Log in    Register
ChipFind Component Selection Catalog
For example: transistor, max232, lt319a
  

Fans, Thermal Management  ·  Heat Sinks
 

311505A00000G — BOARD LEVEL HEAT SINK

ManufacturerAavid Thermalloy
Harmful substancesRoHS   Lead-free
Package CooledTO-5, TO-39
Found under name034477
Analogous by characteristics
PhotoNameManufacturerTechnical parametersPrices (rub.)Buy
311505B00000GAavid ThermalloyBOARD LEVEL HEAT SINK
Package Cooled: TO-5, TO-39  ·  Attachment Method: Press Fit  ·  Outline: 9.52mm Dia  ·  Height: 0.4" (10.16mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 1W @ 70°C  ·  Thermal Resistance @ Forced Air Flow: 45°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 90°C/W
from 1,19Additional information
Find at suppliers
325705B00000GAavid ThermalloyBOARD LEVEL HEAT SINK
Package Cooled: TO-5, TO-39  ·  Attachment Method: Press Fit  ·  Outline: 12.70mm Dia  ·  Height: 0.25" (6.35mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 1W @ 60°C  ·  Thermal Resistance @ Forced Air Flow: 35°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 60°C/W
from 0,83Additional information
Find at suppliers
322805B00000GAavid ThermalloyBOARD LEVEL HEAT SINK
Package Cooled: TO-5, TO-39  ·  Attachment Method: Press Fit  ·  Height: 0.531" (13.49mm)  ·  Power Dissipation @ Temperature Rise: 1W @ 50°C  ·  Thermal Resistance @ Forced Air Flow: 30°C/W @ 200 LFM
from 2,23Additional information
Find at suppliers
320105B00000GAavid ThermalloyBOARD LEVEL HEAT SINK
Package Cooled: TO-5, TO-39  ·  Attachment Method: Press Fit  ·  Outline: 12.70mm Dia  ·  Height: 0.25" (6.35mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 0.6W @ 40°C  ·  Thermal Resistance @ Forced Air Flow: 35°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 63°C/W
from 0,68Additional information
Find at suppliers
325705R00000GAavid ThermalloyBOARD LEVEL HEAT SINK
Package Cooled: TO-5, TO-39  ·  Attachment Method: Press Fit  ·  Outline: 12.70mm Dia  ·  Height: 0.25" (6.35mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 1W @ 60°C  ·  Thermal Resistance @ Forced Air Flow: 35°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 60°C/W
from 1,75Additional information
Find at suppliers
326005R00000GAavid ThermalloyBOARD LEVEL HEAT SINK
Package Cooled: TO-5, TO-39  ·  Attachment Method: Press Fit  ·  Outline: 12.70mm Dia  ·  Height: 0.375" (9.53mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 1W @ 55°C  ·  Thermal Resistance @ Forced Air Flow: 30°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 57°C/W
from 1,13Additional information
Find at suppliers
321527B00000G321527B00000GAavid ThermalloyHEATSINK TO-5 2W BLK
Package Cooled: TO-5, TO-39  ·  Attachment Method: Threaded Coupling  ·  Outline: 19.05mm Dia  ·  Power Dissipation @ Temperature Rise: 0.5W @ 20°C  ·  Thermal Resistance @ Forced Air Flow: 20°C/W @ 300 LFM  ·  Thermal Resistance @ Natural: 35.2°C/W
from 5,74
from 11,26		Additional information
Find at suppliers

Search «311505A00000G» in:  Google   Yahoo   MSN Report an error  

© 2006 — 2024 ChipFind Ltd.
Contact phone, e-mail, ICQ		 Catalog with parameters for 1,401,534 components Register • Advertising