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Fans, Thermal Management  ·  Heat Sinks
 

530600B00000 — BOARD LEVEL HEAT SINK

ManufacturerAavid Thermalloy
MaterialAluminum
Found under name001720
Analogous by characteristics
PhotoNameManufacturerTechnical parametersPrices (rub.)Buy
590102B03600G590102B03600GAavid ThermalloyHEATSINK TO-220 W/TABS 1.67"HIGH
Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 25.40mm x 25.40mm  ·  Height: 1.675" (42.54mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2.5W @ 30°C  ·  Thermal Resistance @ Forced Air Flow: 4°C/W @ 300 LFM  ·  Thermal Resistance @ Natural: 10°C/W
from 0,57Additional information
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574204B00000G574204B00000GAavid ThermalloyHEATSINK TO-202 CLIP-ON 5W
Package Cooled: TO-202  ·  Attachment Method: Clip  ·  Outline: 25.91mm x 10.67mm  ·  Height: 0.9" (22.86mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 1W @ 20°C  ·  Thermal Resistance @ Forced Air Flow: 8.0°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 16.8°C/W
from 0,44Additional information
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574402B03200G574402B03200GAavid ThermalloyHEATSINK TO220 HOR MNT W/TAB.75
Package Cooled: TO-220  ·  Attachment Method: Clip and PC Pin  ·  Outline: 21.84mm x 10.03mm  ·  Height: 0.75" (19.05mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 3W @ 60°C  ·  Thermal Resistance @ Forced Air Flow: 12.0°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 23.2°C/W
from 0,38
from 0,74		Additional information
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530101B00150530101B00150Aavid ThermalloyHEATSINK 1.75" HI RISE TO-218
Package Cooled: TO-218  ·  Attachment Method: Clip  ·  Outline: 44.45mm x 12.45mm  ·  Height: 1.75" (44.45mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 4W @ 30°C  ·  Thermal Resistance @ Forced Air Flow: 1.5°C/W @ 400 LFM  ·  Thermal Resistance @ Natural: 6.3°C/W
from 0,97
from 1,91		Additional information
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533501B02552GAavid ThermalloyBOARD LEVEL HEAT SINK
Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 41.91mm x 25.40mm  ·  Height: 1.5" (38.1mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 6W @ 30°C  ·  Thermal Resistance @ Forced Air Flow: 1.5°C/W @ 500 LFM
from 1,65Additional information
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6237B-1GAavid ThermalloyBOARD LEVEL HEAT SINK
Package Cooled: TO-220  ·  Attachment Method: Clip  ·  Outline: 22.86mm x 9.52mm  ·  Height: 0.7" (17.8mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 50°C  ·  Thermal Resistance @ Forced Air Flow: 14.0°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 25°C/W
from 0,54Additional information
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322400B00000G322400B00000GAavid ThermalloyHEAT SINK TO-18,TO-92 1W BLK
Package Cooled: TO-18  ·  Attachment Method: Press Fit  ·  Outline: 12.70mm Dia  ·  Height: 0.235" (5.969mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 0.6W @ 60°C  ·  Thermal Resistance @ Forced Air Flow: 30°C/W @ 500 LFM  ·  Thermal Resistance @ Natural: 100°C/W
from 0,66
from 1,30		Additional information
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6239B-MTGAavid ThermalloyBOARD LEVEL HEAT SINK
Package Cooled: TO-220  ·  Attachment Method: Clip  ·  Outline: 25.53mm x 15.49mm  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 40°C  ·  Thermal Resistance @ Forced Air Flow: 6°C/W @ 600 LFM  ·  Thermal Resistance @ Natural: 13.6°C/W
from 1,38Additional information
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575803B00000GAavid ThermalloyBOARD LEVEL HEAT SINK
Package Cooled: TO-3  ·  Attachment Method: Bolt On  ·  Outline: 41.40mm x 32.77mm  ·  Height: 1" (25.4mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 5W @ 50°C  ·  Thermal Resistance @ Forced Air Flow: 3.5°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 11°C/W
from 1,37Additional information
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574402B00000GAavid ThermalloyBOARD LEVEL HEAT SINK
Package Cooled: TO-220  ·  Attachment Method: Clip  ·  Outline: 21.84mm x 10.03mm  ·  Height: 0.75" (19.05mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 3W @ 60°C  ·  Thermal Resistance @ Forced Air Flow: 6°C/W @ 600 LFM  ·  Thermal Resistance @ Natural: 23.2°C/W
from 0,36Additional information
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581202B02500581202B02500Aavid ThermalloyHEATSINK TO-220 2.5W BLK W/PINS
Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 16.25mm x 16.25mm  ·  Height: 2" (50.8mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 1.5W @ 20°C  ·  Thermal Resistance @ Forced Air Flow: 4°C/W @ 300 LFM  ·  Thermal Resistance @ Natural: 12.8°C/W
from 1,20
from 1,99		Additional information
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533002B02551GAavid ThermalloyBOARD LEVEL HEAT SINK
Package Cooled: TO-218, TO-247  ·  Attachment Method: Clip and PC Pin  ·  Outline: 34.92mm x 12.70mm  ·  Height: 1" (25.4mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 30°C  ·  Thermal Resistance @ Forced Air Flow: 4°C/W @ 400 LFM  ·  Thermal Resistance @ Natural: 13°C/W
from 1,13Additional information
