Table 35. Thermal Resistance of HardCopy Devices. Device Package. Pin. Count JC (° C/W). JA (° C/W). Still Air. JA (° C/W). 100 ft./min. JA (° C/W). 200 ...
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$300 60-day delivery
Operating Temperature, 0°C ~ 70°C (TA) ; Voltage - Supply, 2.375V ~ 2.625V ; Supplier Device Package, 356-BGA (35x35) ; Number of LABs/CLBs, 624 ; Part Status ...
$60 6–14 day delivery 30-day returns
EP20K100BC356-1 356-BGA (35x35) IC FPGA 252 I/O 356BGA ; Number of Logic Elements/Cells, 4160 ; Total RAM Bits, 53248 ; Number of I/O · 252 ; Number of Gates, 263000.
NS-BGA-352-35. STENCIL BGA 352 PERIMETER MATRIX · View Detail · BGA-352-35. STENCIL BGA 352 PERIMETER MATRIX. View Detail · BGA-356-35 · NS-BGA-356-35
$300 60-day delivery
This component, presented in a 356-BGA (35×35) supplier device package, is noted for its obsolescence. ... 356-BGA (35x35). Number of LABs/CLBs, 832. Total RAM ...
$831.64 $7 6–14 day delivery 30-day returns
EPF10K130EBI356-2 356-BGA (35x35) IC FPGA 274 I/O 356BGA ; Total RAM Bits, 65536 ; Number of I/O · 274 ; Number of Gates, 342000 ; Voltage - Supply, 2.375 V ~ 2.625 ...
356-Pin Ball-Grid Array (BGA). □. All dimensions and tolerances conform to ... Max. Package Acronym. BGA. A. –. –. 1.70. Substrate Material. BT or tape. A1. 0.35.
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EPF10K100EBC356-2 Altera Corporation ; 35 X 35 MM, 1.27 MM PITCH, BGA-356 · 356 · compliant · 3A991.D · 8542.39.00.01 ; 35 X 35 MM, 1.27 MM PITCH, BGA-356 · 356.