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PROCESS DETAILS. GEOMETRY. GROSS DIE PER 4 INCH WAFER. 36,642. PRINCIPAL DEVICE TYPES. CMPZ5235B THRU CMPZ5261B. BACKSIDE CATHODE. R0 R6 (22-February 2012) www.centralsemi.com. PROCESS . CPZ19. Typical Electrical Characteristics. R6 (22-February 2012) www.centralsemi.com. BARE DIE PACKING OPTIONS. BARE DIE IN TRAY (WAFFLE) PACK.
The CPZ19-BZX55C6V8 thru CPZ19-BZX55C33 are silicon Zener diodes ideal for all types of commercial, industrial, entertainment, and computer applications. BACKSIDE CATHODE. R0. MECHANICAL SPECIFICATIONS: MAXIMUM RATINGS: Operating and Storage Junction Temperature. SYMBOL. TJ, Tstg. -65 to +150. UNITS. °C.
Summary:The CPZ18 and CPZ19 Zener diode wafer processes are discontinued and are now classified as End of Life (EOL). Replacement wafer process CPZ28X was previously announced in PCN108 & PCN127. Although Central Semiconductor Corp. makes every effort to continue to produce devices that have been proclaimed EOL (End of Life) by
Part #: CPZ19. Download. File Size: 211Kbytes. Page: 2 Pages. Description: Zener Diode 0.5 Watt Zener Diode Chip. Manufacturer: Central Semiconductor Corp.
Zener Diode 0.5 Watt Zener Diode Chip, CPZ19 Datasheet, CPZ19 circuit, CPZ19 data sheet : CENTRAL, alldatasheet, Datasheet, Datasheet search site for Electronic Components and Semiconductors, integrated circuits, diodes, triacs and other semiconductors.
CPZ19: Description Zener Diode 0.5 Watt Zener Diode Chip: Download 2 Pages: Scroll/Zoom: 100% : Manufacturer: CENTRAL [Central Semiconductor Corp] Direct Link: http://www.centralsemi.com: Logo
Chip process CPZ19, Zener Diode discrete semiconductors, wafers, and die in chip form. Extent of Change: An overall reduction of the die area. The CPZ19 chip process currently measures 17.7 x 17.7 mils and is being replaced by the CPZ28 chip process which measures 13 x 13 mils. Reason for Change:
