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Fans, Thermal Management  ·  Heat Sinks
 

2263R — BOARD LEVEL HEAT SINK

ManufacturerAavid Thermalloy
Found under name034126
Analogous by characteristics
PhotoNameManufacturerTechnical parametersPrices (rub.)Buy
533001B02551GAavid ThermalloyBOARD LEVEL HEAT SINK
Package Cooled: TO-218, TO-247  ·  Attachment Method: Clip and PC Pin  ·  Outline: 34.92mm x 12.70mm  ·  Height: 1" (25.4mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 30°C  ·  Thermal Resistance @ Forced Air Flow: 4°C/W @ 400 LFM  ·  Thermal Resistance @ Natural: 13°C/W
from 1,13Additional information
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551002B00000G551002B00000GAavid ThermalloyHEATSINK TO-220 .787" HIGH
Package Cooled: TO-220  ·  Attachment Method: Bolt On  ·  Outline: 25.55mm x 19.99mm  ·  Height: 1.45" (36.83mm)  ·  Power Dissipation @ Temperature Rise: 1.5W @ 20°C  ·  Thermal Resistance @ Forced Air Flow: 4°C/W @ 300 LFM
from 0,35
from 0,69		Additional information
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322605B00000G322605B00000GAavid ThermalloyHEATSINK TO-5 1.25W H=.25" BLK
Package Cooled: TO-5  ·  Attachment Method: Press Fit  ·  Outline: 19.05mm Dia  ·  Height: 0.25" (6.35mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 1W @ 60°C  ·  Thermal Resistance @ Forced Air Flow: 25°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 54°C/W
from 1,27
from 2,49		Additional information
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501503B00100501503B00100Aavid ThermalloyHEATSINK TO-3 9W 1.0" W/MNT BLK
Package Cooled: TO-3  ·  Attachment Method: Bolt On  ·  Outline: 47.75mm x 35.56mm  ·  Height: 1" (25.4mm)  ·  Power Dissipation @ Temperature Rise: 5W @ 40°C  ·  Thermal Resistance @ Forced Air Flow: 4.0°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 8.4°C/W
from 1,33
from 2,61		Additional information
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574402B03200G574402B03200GAavid ThermalloyHEATSINK TO220 HOR MNT W/TAB.75
Package Cooled: TO-220  ·  Attachment Method: Clip and PC Pin  ·  Outline: 21.84mm x 10.03mm  ·  Height: 0.75" (19.05mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 3W @ 60°C  ·  Thermal Resistance @ Forced Air Flow: 12.0°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 23.2°C/W
from 0,38
from 0,74		Additional information
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198540B00000G198540B00000GAavid ThermalloyHEATSINK TO-3 PWR 50W BLK
Package Cooled: TO-3  ·  Attachment Method: Bolt On  ·  Outline: 104.77mm x 76.20mm  ·  Height: 1" (25.4mm)
from 4,14
from 8,13		Additional information
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513002B00000Aavid ThermalloyBOARD LEVEL HEAT SINK
Package Cooled: TO-220  ·  Attachment Method: Bolt On  ·  Outline: 34.93mm x 12.70mm  ·  Height: 1" (25.4mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 30°C  ·  Thermal Resistance @ Forced Air Flow: 4°C/W @ 400 LFM  ·  Thermal Resistance @ Natural: 13.4°C/W
from 0,57Additional information
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519903B00000GAavid ThermalloyBOARD LEVEL HEAT SINK
Package Cooled: TO-3  ·  Attachment Method: Bolt On  ·  Outline: 48.26mm x 39.37mm  ·  Height: 2" (50.8mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 5W @ 20°C  ·  Thermal Resistance @ Forced Air Flow: 2.0°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 4.2°C/W
from 4,58Additional information
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532802B02500GAavid ThermalloyBOARD LEVEL HEAT SINK
Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 41.91mm x 25.40mm  ·  Height: 2.5" (63.5mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 6W @ 30°C  ·  Thermal Resistance @ Forced Air Flow: 2.0°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 4.2°C/W
from 1,77Additional information
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580200B00000G580200B00000GAavid ThermalloyHEATSINK 14-16 DIP BLK ANODIZED
Package Cooled: 14-DIP and 16-DIP  ·  Attachment Method: Clip  ·  Outline: 22.61mm x 15.24mm  ·  Height: 0.41" (10.42mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 1W @ 20°C  ·  Thermal Resistance @ Forced Air Flow: 12.0°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 20°C/W
from 0,21
from 0,48		Additional information
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529901B02100GAavid ThermalloyBOARD LEVEL HEAT SINK
Package Cooled: TO-218  ·  Attachment Method: Bolt On  ·  Outline: 41.91mm x 25.40mm  ·  Height: 2" (50.8mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 6W @ 30°C  ·  Thermal Resistance @ Forced Air Flow: 1.5°C/W @ 400 LFM  ·  Thermal Resistance @ Natural: 4.5°C/W
from 1,34Additional information
