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10-6327-01 REV B-G — HEATSINK BGA W/PUSH PINS

Manufacturer: Aavid Thermalloy  •  RoHS/pb-free: RoHS   Pb-free  •  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  •  Attachment Method: Push Pin  •  Outline: 28.50mm x 28.50mm  •  Height: 0.394" (10mm)  •  Material: Aluminum  •  Power Dissipation @ Temperature Rise: 2W @ 60°C  •  Thermal Resistance @ Forced Air Flow: 9.3°C/W @ 200 LFM  •  Thermal Resistance @ Natural: 30.6°C/W  •  Other PartNo: 10-6327-01, HS306
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  Sure Technology  


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