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374724B00032

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- Dimensional Drawing
- Dimensional Drawing

374724B00032 — HEATSINK BGA W/ADHESIVE TAPE

ManufacturerAavid Thermalloy
Package CooledAssorted (BGA, LGA, CPU, ASIC...)
Attachment MethodThermal Tape, Adhesive (Included)
Outline35.00mm x 35.00mm
Height0.709" (18mm)
MaterialAluminum
Power Dissipation @ Temperature Rise3W @ 50°C
Thermal Resistance @ Forced Air Flow5.2°C/W @ 200 LFM
Thermal Resistance @ Natural15.3°C/W
Found under nameHS322
Analogous by characteristics
PhotoNameManufacturerTechnical parametersPrices (rub.)Buy
374724B00035G374724B00035GAavid ThermalloyHEATSINK BGA W/ADHESIVE TAPE
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 35.00mm x 35.00mm  ·  Height: 0.709" (18mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 3W @ 50°C  ·  Thermal Resistance @ Forced Air Flow: 5.2°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 15.3°C/W
from 2,00
from 3,93
Additional information
Find at suppliers
374724B00032G374724B00032GAavid ThermalloyHEATSINK BGA W/ADHESIVE TAPE
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 35.00mm x 35.00mm  ·  Height: 0.709" (18mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 3W @ 50°C  ·  Thermal Resistance @ Forced Air Flow: 5.2°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 15.3°C/W
from 1,92
from 3,77
Additional information
Find at suppliers

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