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364424B00032G

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- Dimensional Drawing
- Dimensional Drawing

364424B00032G — HEATSINK BGA W/ADHESIVE TAPE

ManufacturerAavid Thermalloy
Harmful substancesRoHS   Lead-free
Package CooledAssorted (BGA, LGA, CPU, ASIC...)
Attachment MethodThermal Tape, Adhesive (Included)
Outline40.00mm x 40.00mm
Height0.45" (11.43mm)
MaterialAluminum
Power Dissipation @ Temperature Rise2W @ 40°C
Thermal Resistance @ Forced Air Flow6.0°C/W @ 200 LFM
Found under nameHS391
Analogous by characteristics
PhotoNameManufacturerTechnical parametersPrices (rub.)Buy
364424B00032364424B00032Aavid ThermalloyHEATSINK BGA W/ADHESIVE TAPE
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 40.00mm x 40.00mm  ·  Height: 0.45" (11.43mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 40°C  ·  Thermal Resistance @ Forced Air Flow: 6.0°C/W @ 200 LFM
from 2,26
from 4,03
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