--
--
--
±1.5
±2.5
%V
FSS
%V
FSS
NOTES:
1. Device is ratiometric within this specified excitation range.
2. Span is defined as the algebraic difference between the output voltage at specified pressure and the output voltage at the minimum rated
pressure.
3. Offset (V
off
) is defined as the output voltage at the minimum rated pressure.
4. Accuracy (error budget) consists of the following:
· Linearity:
Output deviation from a straight line relationship with pressure over the specified pressure range.
· Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is
cycled to and from the minimum or maximum operating temperature points, with zero differential pressure
applied.
· Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
minimum or maximum rated pressure, at 25°C.
· Offset Stability:
Output deviation, after 1000 temperature cycles, -30 to 100°C, and 1.5 million pressure cycles, with
minimum rated pressure applied.
· TcSpan:
Output deviation over the temperature range of 10 to 60°C, relative to 25°C.
· TcOffset:
Output deviation with minimum rated pressure applied, over the temperature range of 10 to 60°C,
relative to 25°C.
· Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of V
FSS
, at 25°C.
5. Auto Zero at Factory Installation: Due to the sensitivity of the MPXV5004G, external mechanical stresses and mounting position can affect
the zero pressure output reading. Autozeroing is defined as storing the zero pressure output reading and subtracting this from the device's
output during normal operations. Reference AN1636 for specific information. The specified accuracy assumes a maximum temperature
change of ± 5° C between autozero and measurement.
MPXV5004G SERIES
3
Sensor Device Data
Freescale Semiconductor
ON--CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING
The performance over temperature is achieved by inte-
grating the shear--stress strain gauge, temperature com-
pensation, calibration and signal conditioning circuitry onto a
single monolithic chip.
Figure 2 illustrates the gauge configuration in the basic chip
carrier (Case 482). A fluorosilicone gel isolates the die surface
and wire bonds from the environment, while allowing the pres-
sure signal to be transmitted to the silicon diaphragm.
The MPXV5004G series sensor operating characteristics
are based on use of dry air as pressure media. Media, other
than dry air, may have adverse effects on sensor performance
and long--term reliability. Internal reliability and qualification
test for dry air, and other media, are available from the factory.
Contact the factory for information regarding media tolerance
in your application.
Figure 3 shows the recommended decoupling circuit for in-
terfacing the output of the MPXV5004G to the A/D input of
the microprocessor or microcontroller. Proper decoupling of
the power supply is recommended.
Figure 4 shows the sensor output signal relative to pres-
sure input. Typical, minimum and maximum output curves
are shown for operation over a temperature range of 10°C to
60°C using the decoupling circuit shown in Figure 3. The
output will saturate outside of the specified pressure range.
Figure 2. Cross--Sectional Diagram (Not to Scale)
1.0 mF
IPS
470 pF
OUTPUT
Vs
+5 V
0.01 mF
GND
Vout
Figure 3. Recommended power supply decoupling
and output filtering.
For additional output filtering, please refer to
Application Note AN1646.
FLUOROSILICONE
GEL DIE COAT
WIRE BOND
DIFFERENTIAL SENSING
ELEMENT
THERMOPLASTIC
CASE
STAINLESS
STEEL CAP
LEAD
FRAME
P1
P2
DIE BOND
DIE
Figure 4. Output versus Pressure Differential
MAX
DIFFERENTIAL PRESSURE
5.0
4.0
3.0
2.0
OUTPUT
(
V
)
TRANSFER FUNCTION:
V
out
= V
S
*[(0.2*P) + 0.2] ± 1.5% V
FSS
V
S
= 5.0 V ± 0.25 Vdc
TEMP = 10 to 60°C
1.0
MIN
TYPICAL
2 kPa
200 mm H
2
O
(See Note 5 in Operating Characteristics)
4 kPa
400 mm H
2
O
4
Sensor Device Data
Freescale Semiconductor
MPXV5004G SERIES
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale Semiconductor designates the two sides of the
pressure sensor as the Pressure (P1) side and the Vacuum
(P2) side. The Pressure (P1) side is the side containing sili-
cone gel which isolates the die from the environment. The
Freescale Semiconductor pressure sensor is designed to op-
erate with positive differential pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the table
below:
Part Number
Case Type
Pressure (P1) Side Identifier
MPXV5004GC6U/T1
482A
Side with Port Attached
MPXV5004G6U/T1
482
Stainless Steel Cap
MPXV5004GC7U
482C
Side with Port Attached
MPXV5004G7U
482B
Stainless Steel Cap
MPXV5004GP
1369
Side with Port Attached
MPXV5004DP
1351
Side with Port Marking
MPXV5004GVP
1368
Stainless Steel Cap
ORDERING INFORMATION
MPXV5004G series pressure sensors are available in the basic element package or with a pressure port. Two packing
options are offered for the surface mount configuration.
