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630-45AB — HEATSINK FOR BGAS FIN HGT .45
Manufacturer | Wakefield Thermal Solutions |
Harmful substances | RoHS Lead-free |
| Series | 630 |
Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method | Thermal Tape, Adhesive (Not Included) |
Outline | 35.00mm x 35.00mm |
Height | 0.45" (11.43mm) |
Material | Aluminum |
Thermal Resistance @ Forced Air Flow | 4°C/W @ 400 LFM |
Found under name | Q3229789 |
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