Features

625-25ABT-4E — BGA HEATSINK 25MM

Manufacturer: Wakefield Thermal Solutions  •  RoHS/pb-free: RoHS   Pb-free  •  Series: 625  •  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  •  Attachment Method: Thermal Tape, Adhesive (Not Included)  •  Outline: 25.00mm x 25.00mm  •  Height: 0.25" (6.35mm)  •  Material: Aluminum

Suppliers of «625-25ABT-4E»

Part NoManufacturerPriceStock
BETTLINK ELECTRONIC LIMITED, Hong Kong
(852) 8191 1802, info@bettlink.com
625-25ABT4E (HEATSINK CPU 25MM SQ W/DBL TAPE Подробнее)Wakefield-Vette2.3028$6219
Kontest, Moscow
+7 (495) 150-88-73, Fax: (495) 150-88-73, zakaz@kontest.ru
625-25ABT-4E (BGA HEATSINK 25MM Подробнее)Wakefield Thermal Solutions––
Aspect, St. Petersburg
+7 (812) 309-89-32, info@aspect.spb.su
625-25ABT-4E––from 7 days
ООО "Интегральные схемы", St. Petersburg
+7 (812) 448-53-82, info@ic-ltd.ru
625-25ABT-4E––from 7 days