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374524B60023G — HEATSINK BGA W/O SOLDER ANCHORS
Manufacturer | Aavid Thermalloy |
Harmful substances | RoHS Lead-free |
| Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method | Solder Anchor |
Outline | 27.00mm x 27.00mm |
Height | 0.984" (24.99mm) |
Material | Aluminum |
Power Dissipation @ Temperature Rise | 1W @ 20°C |
Thermal Resistance @ Forced Air Flow | 5.5°C/W @ 200 LFM |
Thermal Resistance @ Natural | 16.5°C/W |
Found under name | 374524B60023, HS330 |
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