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371824B00032

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371824B00032 — HEATSINK BGA W/ADHESIVE TAPE

ManufacturerAavid Thermalloy
Package CooledAssorted (BGA, LGA, CPU, ASIC...)
Attachment MethodThermal Tape, Adhesive (Included)
Outline35.00mm x 35.00mm
Height0.275" (7mm)
MaterialAluminum
Power Dissipation @ Temperature Rise1.5W @ 50°C
Thermal Resistance @ Forced Air Flow10.0°C/W @ 200 LFM
Found under nameHS313
Analogous by characteristics
PhotoNameManufacturerTechnical parametersPrices (rub.)Buy
371824B00034G371824B00034GAavid ThermalloyHEATSINK BGA W/ADHESIVE TAPE
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 35.00mm x 35.00mm  ·  Height: 0.275" (7mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 1.5W @ 50°C  ·  Thermal Resistance @ Forced Air Flow: 10.0°C/W @ 200 LFM
from 2,05
from 4,03		Additional information
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