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Photo | Name | Manufacturer | Technical parameters | Prices (rub.) | Buy |
217-36CTE6 | Wakefield Thermal Solutions | HEATSINK DPAK SMT TIN PLATED Series: 217 · Package Cooled: D²Pak · Attachment Method: SMD Pad · Outline: 18.80mm x 15.20mm · Height: 0.36" (9.14mm) · Material: Copper · Power Dissipation @ Temperature Rise: 1W @ 55°C · Thermal Resistance @ Forced Air Flow: 16.0°C/W @ 200 LFM · Thermal Resistance @ Natural: 55°C/W | from 0,19 from 0,45 | Additional information Find at suppliers | |
628-65AB | Wakefield Thermal Solutions | HEATSINK CPU 43MM SQ BLK H=.65 Series: 628 · Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) · Attachment Method: Thermal Tape, Adhesive (Not Included) · Outline: 44.45mm x 43.18mm · Height: 0.65" (16.5mm) · Material: Aluminum · Power Dissipation @ Temperature Rise: 4.5W @ 30°C · Thermal Resistance @ Forced Air Flow: 1.5°C/W @ 400 LFM | from 1,00 from 2,40 | Additional information Find at suppliers | |
641A | Wakefield Thermal Solutions | HEATSINK TO-3 PWR HORZ MT BLK Series: 641 · Package Cooled: TO-3 · Attachment Method: Bolt On · Outline: 104.77mm x 76.20mm · Height: 1" (25.4mm) · Material: Aluminum · Power Dissipation @ Temperature Rise: 15W @ 36°C · Thermal Resistance @ Forced Air Flow: 0.9°C/W @ 250 LFM · Thermal Resistance @ Natural: 2.4°C/W | from 4,54 from 10,89 | Additional information Find at suppliers | |
658-60AB | Wakefield Thermal Solutions | HEATSINK CPU 28MM SQ BLK W/OTAPE Series: 658 · Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) · Attachment Method: Thermal Tape, Adhesive (Not Included) · Outline: 27.94mm x 27.94mm · Height: 0.6" (15.24mm) · Material: Aluminum · Power Dissipation @ Temperature Rise: 2.5W @ 30°C · Thermal Resistance @ Forced Air Flow: 3°C/W @ 300 LFM | from 0,73 from 2,00 | Additional information Find at suppliers | |
258 | Wakefield Thermal Solutions | .5X.25X.34 HEATSINK FOR DIODE Series: 258 · Attachment Method: Thermal Tape, Adhesive (Not Included) · Outline: 12.70mm x 6.35mm · Height: 0.34" (8.64mm) · Material: Aluminum | from 20,98 | Additional information Find at suppliers | |
392-180AB | Wakefield Thermal Solutions | HEATSINK EXTRUSION IGBT/SSR BLK Series: 392 · Attachment Method: Press Fit · Outline: 180.01mm x 124.97mm · Height: 5.34" (135.64mm) · Material: Aluminum · Thermal Resistance @ Forced Air Flow: 0.1°C/W @ 100 LFM · Thermal Resistance @ Natural: 0.43°C/W | from 60,06 from 120,13 | Additional information Find at suppliers | |
623K | Wakefield Thermal Solutions | HEAT SINK PWR NO MNT HOLES BLK Series: 623 · Package Cooled: TO-3 · Attachment Method: Press Fit · Outline: 120.65mm x 76.20mm · Height: 0.43" (11mm) · Material: Aluminum · Power Dissipation @ Temperature Rise: 15W @ 52°C · Thermal Resistance @ Forced Air Flow: 1.5°C/W @ 250 LFM · Thermal Resistance @ Natural: 3.5°C/W | from 6,24 | Additional information Find at suppliers | |
289AB | Wakefield Thermal Solutions | HEATSINK TO-220 VERT/HORZ BLK Series: 289 · Package Cooled: TO-218, TO-202, TO-220 · Attachment Method: Bolt On and PC Pin · Outline: 25.40mm x 18.03mm · Height: 0.5" (12.7mm) · Material: Aluminum · Power Dissipation @ Temperature Rise: 2W @ 50°C · Thermal Resistance @ Forced Air Flow: 44°C/W @ 400 LFM · Thermal Resistance @ Natural: 25°C/W | from 0,15 from 0,42 | Additional information Find at suppliers | |
