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ATS-52350G-C0-R0 — ALUM HEAT SINK MAXIFLOW

ManufacturerAdvanced Thermal Solutions Inc
Harmful substancesRoHS   Lead-free
SeriesmaxiFLOW
Package CooledAssorted (BGA, LGA, CPU, ASIC...)
Attachment MethodThermal Tape, Adhesive (Included)
Outline35.00mm x 35.00mm
Height0.49" (12.5mm)
MaterialAluminum
Found under nameQ4348874
Analogous by characteristics
PhotoNameManufacturerTechnical parametersPrices (rub.)Buy
ATS-52350G-C1-R0ATS-52350G-C1-R0Advanced Thermal Solutions IncHEAT SINK 35MM X 35MM X 12.5MM
Series: maxiFLOW  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 35.00mm x 35.00mm  ·  Height: 0.49" (12.5mm)  ·  Material: Aluminum  ·  Thermal Resistance @ Forced Air Flow: 3.0°C/W @ 200 LFM
from 5,15
from 9,34
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