Device Type / Order No
Case No
Packing Options
Device Marking
Device Type / Order No.
Case No.
Packing Options
Device Marking
MPXV5004G6U
482
Rails
MPXV5004G
MPXV5004G6T1
482
Tape and Reel
MPXV5004G
MPXV5004GC6U
482A
Rails
MPXV5004G
MPXV5004GC6T1
482A
Tape and Reel
MPXV5004G
MPXV5004GC7U
482C
Rails
MPXV5004G
MPXV5004G7U
482B
Rails
MPXV5004G
MPXV5004GP
1369
Trays
MPXV5004G
MPXV5004DP
1351
Trays
MPXV5004G
MPXV5004GVP
1368
Trays
MPXV5004G
INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482)
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must
be the correct size to ensure proper solder connection inter-
face between the board and the package. With the correct
fottprint, the packages will self align when subjected to a
solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and short-
ing between solder pads.
0.660
16.76
0.060 TYP 8X
1.52
0.100 TYP 8X
2.54
0.100 TYP 8X
2.54
0.300
7.62
Figure 5. SOP Footprint (Case 482)
inch
mm
SCALE 2:1
MPXV5004G SERIES
5
Sensor Device Data
Freescale Semiconductor
NOTES
6
Sensor Device Data
Freescale Semiconductor
MPXV5004G SERIES
NOTES
MPXV5004G SERIES
7
Sensor Device Data
Freescale Semiconductor
SMALL OUTLINE PACKAGE DIMENSIONS
CASE 482--01
ISSUE O
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
10.54
0.425
0.415
10.79
B
10.54
0.425
0.415
10.79
C
5.38
0.230
0.212
5.84
D
0.96
0.042
0.038
1.07
G
0.100 BSC
2.54 BSC
H
0.002
0.010
0.05
0.25
J
0.009
0.011
0.23
0.28
K
0.061
0.071
1.55
1.80
M
0
7
0
7
N
0.405
0.415
10.29
10.54
S
0.709
0.725
18.01
18.41
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT.
_
_
_
_
S
D
G
8 PL
4
5
8
1
N
S
B
M
0.25 (0.010)
A
S
T
--A--
--B--
C
M
J
K
PIN 1 IDENTIFIER
H
SEATING
PLANE
--T--
CASE 482A--01
ISSUE A
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
10.54
0.425
0.415
10.79
B
10.54
0.425
0.415
10.79
C
12.70
0.520
0.500
13.21
D
0.96
0.042
0.038
1.07
G
0.100 BSC
2.54 BSC
H
0.002
0.010
0.05
0.25
J
0.009
0.011
0.23
0.28
K
0.061
0.071
1.55
1.80
M
0
7
0
7
N
0.444
0.448
11.28
11.38
S
0.709
0.725
18.01
18.41
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT.