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574102B03700GAavid ThermalloyBOARD LEVEL HEAT SINK
Package Cooled: TO-220  ·  Attachment Method: Clip and PC Pin  ·  Outline: 21.84mm x 10.03mm  ·  Height: 0.75" (19.05mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 50°C  ·  Thermal Resistance @ Forced Air Flow: 8°C/W @ 500 LFM  ·  Thermal Resistance @ Natural: 23.2°C/W
from 1,02Additional information
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533002B02500GAavid ThermalloyBOARD LEVEL HEAT SINK
Package Cooled: TO-218, TO-247  ·  Attachment Method: Clip and PC Pin  ·  Outline: 34.92mm x 12.70mm  ·  Height: 1" (25.4mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 30°C  ·  Thermal Resistance @ Forced Air Flow: 4°C/W @ 400 LFM
from 0,88Additional information
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505403B00400GAavid ThermalloyBOARD LEVEL HEAT SINK
Package Cooled: TO-3  ·  Attachment Method: Bolt On  ·  Outline: 45.21mm x 45.21mm  ·  Height: 1.25" (31.75mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 7W @ 40°C  ·  Thermal Resistance @ Forced Air Flow: 1.5°C/W @ 600 LFM
from 2,92Additional information
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574102B00000G574102B00000GAavid ThermalloyHEATSINK TO-220 CLIP-ON BLK
Package Cooled: TO-220  ·  Attachment Method: Clip  ·  Outline: 21.84mm x 10.03mm  ·  Height: 0.75" (19.05mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 1.5W @ 40°C  ·  Thermal Resistance @ Forced Air Flow: 8°C/W @ 500 LFM  ·  Thermal Resistance @ Natural: 23.2°C/W
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from 0,40		Additional information
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575703B00300GAavid ThermalloyBOARD LEVEL HEAT SINK
Package Cooled: TO-3  ·  Attachment Method: Bolt On  ·  Outline: 41.40mm x 32.77mm  ·  Height: 0.75" (19.05mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 30°C  ·  Thermal Resistance @ Forced Air Flow: 4.0°C/W @ 200 LFM
from 2,68Additional information
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577202B03900GAavid ThermalloyBOARD LEVEL HEAT SINK
Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 13.20mm x 12.70mm  ·  Height: 0.75" (19.05mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 1.5W @ 40°C  ·  Thermal Resistance @ Forced Air Flow: 10.0°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 24.4°C/W
from 0,35Additional information
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531102B02500G531102B02500GAavid ThermalloyHEATSINK TO-220 W/PINS 1.5"TALL
Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 34.92mm x 12.70mm  ·  Height: 1.5" (38.1mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 7W @ 70°C  ·  Thermal Resistance @ Forced Air Flow: 3°C/W @ 500 LFM  ·  Thermal Resistance @ Natural: 10.4°C/W
from 0,70
from 1,37		Additional information
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594302B02853594302B02853Aavid ThermalloyHEATSINK TO-220 W/KOOL CLIP BLK
Package Cooled: TO-220  ·  Attachment Method: Clip and PC Pin  ·  Outline: 35.05mm x 12.20mm  ·  Height: 2" (50.8mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 6W @ 60°C  ·  Thermal Resistance @ Forced Air Flow: 3°C/W @ 500 LFM
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from 1,40		Additional information
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568322B00000568322B00000Aavid ThermalloyHEATSINK FOR(2) TO-220 BLK 1.25
Package Cooled: TO-220 (Dual)  ·  Attachment Method: Bolt On  ·  Outline: 45.97mm x 45.97mm  ·  Height: 1.25" (31.75mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 5W @ 30°C  ·  Thermal Resistance @ Forced Air Flow: 2.5°C/W @ 200 LFM
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579103U00000Aavid ThermalloyHEATSINK TO-3 WHITE .87
Package Cooled: TO-3  ·  Attachment Method: Bolt On  ·  Outline: 39.12mm x 28.57mm  ·  Height: 0.87" (22.10mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2.5W @ 40°C  ·  Thermal Resistance @ Forced Air Flow: 4°C/W @ 600 LFM
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574004B00000G574004B00000GAavid ThermalloyHEATSINK TO-202 CLIP-ON .58" BK
Package Cooled: TO-202  ·  Attachment Method: Clip  ·  Outline: 20.32mm x 6.35mm  ·  Height: 0.58" (14.73mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 1W @ 30°C  ·  Thermal Resistance @ Forced Air Flow: 4°C/W @ 600 LFM  ·  Thermal Resistance @ Natural: 28°C/W
from 0,40Additional information
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375024B00032G375024B00032GAavid ThermalloyHEATSINK BGA W/ADHESIVE TAPE
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 40.00mm x 40.00mm  ·  Height: 0.709" (18mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 30°C  ·  Thermal Resistance @ Forced Air Flow: 4.3°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 12°C/W
from 2,57
from 5,04		Additional information
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593202B03400GAavid ThermalloyBOARD LEVEL HEAT SINK
Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 35.05mm x 12.20mm  ·  Height: 2" (50.8mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 6W @ 60°C  ·  Thermal Resistance @ Forced Air Flow: 4°C/W @ 300 LFM  ·  Thermal Resistance @ Natural: 10.4°C/W
from 0,65Additional information
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