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Fans, Thermal Management  ·  Heat Sinks
 

5079-72 — HEAT SINK EXTRUSION 6 FOOT

ManufacturerWakefield Thermal Solutions
Harmful substancesRoHS   Lead-free
Found under nameQ4125634
Analogous by characteristics
PhotoNameManufacturerTechnical parametersPrices (rub.)Buy
287-1ABH287-1ABHWakefield Thermal SolutionsHEATSINK VERT MT HOLE BLK TO-220
Series: 287  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 25.40mm x 12.70mm  ·  Height: 1.18" (29.97mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 4W @ 65°C  ·  Thermal Resistance @ Forced Air Flow: 7.8°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 16.2°C/W
from 0,69Additional information
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537-95ABWakefield Thermal SolutionsHEATSINK DC DC 1/4 BRICK VERT
Series: 537  ·  Attachment Method: Bolt On  ·  Outline: 57.91mm x 36.83mm  ·  Height: 0.95" (24.13mm)  ·  Material: Aluminum  ·  Thermal Resistance @ Forced Air Flow: 2.1°C/W @ 300 LFM
from 3,64Additional information
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658-45ABT2Wakefield Thermal SolutionsHEATSINK CPU 28MM SQ BLK W/TAPE
Series: 658  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 27.94mm x 27.94mm  ·  Height: 0.45" (11.43mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 3W @ 50°C  ·  Thermal Resistance @ Forced Air Flow: 6.0°C/W @ 200 LFM
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291-H36AB291-H36ABWakefield Thermal SolutionsHEATSINK TO-220 CLIP-ON BLK
Series: 291  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On  ·  Outline: 27.94mm x 9.14mm  ·  Height: 0.86" (21.84mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 68°C  ·  Thermal Resistance @ Forced Air Flow: 16.0°C/W @ 600 LFM  ·  Thermal Resistance @ Natural: 34°C/W
from 0,32
from 0,88		Additional information
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624-45ABWakefield Thermal SolutionsHEATSINK CPU 21MM SQ W/OUT ADH
Series: 624  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Not Included)  ·  Outline: 21.00mm x 21.00mm  ·  Height: 0.45" (11.43mm)  ·  Material: Aluminum
from 1,20Additional information
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265-118ABH-22Wakefield Thermal SolutionsHEATSINK VERT ALUM BLACK TO-220
Series: 265  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 25.40mm x 12.70mm  ·  Height: 1.18" (29.97mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 4W @ 56°C  ·  Thermal Resistance @ Forced Air Flow: 7.0°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 14°C/W
from 0,23Additional information
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658-35ABT3658-35ABT3Wakefield Thermal SolutionsHEATSINK CPU 28MM SQ BLK W/TAPE
Series: 658  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 27.94mm x 27.94mm  ·  Height: 0.35" (9mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 50°C
from 1,36
from 3,27		Additional information
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630-45ABWakefield Thermal SolutionsHEATSINK FOR BGAS FIN HGT .45
Series: 630  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Not Included)  ·  Outline: 35.00mm x 35.00mm  ·  Height: 0.45" (11.43mm)  ·  Material: Aluminum  ·  Thermal Resistance @ Forced Air Flow: 4°C/W @ 400 LFM
from 1,26Additional information
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624-35ABT4Wakefield Thermal SolutionsHEATSINK CPU 25MM SQUARE W/TAPE
Series: 624  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 25.00mm x 25.00mm  ·  Height: 0.35" (9mm)  ·  Material: Aluminum
from 2,00Additional information
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658-60ABT1658-60ABT1Wakefield Thermal SolutionsHEATSINK CPU 28MM SQ BLK W/TAPE
Series: 658  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 27.94mm x 27.94mm  ·  Height: 0.6" (15.24mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2.5W @ 30°C  ·  Thermal Resistance @ Forced Air Flow: 3°C/W @ 300 LFM
from 1,36
from 3,27		Additional information
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634-20ABP634-20ABPWakefield Thermal SolutionsHEATSINK TO-220 VERT MT BLK 2.0
Series: 634  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 16.25mm x 16.25mm  ·  Height: 2" (50.8mm)  ·  Material: Aluminum
from 1,11
from 3,05		Additional information
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274-2AB274-2ABWakefield Thermal SolutionsHEATSINK LOW HEIGHT BLK TO-220
Series: 274  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On  ·  Outline: 19.05mm x 12.70mm  ·  Height: 0.5" (12.7mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 50°C  ·  Thermal Resistance @ Forced Air Flow: 7.0°C/W @ 400 LFM  ·  Thermal Resistance @ Natural: 25°C/W
from 0,13
from 0,35		Additional information
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624-45ABT3624-45ABT3Wakefield Thermal SolutionsHEATSINK CPU 21MM SQ W/ADH BLK
