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PROCESS DETAILS. GEOMETRY. GROSS DIE PER 4 INCH WAFER. 36,642. PRINCIPAL DEVICE TYPES. CMPZ5235B THRU CMPZ5261B. BACKSIDE CATHODE. R0 R6 (22-February 2012) www.centralsemi.com. PROCESS . CPZ19. Typical Electrical Characteristics. R6 (22-February 2012) www.centralsemi.com. BARE DIE PACKING OPTIONS. BARE DIE IN TRAY (WAFFLE) PACK.
The CPZ19-BZX55C6V8 thru CPZ19-BZX55C33 are silicon Zener diodes ideal for all types of commercial, industrial, entertainment, and computer applications. BACKSIDE CATHODE. R0. MECHANICAL SPECIFICATIONS: MAXIMUM RATINGS: Operating and Storage Junction Temperature. SYMBOL. TJ, Tstg. -65 to +150. UNITS. °C.
Summary:The CPZ18 and CPZ19 Zener diode wafer processes are discontinued and are now classified as End of Life (EOL). Replacement wafer process CPZ28X was previously announced in PCN108 & PCN127. Although Central Semiconductor Corp. makes every effort to continue to produce devices that have been proclaimed EOL (End of Life) by
Part #: CPZ19. Download. File Size: 211Kbytes. Page: 2 Pages. Description: Zener Diode 0.5 Watt Zener Diode Chip. Manufacturer: Central Semiconductor Corp.
Zener Diode 0.5 Watt Zener Diode Chip, CPZ19_10 Datasheet, CPZ19_10 circuit, CPZ19_10 data sheet : CENTRAL, alldatasheet, Datasheet, Datasheet search site for Electronic Components and Semiconductors, integrated circuits, diodes, triacs and other semiconductors.
Chip process CPZ19, Zener Diode discrete semiconductors, wafers, and die in chip form. Extent of Change: An overall reduction of the die area. The CPZ19 chip process currently measures 17.7 x 17.7 mils and is being replaced by the CPZ28 chip process which measures 13 x 13 mils. Reason for Change:
Central Semiconductor's CPZ19-BZX55C8V2 is a zener diode die. in the regulator diodes, zener category. Check part details, parametric & specs updated 28 SEP 2023 and download pdf datasheet from datasheets.com, a global distributor of electronics components.