_
_
_
_
S
D
G
8 PL
4
5
8
1
S
B
M
0.25 (0.010)
A
S
T
--A--
--B--
C
M
J
K
PIN 1 IDENTIFIER
H
SEATING
PLANE
--T--
N
V
W
V
0.245
0.255
6.22
6.48
W
0.115
0.125
2.92
3.17
8
Sensor Device Data
Freescale Semiconductor
MPXV5004G SERIES
SMALL OUTLINE PACKAGE DIMENSIONS (CONTINUED)
CASE 482B--03
ISSUE B
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
10.54
0.425
0.415
10.79
B
10.54
0.425
0.415
10.79
C
5.33
0.220
0.210
5.59
D
0.66
0.034
0.026
0.864
G
0.100 BSC
2.54 BSC
J
0.009
0.011
0.23
0.28
K
0.100
0.120
2.54
3.05
M
0
15
0
15
N
0.405
0.415
10.29
10.54
S
0.540
0.560
13.72
14.22
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT.
6. DIMENSION S TO CENTER OF LEAD WHEN
FORMED PARALLEL.
_
_
_
_
PIN 1 IDENTIFIER
K
SEATING
PLANE
--T--
S
G
4
5
8
1
--A--
--B--
C
M
J
N
D
8 PL
S
B
M
0.25 (0.010)
A
S
T
DETAIL X
DETAIL X
CASE 482C--03
ISSUE B
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
10.54
0.425
0.415
10.79
B
10.54
0.425
0.415
10.79
C
12.70
0.520
0.500
13.21
D
0.66
0.034
0.026
0.864
G
0.100 BSC
2.54 BSC
J
0.009
0.011
0.23
0.28
K
0.100
0.120
2.54
3.05
M
0
15
0
15
N
0.444
0.448
11.28
11.38
S
0.540
0.560
13.72
14.22
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT.
6. DIMENSION S TO CENTER OF LEAD WHEN
FORMED PARALLEL.
_
_
_
_
PIN 1
K
SEATING
PLANE
--T--
S
G
4
5
8
1
--A--
--B--
C
N
V
W
M
J
V
0.245
0.255
6.22
6.48
W
0.115
0.125
2.92
3.17
IDENTIFIER
D
8 PL
S
B
M
0.25 (0.010)
A
S
T
DETAIL X
DETAIL X
MPXV5004G SERIES
9
Sensor Device Data
Freescale Semiconductor
SMALL OUTLINE PACKAGE DIMENSIONS (CONTINUED)
CASE 1369--01
ISSUE O
D
E
e/2
N
e
A
M
0.004 (0.1)
B
C
A
E1
A
B
C
0.004 (0.1)
A
0.008 (0.20)
B
C
8X
b
2 PLACES 4 TIPS
DETAIL G
SEATING
PLANE
8X
P
1
4
8
5
NOTES:
1. CONTROLLING DIMENSION: INCH.
2. INTERPRET DIMENSIONS AND TOLERANCES PER
ASME Y14.5M--1994.
3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152)
PER SIDE.
4. DIMENSION "b" DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.008 (0.203) MAXIMUM.
DIM
A
MIN
MAX
MIN
MAX
MILLIMETERS
0.300
0.330
7.11
7.62
INCHES
A1
0.002
0.010
0.05
0.25
b
0.038
0.042
0.96
1.07
D
0.465
0.485
11.81
12.32
E
E1
0.465
0.485
11.81
12.32
e
M
0.270
0.290
6.86
7.36
N
0.080
0.090
2.03
2.28
P
0.009
0.011
0.23
0.28
T
0.115
0.125
2.92
3.17
0.100 BSC
2.54 BSC
F
0.245
0.255
6.22
6.47
K
0.120
0.130
3.05
3.30
L
0.061
0.071
1.55
1.80
F
K
M
GAGE
DETAIL G
L
A1
.014 (0.35)
PLANE
0
7
0
7
°
°
°
°
T
0.717 BSC
18.21 BSC
10
Sensor Device Data
Freescale Semiconductor
MPXV5004G SERIES
SMALL OUTLINE PACKAGE DIMENSIONS (CONTINUED)
CASE 1351--01
ISSUE O
D
E
e/2
N
e
A
M
0.004 (0.1)
B
C
A
E1
A
B
C
0.004 (0.1)
A
0.006 (0.15)
B
C
8X
b
2 PLACES 4 TIPS
DETAIL G
SEATING
PLANE
8X
P
1
4
8
5
NOTES:
1. CONTROLLING DIMENSION: INCH.
2. INTERPRET DIMENSIONS AND TOLERANCES PER
ASME Y14.5M--1994.
