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Fans, Thermal Management  ·  Heat Sinks
 

506103B00000 — BOARD LEVEL HEAT SINK

ManufacturerAavid Thermalloy
Found under name035908
Analogous by characteristics
PhotoNameManufacturerTechnical parametersPrices (rub.)Buy
574204B00000G574204B00000GAavid ThermalloyHEATSINK TO-202 CLIP-ON 5W
Package Cooled: TO-202  ·  Attachment Method: Clip  ·  Outline: 25.91mm x 10.67mm  ·  Height: 0.9" (22.86mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 1W @ 20°C  ·  Thermal Resistance @ Forced Air Flow: 8.0°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 16.8°C/W
from 0,44Additional information
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7138DGAavid ThermalloyBOARD LEVEL HEAT SINK
Package Cooled: TO-220  ·  Attachment Method: Clip and PC Pin  ·  Outline: 25.53mm x 15.49mm  ·  Height: 1.02" (26mm)  ·  Material: Copper  ·  Power Dissipation @ Temperature Rise: 1.5W @ 40°C  ·  Thermal Resistance @ Forced Air Flow: 5°C/W @ 500 LFM  ·  Thermal Resistance @ Natural: 20°C/W
from 1,39Additional information
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6237B-1GAavid ThermalloyBOARD LEVEL HEAT SINK
Package Cooled: TO-220  ·  Attachment Method: Clip  ·  Outline: 22.86mm x 9.52mm  ·  Height: 0.7" (17.8mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 50°C  ·  Thermal Resistance @ Forced Air Flow: 14.0°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 25°C/W
from 0,54Additional information
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192035B00000192035B00000Aavid ThermalloyHEATSINK W/TO-3 EXTRUSIONfrom 7,28
from 10,41		Additional information
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577202B03900GAavid ThermalloyBOARD LEVEL HEAT SINK
Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 13.20mm x 12.70mm  ·  Height: 0.75" (19.05mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 1.5W @ 40°C  ·  Thermal Resistance @ Forced Air Flow: 10.0°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 24.4°C/W
from 0,35Additional information
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594302B02853594302B02853Aavid ThermalloyHEATSINK TO-220 W/KOOL CLIP BLK
Package Cooled: TO-220  ·  Attachment Method: Clip and PC Pin  ·  Outline: 35.05mm x 12.20mm  ·  Height: 2" (50.8mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 6W @ 60°C  ·  Thermal Resistance @ Forced Air Flow: 3°C/W @ 500 LFM
from 0,72
from 1,40		Additional information
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2289BAavid ThermalloyBOARD LEVEL HEAT SINKfrom 6,58Additional information
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375024B00032G375024B00032GAavid ThermalloyHEATSINK BGA W/ADHESIVE TAPE
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 40.00mm x 40.00mm  ·  Height: 0.709" (18mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 30°C  ·  Thermal Resistance @ Forced Air Flow: 4.3°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 12°C/W
from 2,57
from 5,04		Additional information
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372924M02000G372924M02000GAavid ThermalloyHEATSINK BGA W/PUSH PINS
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Push Pin  ·  Outline: 37.40mm x 37.40mm  ·  Height: 0.24" (6.10mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 1.5W @ 50°C  ·  Thermal Resistance @ Forced Air Flow: 10.0°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 32.6°C/W
from 2,55
from 5,00		Additional information
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513201B02500G513201B02500GAavid ThermalloyHEATSINK TO-218 W/PINS 2" TALL
Package Cooled: TO-218  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 34.92mm x 12.70mm  ·  Height: 2" (50.8mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 20°C  ·  Thermal Resistance @ Forced Air Flow: 3°C/W @ 400 LFM  ·  Thermal Resistance @ Natural: 8.3°C/W
from 0,69
from 1,35		Additional information
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533402B02552GAavid ThermalloyBOARD LEVEL HEAT SINK
Package Cooled: TO-220  ·  Attachment Method: Clip and PC Pin  ·  Outline: 41.91mm x 25.40mm  ·  Height: 1.5" (38.1mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 8W @ 40°C  ·  Thermal Resistance @ Forced Air Flow: 2.0°C/W @ 500 LFM  ·  Thermal Resistance @ Natural: 5°C/W
from 1,68Additional information
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594302B00000GAavid ThermalloyBOARD LEVEL HEAT SINKfrom 0,81Additional information
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6021BGAavid ThermalloyBOARD LEVEL HEAT SINK
Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 25.40mm x 12.70mm  ·  Height: 1.18" (29.97mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 30°C  ·  Thermal Resistance @ Forced Air Flow: 5°C/W @ 500 LFM  ·  Thermal Resistance @ Natural: 12.5°C/W
from 0,68Additional information
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530401B00150GAavid ThermalloyBOARD LEVEL HEAT SINK
Package Cooled: TO-218, TO-247  ·  Attachment Method: Clip  ·  Outline: 44.45mm x 12.45mm  ·  Height: 1.75" (44.45mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 4W @ 30°C  ·  Thermal Resistance @ Forced Air Flow: 2°C/W @ 400 LFM  ·  Thermal Resistance @ Natural: 6.3°C/W
from 2,11Additional information
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534002B02554GAavid ThermalloyBOARD LEVEL HEAT SINK
Package Cooled: TO-220  ·  Attachment Method: Clip and PC Pin  ·  Outline: 34.93mm x 12.70mm  ·  Height: 2" (50.8mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 30°C  ·  Thermal Resistance @ Forced Air Flow: 5°C/W @ 400 LFM  ·  Thermal Resistance @ Natural: 9°C/W
from 1,25Additional information
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581202B00000Aavid ThermalloyBOARD LEVEL HEAT SINK
Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 16.25mm x 16.25mm  ·  Height: 2" (50.8mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 1.5W @ 20°C  ·  Thermal Resistance @ Forced Air Flow: 4°C/W @ 300 LFM
from 1,01Additional information
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322605C00000322605C00000Aavid ThermalloyHEATSINK TO-5 1.25W H=.25 GOLD
Package Cooled: TO-5  ·  Attachment Method: Press Fit  ·  Outline: 19.05mm Dia  ·  Height: 0.25" (6.35mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 1W @ 60°C  ·  Thermal Resistance @ Forced Air Flow: 25°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 54°C/W
from 1,29
from 2,52		Additional information
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574902B03300G574902B03300GAavid ThermalloyHEATSINK TO-220 VERT MNT W/TAB
Package Cooled: TO-220  ·  Attachment Method: Clip and PC Pin  ·  Outline: 21.84mm x 10.03mm  ·  Height: 1.375" (34.93mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2.5W @ 40°C  ·  Thermal Resistance @ Forced Air Flow: 6.0°C/W @ 400 LFM  ·  Thermal Resistance @ Natural: 16°C/W
from 0,38
from 0,75		Additional information
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6084BGAavid ThermalloyBOARD LEVEL HEAT SINK
Package Cooled: TO-220  ·  Attachment Method: Bolt On  ·  Outline: 13.21mm x 8.38mm  ·  Height: 0.75" (19.05mm)  ·  Power Dissipation @ Temperature Rise: 1W @ 30°C  ·  Thermal Resistance @ Forced Air Flow: 7°C/W @ 300 LFM  ·  Thermal Resistance @ Natural: 22.5°C/W
from 1,04Additional information
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2263RAavid ThermalloyBOARD LEVEL HEAT SINKfrom 4,67Additional information
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7019BGAavid ThermalloyBOARD LEVEL HEAT SINK
Package Cooled: TO-220  ·  Attachment Method: Bolt On  ·  Outline: 39.37mm x 9.52mm  ·  Height: 1" (25.4mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 3W @ 40°C  ·  Thermal Resistance @ Forced Air Flow: 5°C/W @ 400 LFM  ·  Thermal Resistance @ Natural: 11°C/W
from 0,42Additional information
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321127C00000321127C00000Aavid ThermalloyHEATSINK TO-5 1W H=.271" GOLD
Package Cooled: TO-5  ·  Attachment Method: Threaded Coupling  ·  Outline: 15.88mm Dia  ·  Material: Aluminum  ·  Thermal Resistance @ Natural: 54°C/W
from 3,67
from 7,20		Additional information
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2288BAavid ThermalloyBOARD LEVEL HEAT SINK
Attachment Method: Thermal Tape, Adhesive (Not Included)  ·  Power Dissipation @ Temperature Rise: 1.5W @ 40°C  ·  Thermal Resistance @ Forced Air Flow: 14.0°C/W @ 200 LFM
from 3,86Additional information
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506007B00000G506007B00000GAavid ThermalloyHEATSINK TO-3 LOW PROFILE .375
Package Cooled: TO-3  ·  Attachment Method: Bolt On  ·  Outline: 50.80mm x 44.45mm  ·  Height: 0.375" (9.53mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 10W @ 70°C  ·  Thermal Resistance @ Forced Air Flow: 3°C/W @ 400 LFM  ·  Thermal Resistance @ Natural: 7°C/W
from 0,53Additional information
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501503B00000G501503B00000GAavid ThermalloyHEATSINK TO-3 1.00" 12W BLK
Package Cooled: TO-3  ·  Attachment Method: Bolt On  ·  Outline: 47.75mm x 35.56mm  ·  Height: 1" (25.4mm)  ·  Power Dissipation @ Temperature Rise: 6W @ 40°C  ·  Thermal Resistance @ Forced Air Flow: 2.0°C/W @ 500 LFM  ·  Thermal Resistance @ Natural: 8.4°C/W
from 0,67Additional information
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