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  1. SMCT TA 32N14 A10 . Thin-PakTM Voltage Controlled SolidTRON®. Data Sheet Rev 3 CAO-20140515. Description: N-Type MOS-controlled thyristor. Metal surfaces tinned with 63Sn/37Pb solder. Package is perforated, metalized ceramic substrate attached to silicon die. Applications: EFD / EFI / ESA / LEFFI / SAF Capacitor Discharge Pulse Power. Features:

  2. Advanced Pulse Power Device. N-MOS VCS, TO-247. Performance Characteristics . Parameters Anode to Cathode Breakdown Voltage. TJ=25oC unless otherwise specified Symbol Test Conditions V(BR) VGK=-5, IA=1mA. Min. 1400. Measurements Typ. Max. Units. V Anode-Cathode Off-State Current. iD. VGE=-5V, VAK=1200V. TC=25oC. <10 100. uA.

  3. Link URL. Part #: SMCTTA32N14A10. Download. File Size: 671Kbytes. Page: 5 Pages. Description: Advanced Pulse Power Device N-MOS VCS, ThinPakTM. Manufacturer: List of Unclassifed Manufacturers.

  4. SMCTTA32N14A10 , DigChip http://www.digchip.com. SMCT TA32N14A10. Advanced Pulse Power Device. N-MOS VCS, ThinPakTM. Description. Package. This voltage controlled Solidtron (VCS) discharge switch utilizes an n-type MOS-Controlled Thyristor mounted on a ThinPakTM, ceramic "chip-scale" hybrid.

  5. Typical Performance Curves (Continued)Figure 8. Pulses to Failure (Pulse Widths < 100uSec)Test Circuit and WaveformsFigure 9. 0.2uF Pulsed Discharge Circuit SchematicFigure 10. 0.2uF Pulsed Discharge Circuit WaveformsVGKVAKIAIPTD(ON) Datasheet search, datasheets, Datasheet search site for Electronic Components and Semiconductors, integrated circuits, diodes, triacs and other semiconductors.

  6. SMCT TA32N14A10. Typical Performance Curves (Continued) Figure 4. Turn-On Delay Characteristics Figure 5. Turn-On Delay Characteristics R G =4.7 W - 500 W , TJ=25

  7. Application NotesPackaging and HandlingA1. Junction Temperature CalculationThe figure below shows a lump model of the thermal properties of the size 4 thinPak packaged VCS, from the 2-mil solderon the top of the lid on the left to the 2-mil solder on the bottom of the device on the right. By adding the user's lump modelof the rest of the thermal system the user can calculate the junction and ...