637-10ABP | Wakefield Thermal Solutions | HEATSINK TO-220 VERT MT BLK 1 Series: 637 · Package Cooled: TO-220 · Attachment Method: Bolt On and PC Pin · Outline: 34.92mm x 12.70mm · Height: 1" (25.4mm) · Material: Aluminum · Power Dissipation @ Temperature Rise: 6W @ 76°C · Thermal Resistance @ Forced Air Flow: 5.8°C/W @ 200 LFM · Thermal Resistance @ Natural: 12.7°C/W | from 0,84 from 2,31 | Additional information Find at suppliers | |
274-1AB | Wakefield Thermal Solutions | HEATSINK TO-220 LOW HEIGHT BLK Series: 274 · Package Cooled: TO-220 · Attachment Method: Bolt On and PC Pin · Outline: 19.05mm x 13.21mm · Height: 0.375" (9.53mm) · Material: Aluminum · Power Dissipation @ Temperature Rise: 2W @ 56°C · Thermal Resistance @ Forced Air Flow: 8.0°C/W @ 400 LFM · Thermal Resistance @ Natural: 28°C/W | from 0,13 from 0,35 | Additional information Find at suppliers | |
401K | Wakefield Thermal Solutions | HEATSINK POWER NO MNT HOLES BLK Series: 401 · Package Cooled: TO-3 · Attachment Method: Bolt On · Outline: 120.65mm x 38.10mm · Height: 1.25" (31.75mm) · Material: Aluminum · Power Dissipation @ Temperature Rise: 30W @ 80°C · Thermal Resistance @ Forced Air Flow: 1.5°C/W @ 250 LFM · Thermal Resistance @ Natural: 3°C/W | from 5,31 from 12,75 | Additional information Find at suppliers | |
658-45ABT4 | Wakefield Thermal Solutions | HEATSINK CPU 28MM SQ BLK W/TAPE Series: 658 · Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) · Attachment Method: Thermal Tape, Adhesive (Included) · Outline: 27.94mm x 27.94mm · Height: 0.45" (11.43mm) · Material: Aluminum · Power Dissipation @ Temperature Rise: 3W @ 50°C · Thermal Resistance @ Forced Air Flow: 6.0°C/W @ 200 LFM | from 1,45 from 3,48 | Additional information Find at suppliers | |
637-15ABP | Wakefield Thermal Solutions | HEATSINK TO-220 VERT MT BLK 1.5 Series: 637 · Package Cooled: TO-220 · Attachment Method: Bolt On and PC Pin · Outline: 34.92mm x 12.70mm · Height: 1.5" (38.1mm) · Material: Aluminum · Power Dissipation @ Temperature Rise: 6W @ 65°C · Thermal Resistance @ Forced Air Flow: 5.5°C/W @ 200 LFM · Thermal Resistance @ Natural: 10.8°C/W | from 0,87 from 2,38 | Additional information Find at suppliers | |
217-36CT6 | Wakefield Thermal Solutions | HEATSINK DPAK SMT TIN PLATED Series: 217 · Package Cooled: D²Pak · Attachment Method: SMD Pad · Outline: 18.80mm x 15.20mm · Height: 0.36" (9.14mm) · Material: Copper · Power Dissipation @ Temperature Rise: 1W @ 55°C · Thermal Resistance @ Forced Air Flow: 16.0°C/W @ 200 LFM · Thermal Resistance @ Natural: 55°C/W | from 0,19 from 0,53 | Additional information Find at suppliers | |
287-1AB | Wakefield Thermal Solutions | HEATSINK TO-220 VERT W/TABS BLK Series: 287 · Package Cooled: TO-220 · Attachment Method: Bolt On and PC Pin · Outline: 25.40mm x 12.70mm · Height: 1.18" (29.97mm) · Material: Aluminum · Power Dissipation @ Temperature Rise: 4W @ 65°C · Thermal Resistance @ Forced Air Flow: 7.8°C/W @ 200 LFM · Thermal Resistance @ Natural: 16.2°C/W | from 0,69 from 1,89 | Additional information Find at suppliers | |
677-10ABP | Wakefield Thermal Solutions | HEATSINK MULTIWATT 1.0" BLK Series: 677 · Package Cooled: TO-220 · Attachment Method: Bolt On and PC Pin · Outline: 41.91mm x 25.40mm · Height: 1" (25.4mm) · Material: Aluminum · Power Dissipation @ Temperature Rise: 6W @ 76°C · Thermal Resistance @ Forced Air Flow: 5.8°C/W @ 200 LFM · Thermal Resistance @ Natural: 8.7°C/W | from 1,43 | Additional information Find at suppliers | |
680-125A | Wakefield Thermal Solutions | HEATSINK POWER TO-3 BLK Series: 680 · Package Cooled: TO-3 · Attachment Method: Bolt On · Outline: 45.97mm x 45.97mm · Height: 1.25" (31.75mm) · Material: Aluminum · Power Dissipation @ Temperature Rise: 8W @ 45°C · Thermal Resistance @ Forced Air Flow: 1.5°C/W @ 400 LFM · Thermal Resistance @ Natural: 6°C/W | from 5,18 from 12,42 | Additional information Find at suppliers | |
