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Fans, Thermal Management  ·  Heat Sinks
 

6933-72 — HEATSINK EXTRUSION

ManufacturerWakefield Thermal Solutions
Harmful substancesRoHS   Lead-free
Found under nameQ4117200
Analogous by characteristics
PhotoNameManufacturerTechnical parametersPrices (rub.)Buy
658-60ABT3658-60ABT3Wakefield Thermal SolutionsHEATSINK CPU 28MM SQ BLK W/TAPE
Series: 658  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 27.94mm x 27.94mm  ·  Height: 0.6" (15.24mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2.5W @ 30°C  ·  Thermal Resistance @ Forced Air Flow: 3°C/W @ 300 LFM
from 1,48
from 3,54		Additional information
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637-10ABP637-10ABPWakefield Thermal SolutionsHEATSINK TO-220 VERT MT BLK 1
Series: 637  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 34.92mm x 12.70mm  ·  Height: 1" (25.4mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 6W @ 76°C  ·  Thermal Resistance @ Forced Air Flow: 5.8°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 12.7°C/W
from 0,84
from 2,31		Additional information
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528-45AB-MS4528-45AB-MS4Wakefield Thermal SolutionsHEATSINK BXB50,75,100,150.45"VRT
Series: 528  ·  Package Cooled: Half Brick DC/DC Converter  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 61.00mm x 57.90mm  ·  Height: 0.45" (11.43mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 7W @ 60°C  ·  Thermal Resistance @ Forced Air Flow: 3.2°C/W @ 300 LFM
from 6,94Additional information
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290-2AB290-2ABWakefield Thermal SolutionsHEATSINK TO-220 DUAL MNT BLK
Series: 290  ·  Package Cooled: TO-218, TO-202, TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 30.00mm x 25.40mm  ·  Height: 0.5" (12.7mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 44°C  ·  Thermal Resistance @ Forced Air Flow: 35.0°C/W @ 400 LFM  ·  Thermal Resistance @ Natural: 22°C/W
from 0,22
from 0,60		Additional information
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695-1B695-1BWakefield Thermal SolutionsHEATSINK FOR STUD MT DIODE BLACK
Series: 695  ·  Package Cooled: Stud Mounted Diode  ·  Attachment Method: Bolt On  ·  Outline: 33.80mm Dia  ·  Height: 0.531" (13.49mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 4W @ 72°C  ·  Thermal Resistance @ Forced Air Flow: 5.2°C/W @ 400 LFM  ·  Thermal Resistance @ Natural: 18°C/W
from 0,73
from 2,00		Additional information
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628-65AB628-65ABWakefield Thermal SolutionsHEATSINK CPU 43MM SQ BLK H=.65
Series: 628  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Not Included)  ·  Outline: 44.45mm x 43.18mm  ·  Height: 0.65" (16.5mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 4.5W @ 30°C  ·  Thermal Resistance @ Forced Air Flow: 1.5°C/W @ 400 LFM
from 1,00
from 2,40		Additional information
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630-45ABWakefield Thermal SolutionsHEATSINK FOR BGAS FIN HGT .45
Series: 630  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Not Included)  ·  Outline: 35.00mm x 35.00mm  ·  Height: 0.45" (11.43mm)  ·  Material: Aluminum  ·  Thermal Resistance @ Forced Air Flow: 4°C/W @ 400 LFM
from 1,26Additional information
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528-24AB-MS4Wakefield Thermal SolutionsHEATSINK BXB50,75,100,150.24"VRT
Series: 528  ·  Package Cooled: Half Brick DC/DC Converter  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 61.00mm x 57.90mm  ·  Height: 0.24" (6.10mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 5W @ 60°C  ·  Thermal Resistance @ Forced Air Flow: 5.8°C/W @ 300 LFM
from 6,80Additional information
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677-20ABPWakefield Thermal SolutionsHEATSINK MULTIWATT 2.0" BLK
Series: 677  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 41.91mm x 25.40mm  ·  Height: 2" (50.8mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 6W @ 58°C  ·  Thermal Resistance @ Forced Air Flow: 4.7°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 6.7°C/W
from 1,49Additional information
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658-35AB658-35ABWakefield Thermal SolutionsHEATSINK CPU 28MM SQBLK W/O TAPE
Series: 658  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Not Included)  ·  Outline: 27.94mm x 27.94mm  ·  Height: 0.35" (9mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 50°C  ·  Thermal Resistance @ Forced Air Flow: 8.0°C/W @ 200 LFM
from 0,60
from 1,65		Additional information
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262-75AB-01Wakefield Thermal SolutionsHEATSINK VERT/HORIZ BLACK TO-220
Series: 262  ·  Package Cooled: TO-220  ·  Attachment Method: Press Fit and PC Pin  ·  Outline: 13.46mm x 12.70mm  ·  Height: 0.75" (19.05mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 3W @ 80°C  ·  Thermal Resistance @ Forced Air Flow: 10.0°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 26.7°C/W
from 0,37Additional information
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667-10ABSPWakefield Thermal SolutionsHEATSINK TO-220 W/S/O PINS BLK