Series: 624  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 21.00mm x 21.00mm  ·  Height: 0.45" (11.43mm)  ·  Material: Aluminum  ·  Thermal Resistance @ Forced Air Flow: 15.0°C/W @ 200 LFM
from 1,20
from 3,29		Additional information
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641K641KWakefield Thermal SolutionsHEATSINK TO-3 HORZ MT NO HOLES
Series: 641  ·  Package Cooled: TO-3  ·  Attachment Method: Bolt On  ·  Outline: 104.77mm x 76.20mm  ·  Height: 1" (25.4mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 15W @ 36°C  ·  Thermal Resistance @ Forced Air Flow: 0.9°C/W @ 250 LFM  ·  Thermal Resistance @ Natural: 2.4°C/W
from 4,54
from 10,89		Additional information
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527-24AB-MS4Wakefield Thermal SolutionsHEATSINK BXB50,75,100,150.24"HRZ
Series: 527  ·  Package Cooled: Half Brick DC/DC Converter  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 60.96mm x 57.91mm  ·  Height: 0.24" (6.10mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 5W @ 60°C  ·  Thermal Resistance @ Forced Air Flow: 5.8°C/W @ 300 LFM
from 6,44Additional information
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625-25ABT-4EWakefield Thermal SolutionsBGA HEATSINK 25MM
Series: 625  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Not Included)  ·  Outline: 25.00mm x 25.00mm  ·  Height: 0.25" (6.35mm)  ·  Material: Aluminum
from 1,33Additional information
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695-1B695-1BWakefield Thermal SolutionsHEATSINK FOR STUD MT DIODE BLACK
Series: 695  ·  Package Cooled: Stud Mounted Diode  ·  Attachment Method: Bolt On  ·  Outline: 33.80mm Dia  ·  Height: 0.531" (13.49mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 4W @ 72°C  ·  Thermal Resistance @ Forced Air Flow: 5.2°C/W @ 400 LFM  ·  Thermal Resistance @ Natural: 18°C/W
from 0,73
from 2,00		Additional information
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624-45AB-T4EWakefield Thermal SolutionsHEATSINK CPU 21MM SQ
Series: 624  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: SMD Pad  ·  Outline: 21.00mm x 21.00mm  ·  Height: 0.45" (11.43mm)  ·  Material: Aluminum
from 1,95Additional information
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658-25AB658-25ABWakefield Thermal SolutionsHEATSINK CPU 28MM SQ BLK
Series: 658  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Not Included)  ·  Outline: 27.94mm x 27.94mm  ·  Height: 0.25" (6.35mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 40°C  ·  Thermal Resistance @ Forced Air Flow: 5°C/W @ 500 LFM
from 0,57
from 1,58		Additional information
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290-1AB290-1ABWakefield Thermal SolutionsHEATSINK TO-220 VERT/HORZ BLK
Series: 290  ·  Package Cooled: TO-218, TO-202, TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 30.00mm x 25.40mm  ·  Height: 0.5" (12.7mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 44°C  ·  Thermal Resistance @ Forced Air Flow: 35.0°C/W @ 400 LFM  ·  Thermal Resistance @ Natural: 22°C/W
from 0,22
from 0,60		Additional information
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658-25ABT2658-25ABT2Wakefield Thermal SolutionsHEATSINK CPU 28MM SQ BLK W/TAPE
Series: 658  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 27.94mm x 27.94mm  ·  Height: 0.25" (6.35mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 4W @ 70°C  ·  Thermal Resistance @ Forced Air Flow: 5°C/W @ 500 LFM
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658-60ABT4E658-60ABT4EWakefield Thermal SolutionsHEATSINK CPU 27.9MM SQ W/ADH BLK
Series: 658  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 27.94mm x 27.94mm  ·  Height: 0.6" (15.24mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2.5W @ 30°C  ·  Thermal Resistance @ Forced Air Flow: 3°C/W @ 300 LFM
from 1,53
from 4,20		Additional information
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609-50ABS3609-50ABS3Wakefield Thermal SolutionsHEATSINK FOR POWERPC CPU BLK
Series: 609  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Clip  ·  Outline: 73.53mm x 50.80mm  ·  Height: 0.5" (12.7mm)  ·  Material: Aluminum  ·  Thermal Resistance @ Forced Air Flow: 2°C/W @ 400 LFM
from 4,44
from 10,65		Additional information
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260-4TH5EWakefield Thermal SolutionsCUP CLIP TRANSISTOR C3488 REV H
Series: 260  ·  Package Cooled: TO-5  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 9.40mm x 9.40mm  ·  Height: 0.4" (10.16mm)  ·  Material: Beryllium Copper
from 12,06Additional information
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528-45AB528-45ABWakefield Thermal SolutionsHEATSINK DC/DC HALF BRICK VERT
Series: 528  ·  Package Cooled: Half Brick DC/DC Converter  ·  Attachment Method: Bolt On  ·  Outline: 61.00mm x 57.90mm  ·  Height: 0.45" (11.43mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 7W @ 60°C  ·  Thermal Resistance @ Forced Air Flow: 3.2°C/W @ 300 LFM
from 1,41
from 3,39		Additional information
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