560631-2 — 19X19 INTERST.296 POS.HEAT SNK
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| Photo | Name | Manufacturer | Technical parameters | Prices (rub.) | Buy |
| 5-1542000-6 | Tyco Electronics | HEAT SINK 25MM BGA 2 FIN RADIAL Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) · Attachment Method: Clip · Outline: 25.00mm Dia · Height: 0.357" (9.06mm) · Material: Aluminum · Thermal Resistance @ Forced Air Flow: 8.0°C/W @ 200 LFM | from 11,72 | Additional information Find at suppliers | |
| 7-1542006-8 | Tyco Electronics | HTS804-U=29MM HS ASSY ULTEM CL Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) · Attachment Method: Clip · Outline: 50.80mm Dia · Height: 0.89" (22.65mm) · Material: Aluminum · Thermal Resistance @ Forced Air Flow: 1.5°C/W @ 400 LFM | from 21,83 | Additional information Find at suppliers | |
| 2-1542006-2 | Tyco Electronics | HEATSINK BGA 5 FIN RADIAL Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) · Attachment Method: Clip · Outline: 34.93mm Dia · Height: 0.678" (17.22mm) · Material: Aluminum · Thermal Resistance @ Forced Air Flow: 4.4°C/W @ 200 LFM · Thermal Resistance @ Natural: 9.9°C/W | from 13,76 | Additional information Find at suppliers | |
| 2-1542003-2 | Tyco Electronics | HEAT SINK BGA 23MM Attachment Method: Clip · Outline: 34.93mm Dia · Height: 0.357" (9.06mm) · Material: Aluminum · Thermal Resistance @ Forced Air Flow: 7.2°C/W @ 200 LFM · Thermal Resistance @ Natural: 13.4°C/W | from 15,41 | Additional information Find at suppliers | |
| 9-1542003-0 | Tyco Electronics | HEAT SINK BGA BLACK ALUMINUM Attachment Method: Clip · Outline: 34.93mm Dia · Material: Aluminum · Thermal Resistance @ Forced Air Flow: 5.7°C/W @ 200 LFM · Thermal Resistance @ Natural: 11°C/W | from 13,26 | Additional information Find at suppliers |
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