3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152)
PER SIDE.
4. DIMENSION "b" DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.008 (0.203) MAXIMUM.
DIM
A
MIN
MAX
MIN
MAX
MILLIMETERS
0.370
0.390
9.39
9.91
INCHES
A1
0.002
0.010
0.05
0.25
b
0.038
0.042
0.96
1.07
D
0.465
0.485
11.81
12.32
E
0.680
0.700
17.27
17.78
E1
0.465
0.485
11.81
12.32
e
M
0.270
0.290
6.86
7.37
N
0.160
0.180
4.06
4.57
P
0.009
0.011
0.23
0.28
T
0.110
0.130
2.79
3.30
0.100 BSC
2.54 BSC
F
0.240
0.260
6.10
6.60
K
0.115
0.135
2.92
3.43
L
0.040
0.060
1.02
1.52
F
K
M
T
GAGE
DETAIL G
L
A1
.014 (0.35)
PLANE
0
7
0
7
°
°
°
°
STYLE 1:
PIN 1. GND
2. +Vout
3. Vs
4. --Vout
5. N/C
6. N/C
7. N/C
8. N/C
STYLE 2:
PIN 1. N/C
2. Vs
3. GND
4. Vout
5. N/C
6. N/C
7. N/C
8. N/C
MPXV5004G SERIES
11
Sensor Device Data
Freescale Semiconductor
SMALL OUTLINE PACKAGE DIMENSIONS (CONTINUED)
CASE 1368--01
ISSUE O
D
E
e/2
N
e
A
M
0.004 (0.1)
B
C
A
E1
A
B
C
0.004 (0.1)
A
0.006 (0.15)
B
C
8X
b
2 PLACES 4 TIPS
DETAIL G
SEATING
PLANE
8X
P
1
4
8
5
NOTES:
1. CONTROLLING DIMENSION: INCH.
2. INTERPRET DIMENSIONS AND TOLERANCES PER
ASME Y14.5M--1994.
3. DIMENSIONS "D" AND "E1" DO NOT INCLUDE MOLD
FLASH OR PROTRUSIONS. MOLD FLASH OR
PROTRUSIONS SHALL NOT EXCEED 0.006 (0.152)
PER SIDE.
4. DIMENSION "b" DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.008 (0.203) MAXIMUM.
DIM
A
MIN
MAX
MIN
MAX
MILLIMETERS
0.280
0.300
7.11
7.62
INCHES
A1
0.002
0.010
0.05
0.25
b
0.038
0.042
0.96
1.07
D
0.465
0.485
11.81
12.32
E
E1
0.465
0.485
11.81
12.32
e
M
0.035
0.055
1.90
2.41
N
0.075
0.095
0.89
1.39
P
0.009
0.011
0.23
0.28
R
0.405
0.415
10.28
10.54
0.100 BSC
2.54 BSC
F
0.240
0.260
6.10
6.60
K
0.115
0.135
2.92
3.43
L
0.040
0.060
1.02
1.52
F
K
M
R
GAGE
DETAIL G
L
A1
.014 (0.35)
PLANE
0
7
0
7
°
°
°
°
STYLE 1:
PIN 1. GND
2. +Vout
3. Vs
4. --Vout
5. N/C
6. N/C
7. N/C
8. N/C
STYLE 2:
PIN 1. N/C
2. Vs
3. GND
4. Vout
5. N/C
6. N/C
7. N/C
8. N/C
T
T
0.110
0.130
2.79
3.30
0.690 BSC
17.52 BSC
12
Sensor Device Data
Freescale Semiconductor
MPXV5004G SERIES
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