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Photo | Name | Manufacturer | Technical parameters | Prices (rub.) | Buy |
ATS-52350G-C1-R0 | Advanced Thermal Solutions Inc | HEAT SINK 35MM X 35MM X 12.5MM Series: maxiFLOW · Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) · Attachment Method: Thermal Tape, Adhesive (Included) · Outline: 35.00mm x 35.00mm · Height: 0.49" (12.5mm) · Material: Aluminum · Thermal Resistance @ Forced Air Flow: 3.0°C/W @ 200 LFM | from 5,15 from 9,34 | Additional information Find at suppliers |
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