270-AB | Wakefield Thermal Solutions | HEATSINK TO-220 SM FOOTPRINT BLK Series: 270 · Package Cooled: TO-220, TO-202 · Attachment Method: Bolt On · Outline: 44.45mm x 17.78mm · Height: 0.375" (9.53mm) · Material: Aluminum · Power Dissipation @ Temperature Rise: 4W @ 70°C · Thermal Resistance @ Forced Air Flow: 6.0°C/W @ 400 LFM · Thermal Resistance @ Natural: 17.5°C/W | from 0,18 from 0,49 | Additional information Find at suppliers | |
637-20ABP | Wakefield Thermal Solutions | HEATSINK TO-220 VERT MT BLK 2 Series: 637 · Package Cooled: TO-220 · Attachment Method: Bolt On and PC Pin · Outline: 34.92mm x 12.70mm · Height: 2" (50.8mm) · Material: Aluminum · Power Dissipation @ Temperature Rise: 6W @ 55°C · Thermal Resistance @ Forced Air Flow: 4.7°C/W @ 200 LFM · Thermal Resistance @ Natural: 9.2°C/W | from 1,03 from 2,84 | Additional information Find at suppliers | |
233-60AB | Wakefield Thermal Solutions | HEATSINK TO-220 VERT/HORZ BLK Series: 233 · Package Cooled: TO-220 · Attachment Method: Bolt On · Outline: 14.48mm x 12.70mm · Height: 0.600" (15.20mm) · Material: Aluminum · Power Dissipation @ Temperature Rise: 2W @ 58°C · Thermal Resistance @ Forced Air Flow: 11.0°C/W @ 400 LFM · Thermal Resistance @ Natural: 29°C/W | from 0,22 | Additional information Find at suppliers | |
658-35ABT4E | Wakefield Thermal Solutions | HEATSINK CPU 28MM SQ BLK W/TAPE Series: 658 · Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) · Attachment Method: Thermal Tape, Adhesive (Included) · Outline: 27.94mm x 27.94mm · Height: 0.35" (9mm) · Material: Aluminum · Thermal Resistance @ Forced Air Flow: 8.0°C/W @ 200 LFM | from 1,39 from 3,33 | Additional information Find at suppliers | |
230-75AB | Wakefield Thermal Solutions | HEATSINK TO-220 VERT/HORZ BLK Series: 230 · Package Cooled: TO-220 · Attachment Method: Bolt On · Outline: 14.48mm x 12.70mm · Height: 0.75" (19.05mm) · Material: Aluminum · Power Dissipation @ Temperature Rise: 2W @ 57°C · Thermal Resistance @ Forced Air Flow: 7.5°C/W @ 400 LFM · Thermal Resistance @ Natural: 28.5°C/W | from 0,20 from 0,56 | Additional information Find at suppliers | |
657-20ABPE | Wakefield Thermal Solutions | HEATSINK TO-220 W/PINS BLK 2 Series: 657 · Package Cooled: TO-220 · Attachment Method: Bolt On and PC Pin · Outline: 41.91mm x 25.40mm · Height: 2" (50.8mm) · Material: Aluminum · Power Dissipation @ Temperature Rise: 6W @ 32°C · Thermal Resistance @ Forced Air Flow: 2.9°C/W @ 200 LFM | from 1,19 | Additional information Find at suppliers | |
528-45AB-MS4 | Wakefield Thermal Solutions | HEATSINK BXB50,75,100,150.45"VRT Series: 528 · Package Cooled: Half Brick DC/DC Converter · Attachment Method: Thermal Tape, Adhesive (Included) · Outline: 61.00mm x 57.90mm · Height: 0.45" (11.43mm) · Material: Aluminum · Power Dissipation @ Temperature Rise: 7W @ 60°C · Thermal Resistance @ Forced Air Flow: 3.2°C/W @ 300 LFM | from 6,94 | Additional information Find at suppliers | |
642-45AB | Wakefield Thermal Solutions | HEATSINK CPU 35MM SQ H=.45" BLK Series: 642 · Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) · Attachment Method: Thermal Tape, Adhesive (Not Included) · Outline: 35.00mm x 35.00mm · Height: 0.45" (11.43mm) · Material: Aluminum | from 0,83 from 2,28 | Additional information Find at suppliers |
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