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Photo | Name | Manufacturer | Technical parameters | Prices (rub.) | Buy |
375024B00032 | Aavid Thermalloy | HEATSINK BGA W/ADHESIVE TAPE Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) · Attachment Method: Thermal Tape, Adhesive (Included) · Outline: 40.00mm x 40.00mm · Height: 0.709" (18mm) · Material: Aluminum · Power Dissipation @ Temperature Rise: 2W @ 30°C · Thermal Resistance @ Forced Air Flow: 4.3°C/W @ 200 LFM · Thermal Resistance @ Natural: 12°C/W | Additional information Find at suppliers |
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