Series: 667  ·  Package Cooled: TO-220  ·  Attachment Method: Clip and PC Pin  ·  Outline: 34.92mm x 12.70mm  ·  Height: 1" (25.4mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 6W @ 76°C  ·  Thermal Resistance @ Forced Air Flow: 5.8°C/W @ 200 LFM
from 1,90Additional information
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658-60ABT2658-60ABT2Wakefield Thermal SolutionsHEATSINK CPU 28MM SQ BLK W/TAPE
Series: 658  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 27.94mm x 27.94mm  ·  Height: 0.6" (15.24mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2.5W @ 30°C  ·  Thermal Resistance @ Forced Air Flow: 3°C/W @ 300 LFM
Additional information
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657-20ABP657-20ABPWakefield Thermal SolutionsHEATSINK TO-220 W/PINS BLK 2
Series: 657  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 41.91mm x 25.40mm  ·  Height: 2" (50.8mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 6W @ 32°C  ·  Thermal Resistance @ Forced Air Flow: 2.9°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 5.3°C/W
from 1,08
from 2,98		Additional information
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258Wakefield Thermal Solutions.5X.25X.34 HEATSINK FOR DIODE
Series: 258  ·  Attachment Method: Thermal Tape, Adhesive (Not Included)  ·  Outline: 12.70mm x 6.35mm  ·  Height: 0.34" (8.64mm)  ·  Material: Aluminum
from 20,98Additional information
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634-20ABP634-20ABPWakefield Thermal SolutionsHEATSINK TO-220 VERT MT BLK 2.0
Series: 634  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 16.25mm x 16.25mm  ·  Height: 2" (50.8mm)  ·  Material: Aluminum
from 1,11
from 3,05		Additional information
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206-1PABH206-1PABHWakefield Thermal SolutionsHEATSINK VERT ALUM BLK TO-220
Series: 206  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 25.40mm x 12.70mm  ·  Height: 1.18" (29.97mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 4W @ 56°C  ·  Thermal Resistance @ Natural: 14°C/W
from 0,23
from 0,63		Additional information
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235-85AB235-85ABWakefield Thermal SolutionsHEATSINK TO-220 CLIP-ON BLK
Series: 235  ·  Package Cooled: TO-220  ·  Attachment Method: Clip  ·  Outline: 25.40mm x 12.70mm  ·  Height: 0.85" (21.59mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 40°C  ·  Thermal Resistance @ Forced Air Flow: 6.8°C/W @ 400 LFM  ·  Thermal Resistance @ Natural: 20°C/W
from 0,24
from 0,67		Additional information
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624-25ABT4E624-25ABT4EWakefield Thermal SolutionsHEATSINK CPU 21MM SQ W/DBL TAPE
Series: 624  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 21.00mm x 21.00mm  ·  Height: 0.25" (6.35mm)  ·  Material: Aluminum  ·  Thermal Resistance @ Forced Air Flow: 20°C/W @ 350 LFM
from 1,18
from 2,82		Additional information
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233-60AB-10Wakefield Thermal SolutionsHEATSINK TO-220 VERT BLK W/TABS
Series: 233  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On  ·  Outline: 14.48mm x 12.70mm  ·  Height: 0.725" (18.415mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 58°C  ·  Thermal Resistance @ Forced Air Flow: 11.0°C/W @ 400 LFM  ·  Thermal Resistance @ Natural: 29°C/W
from 0,33Additional information
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243-3PAB243-3PABWakefield Thermal SolutionsHEATSINK TO-220 CLIP-ON BLK
Series: 243  ·  Package Cooled: TO-220  ·  Attachment Method: Clip  ·  Outline: 20.32mm x 6.86mm  ·  Height: 0.8" (20.32mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 78°C  ·  Thermal Resistance @ Forced Air Flow: 8.2°C/W @ 400 LFM  ·  Thermal Resistance @ Natural: 39°C/W
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642-35ABT3Wakefield Thermal SolutionsHEAT SINK WITH THERMAL TAPE
Series: 642  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 35.00mm x 35.00mm  ·  Height: 0.35" (9mm)  ·  Material: Aluminum
from 1,84Additional information
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625-45AB625-45ABWakefield Thermal SolutionsHEATSINK CPU 25MM SQ H=.45" BLK
Series: 625  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Not Included)  ·  Outline: 25.00mm x 25.00mm  ·  Height: 0.45" (11.43mm)  ·  Material: Aluminum  ·  Thermal Resistance @ Forced Air Flow: 15.0°C/W @ 200 LFM
from 0,84
from 2,31		Additional information
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637-20ABP637-20ABPWakefield Thermal SolutionsHEATSINK TO-220 VERT MT BLK 2
Series: 637  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 34.92mm x 12.70mm  ·  Height: 2" (50.8mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 6W @ 55°C  ·  Thermal Resistance @ Forced Air Flow: 4.7°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 9.2°C/W
from 1,03
from 2,84		Additional information
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625-25ABT4625-25ABT4Wakefield Thermal SolutionsHEATSINK CPU 25MM SQ W/DBL TAPE
Series: 625  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 25.00mm x 25.00mm  ·  Height: 0.25" (6.35mm)  ·  Material: Aluminum  ·  Thermal Resistance @ Forced Air Flow: 12°C/W @ 500 LFM
from 1,35
from 3,71		Additional information
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