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Part Number AMD-K6-2

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®
Mobile
AMD-K6-2
Processor
Data Sheet
Publication # 21896
Rev: E
Amendment/0
Issue Date: May 2000
Preliminary Information
®
Trademarks
AMD, the AMD logo, K6, 3DNow!, and combinations thereof, and Super7 are trademarks, and AMD-K6 and RISC86
are registered trademarks of Advanced Micro Devices, Inc.
MMX is a trademark of Intel Corporation.
Microsoft, Windows, and Windows NT are registered trademarks of Microsoft Corporation.
Other product names used in this publication are for identification purposes only and may be trademarks of their
respective companies.
© 2000 Advanced Micro Devices, Inc. All rights reserved.
The contents of this document are provided in connection with Advanced Micro Devices, Inc.
("AMD") products. AMD makes no representations or warranties with respect to the accuracy
or completeness of the contents of this publication and reserves the right to make changes to
specifications and product descriptions at any time without notice. No license, whether
express, implied, arising by estoppel or otherwise, to any intellectual property rights is granted
by this publication. Except as set forth in AMD's Standard Terms and Conditions of Sale, AMD
assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a
particular purpose, or infringement of any intellectual property right.
AMD's products are not designed, intended, authorized or warranted for use as components
in systems intended for surgical implant into the body, or in other applications intended to
support or sustain life, or in any other application in which the failure of AMD's product could
create a situation where personal injury, death, or severe property or environmental damage
may occur. AMD reserves the right to discontinue or make changes to its products at any time
without notice.
Preliminary Information
Contents
iii
21896E/0--May 2000
Mobile AMD-K6
®
-2 Processor Data Sheet
Preliminary Information
Contents
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xi
About This Data Sheet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .xiii
Part One
Mobile AMD-K6
®
-2 Processor
1
1
Mobile AMD-K6
®
-2 Processor . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1
Super7TM Platform Initiative . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Super7 Platform Enhancements: . . . . . . . . . . . . . . . . . . . . . . . . 5
2
Internal Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.1
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.2
Mobile AMD-K6
®
-2 Processor Microarchitecture
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Enhanced RISC86
®
Microarchitecture . . . . . . . . . . . . . . . . . . . 8
2.3
Cache, Instruction Prefetch, and Predecode Bits . . . . . . . . . 11
Cache . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Prefetching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Predecode Bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2.4
Instruction Fetch and Decode . . . . . . . . . . . . . . . . . . . . . . . . . 13
Instruction Fetch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Instruction Decode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2.5
Centralized Scheduler . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
2.6
Execution Units . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Register X and Y Pipelines . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
2.7
Branch-Prediction Logic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Branch History Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Branch Target Cache . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Return Address Stack . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Branch Execution Unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3
Logic Symbol Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
4
Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
5
Mobile AMD-K6-2 Processor Operation . . . . . . . . . . . . . . . . . 37
5.1
Process Technology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
5.2
Clock Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Halt State . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Stop Grant State . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
iv
Contents
Mobile AMD-K6
®
-2 Processor Data Sheet
21896E/0--May 2000
Preliminary Information
Stop Grant Inquire State. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Stop Clock State . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
5.3
System Management Mode (SMM) . . . . . . . . . . . . . . . . . . . . . 42
Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
SMM Operating Mode and Default Register Values . . . . . . . 42
SMM State-Save Area . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
SMM Revision Identifier . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
SMM Base Address . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Halt Restart Slot . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
I/O Trap Dword. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
I/O Trap Restart Slot . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Exceptions, Interrupts, and Debug in SMM . . . . . . . . . . . . . . 51
6
Signal Switching Characteristics . . . . . . . . . . . . . . . . . . . . . . . 53
6.1
CLK Switching Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 53
6.2
Clock Switching Characteristics for 100-MHz Bus
Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
6.3
Clock Switching Characteristics for 66-MHz Bus
Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
6.4
Valid Delay, Float, Setup, and Hold Timings . . . . . . . . . . . . 55
6.5
Output Delay Timings for 100-MHz Bus Operation . . . . . . . 56
6.6
Input Setup and Hold Timings for 100-MHz Bus
Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
6.7
Output Delay Timings for 66-MHz Bus Operation . . . . . . . . 60
6.8
Input Setup and Hold Timings for 66-MHz Bus
Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
6.9
RESET and Test Signal Timing . . . . . . . . . . . . . . . . . . . . . . . 64
7
Electrical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
7.1
Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
7.2
Absolute Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
7.3
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
7.4
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
7.5
Power and Grounding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
Power Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
Decoupling Recommendations . . . . . . . . . . . . . . . . . . . . . . . . 77
Pin Connection Requirements . . . . . . . . . . . . . . . . . . . . . . . . . 77
8
Thermal Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
8.1
Package Thermal Specifications . . . . . . . . . . . . . . . . . . . . . . . 79
Heat Dissipation Path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81
Measuring Case Temperature . . . . . . . . . . . . . . . . . . . . . . . . . 82
Contents
v
21896E/0--May 2000
Mobile AMD-K6
®
-2 Processor Data Sheet
Preliminary Information
9
Package Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
9.1
321-Pin Staggered CPGA Package Specification . . . . . . . . . 83
9.2
360-Pin Model 8 CBGA Package Specification . . . . . . . . . . . 85
9.3
360-Pin CBGA Mechanical Specification . . . . . . . . . . . . . . . . 87
10
Pin Description Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
10.1
360-Pin CBGA Pin Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . 89
10.2
321-Pin CPGA Pin Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . 91
10.3
Pin Designations by Functional Grouping . . . . . . . . . . . . . . . 93
11
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 95
Part Two
Mobile AMD-K6-2-P Processor
97
12
Mobile AMD-K6-2-P Processor . . . . . . . . . . . . . . . . . . . . . . . . . 99
12.1
Super7 Platform Initiative . . . . . . . . . . . . . . . . . . . . . . . . . . 101
Super7 Platform Enhancements: . . . . . . . . . . . . . . . . . . . . . . 101
13
Electrical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
13.1
Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
13.2
Absolute Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
13.3
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
13.4
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107
13.5
Power and Grounding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109
Power Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109
Decoupling Recommendations . . . . . . . . . . . . . . . . . . . . . . . 110
Pin Connection Requirements . . . . . . . . . . . . . . . . . . . . . . . . 111
14
Thermal Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113
14.1
Package Thermal Specifications . . . . . . . . . . . . . . . . . . . . . . 113
Heat Dissipation Path . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115
Measuring Case Temperature . . . . . . . . . . . . . . . . . . . . . . . . 115
15
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117
Index. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119