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  1. www.digikey.com › 374724B00035G › 506644374724B00035G Boyd Laconia, LLC | Fans, Blowers, Thermal ...

    1,344. $3.85008. $5,174.51. Manufacturers Standard Package. Order today, ships today. 374724B00035G – Heat Sink BGA Aluminum 3.0W @ 50°C Top Mount from Boyd Laconia, LLC. Pricing and Availability on millions of electronic components from Digi-Key Electronics.

    • Aavid, Thermal Division of Boyd Corporation

  2. www.mouser.com › ProductDetail › Aavid374724B00035G Aavid | Mouser

    May 7, 2024 · 374724B00035G Aavid Heat Sinks Heat Sink for Plastic BGA Packages, Black, 35x35x18mm, IC Pkg=35 x 35, Tape #35 datasheet, inventory, & pricing.

    • Aavid
    • Aavid
    • BGA
    • Adhesive

  3. www.digikey.ca › 374724B00035G › 506644374724B00035G Boyd Laconia, LLC | Fans, Thermal Management ...

    Order today, ships today. 374724B00035G – Heat Sink BGA Aluminum 3.0W @ 50°C Top Mount from Boyd Laconia, LLC. Pricing and Availability on millions of electronic components from Digi-Key Electronics.

    • Boyd Laconia, LLC

  4. www.mouser.com › datasheet › 2DATASHEET Board Level Cooling 3747 - Mouser Electronics

    Thermal Interface Material: . 374724B60024G . T766 Chomerics Phase Change for All Surfaces . MECHANICAL & PERFORMANCE . Drawing dimensions are shown in mm, (in) . Part Number: 374724B00032G, 374724B00035G . Part Number: 374724B60024G. Mounting Details: . Board Level Cooling www.boydcorp.com. BC122020.

  5. Images

    • 374724B00035G - Boyd - Heat Sink, For Ball Grid Array, 15.3 °C/W
    • 374724B00035G - Boyd - Heat Sink, For Ball Grid Array, 15.3 °C/W
    • 374724B00035 Datasheet(PDF) - Aavid, Thermal Division of Boyd Corporation
    • サーマル - ヒートシンク/ファン、熱管理（Digi-Key）の定格検索結果|Aavid Thermal Division of Boyd ...
    • Heat Sinks - Fans, Thermal Management - SeekIC.com

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  6. www.onlinecomponents.com › en › boyd-laconia-llc374724B00035G - Boyd Laconia Llc - Authorized Distributor

    374724B00035G : available at OnlineComponents.com. Datasheets, competitive pricing, flat rate shipping & secure online ordering.

  7. www.findchips.com › detail › 374724b00035gFindchips: 374724b00035g by Boyd Corporation

    Details for 374724b00035g by Boyd Corporation. Find 374724b00035g price and stock, 374724b00035g alternates, part risk, CAD models and other insights. Findchips.com

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  9. info.boydcorp.com › hubfs › ThermalDATASHEET Board Level Cooling 3747 - Boyd Corporation

    ORDERING INFORMATION. Thermal Interface Material: . T766 Chomerics Phase Change for All . 374724B60024G . Surfaces . MECHANICAL & PERFORMANCE . Drawing dimensions are shown in mm, (in) . Part Number: 374724B00032G, 374724B00035G . USA: 1.855.322.2843 EUROPE: 39.051.764002 ASIA: 86.21.6115.2000 x8122. Board Level Cooling .