defining a degree of excellence
Bel Fuse Inc.
198 Van Vorst Street, Jersey City, NJ 07302 ˇ Tel: 201-432-0463 ˇ Fax: 201-432-9542 ˇ E-Mail: BelFuse@belfuse.com
Website: http://www.belfuse.com
Specifications subject to change without notice.
MECHANICAL
SCHEMATICS
ˇ Designed for use with Microlinear ML 4664/4669
10Base-T UTP to Fiber application chips
ˇ Includes TP-PMD filter network, available with and
without common mode choke
960036A
S556-2793-00
-1.0
-5
-10
-16
-15
-30
--
--
A
S556-2793-01
-1.1
-5
-10
-16
-15
-30
-40
-30
B
10BASE-T/FIBER APPLICATION
FILTER MODULE
ˇ Low profile, robust surface mount packaging, rated to
withstand 225ēC peak IR reflow temperature
ˇ 2000 Vrms isolation
A
B
ELECTRICALS AT 25ēC
Insertion Loss
Attenuation
Return Loss
Crosstalk
CM-CM Rej
(dB) Max
(dB) Min
(dB) Min
(dB) Min
(dB) Min
Part No.
1-10MHz
25MHz 30MHz 40MHz
5MHz-10MHz
1MHz-10MHz
1-10MHz 10-100MHz
Schematic
defining a degree of excellence
Corporate Office
Bel Fuse Inc.
198 Van Vorst Street, Jersey City, NJ 07302-4496
Tel: 201-432-0463
Fax: 201-432-9542
E-Mail: BelFuse@belfuse.com
Internet: http://www.belfuse.com
Far East Office
Bel Fuse Ltd.
8F/8 Luk Hop Street
San Po Kong
Kowloon, Hong Kong
Tel: 852-2328-5515
Fax: 852-2352-3706
European Office
Bel Fuse Europe Ltd.
Preston Technology Management Centre
Marsh Lane, Preston PR1 8UD
Lancashire, U.K.
Tel: 44-1772-556601
Fax: 44-1772-888366
APPLICATION NOTES
APPLICATION CIRCUIT
960036A
10BASE-T/FIBER APPLICATION
FILTER MODULE
ˇ Bel has developed a series of filter modules for Microlinear's 10Base-T twisted pari to fiber conversion chipsets. Each
module includes a 400 ohm transmit and 100 ohm receive filter, impedance matched to the Microlinear chipset for
signal shaping, high voltage isolation transformers, and center taps for grounding. An optional common mode choke
is available for further EMI and noise suppression.
ˇ Bel's low profile, surface mount packaging is ideal for high speed pick and place machinery. Parts can be shipped on
tape and reel for high speed placement. Construction processes have been implemented for thermal compatibility
with high temperature IR reflow assembly processing. Post dipping of leads assist with PC board solderability. Each
part is optically inspected to meet rigid coplanarity requirements.
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