Fans, Thermal Management  ·  Heat Sinks

658-60AB — HEATSINK CPU 28MM SQ BLK W/OTAPE

Manufacturer	Wakefield Thermal Solutions
Harmful substances	RoHS   Lead-free
Series	658
Package Cooled	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method	Thermal Tape, Adhesive (Not Included)
Outline	27.94mm x 27.94mm
Height	0.6" (15.24mm)
Material	Aluminum
Power Dissipation @ Temperature Rise	2.5W @ 30°C
Thermal Resistance @ Forced Air Flow	3°C/W @ 300 LFM
Found under name	345-1072