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513101B02500GAavid ThermalloyBOARD LEVEL HEAT SINK
Package Cooled: TO-18  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 34.92mm x 12.70mm  ·  Height: 1.5" (38.1mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 8W @ 80°C  ·  Thermal Resistance @ Forced Air Flow: 4°C/W @ 400 LFM  ·  Thermal Resistance @ Natural: 11°C/W
from 0,68Additional information
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534202B02853G534202B02853GAavid ThermalloyHEATSINK TO-220 W/SHURLOCK-CLIP
Package Cooled: TO-220  ·  Attachment Method: Clip and PC Pin  ·  Outline: 25.40mm x 12.70mm  ·  Height: 1.18" (29.97mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 1W @ 20°C  ·  Thermal Resistance @ Forced Air Flow: 6°C/W @ 300 LFM  ·  Thermal Resistance @ Natural: 13.4°C/W
from 0,72
from 1,41		Additional information
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530102B00150G530102B00150GAavid ThermalloyHEAT SINK .720" HIGH RISE TO-220
Package Cooled: TO-220  ·  Attachment Method: Clip and PC Pin  ·  Outline: 44.45mm x 12.45mm  ·  Height: 1.75" (44.45mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 4W @ 30°C  ·  Thermal Resistance @ Forced Air Flow: 1.5°C/W @ 400 LFM  ·  Thermal Resistance @ Natural: 6.3°C/W
from 0,96
from 1,88		Additional information
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PF527Aavid ThermalloyBOARD LEVEL HEAT SINK
Package Cooled: TO-3  ·  Attachment Method: Bolt On  ·  Outline: 40.80mm x 26.90mm  ·  Height: 0.984" (24.99mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 3W @ 30°C  ·  Thermal Resistance @ Forced Air Flow: 3°C/W @ 400 LFM  ·  Thermal Resistance @ Natural: 7.4°C/W
from 7,09Additional information
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2292BGAavid ThermalloyBOARD LEVEL HEAT SINK
Attachment Method: Thermal Tape, Adhesive (Not Included)  ·  Power Dissipation @ Temperature Rise: 1.5W @ 40°C  ·  Thermal Resistance @ Forced Air Flow: 8.0°C/W @ 400 LFM
from 3,03Additional information
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374424B00035G374424B00035GAavid ThermalloyHEATSINK BGA W/ADHESIVE TAPE
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 27.00mm x 27.00mm  ·  Height: 0.709" (18mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 4W @ 80°C  ·  Thermal Resistance @ Forced Air Flow: 6.5°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 20.3°C/W
from 2,36
from 4,63		Additional information
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364424B00032364424B00032Aavid ThermalloyHEATSINK BGA W/ADHESIVE TAPE
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 40.00mm x 40.00mm  ·  Height: 0.45" (11.43mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 40°C  ·  Thermal Resistance @ Forced Air Flow: 6.0°C/W @ 200 LFM
from 2,26
from 4,03		Additional information
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576802B03200GAavid ThermalloyBOARD LEVEL HEAT SINK
Package Cooled: TO-220, TO-262  ·  Attachment Method: Clip and PC Pin  ·  Outline: 14.48mm x 12.70mm  ·  Height: 0.75" (19.05mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 1W @ 30°C  ·  Thermal Resistance @ Forced Air Flow: 7.0°C/W @ 400 LFM  ·  Thermal Resistance @ Natural: 27.3°C/W
from 0,40Additional information
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574902B02800GAavid ThermalloyBOARD LEVEL HEAT SINK
Package Cooled: TO-220  ·  Attachment Method: Clip and PC Pin  ·  Outline: 21.84mm x 10.03mm  ·  Height: 1.38" (35.05mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2.5W @ 40°C  ·  Thermal Resistance @ Forced Air Flow: 6.0°C/W @ 400 LFM  ·  Thermal Resistance @ Natural: 16°C/W
from 0,77Additional information
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504222B00000G504222B00000GAavid ThermalloyHEATSINK TO-220 PWR CLR 1.45"10W
Package Cooled: TO-220  ·  Attachment Method: Bolt On  ·  Outline: 21.59mm x 19.80mm  ·  Height: 1.45" (36.83mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 4W @ 40°C  ·  Thermal Resistance @ Forced Air Flow: 5.0°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 6.4°C/W
from 0,26
from 0,61		Additional information
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325705R00000GAavid ThermalloyBOARD LEVEL HEAT SINK
Package Cooled: TO-5, TO-39  ·  Attachment Method: Press Fit  ·  Outline: 12.70mm Dia  ·  Height: 0.25" (6.35mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 1W @ 60°C  ·  Thermal Resistance @ Forced Air Flow: 35°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 60°C/W
from 1,75Additional information
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568303B00000G568303B00000GAavid ThermalloyHEATSINK TO-3 1.25" 25WATT
Package Cooled: TO-3  ·  Attachment Method: Bolt On  ·  Outline: 45.97mm x 45.97mm  ·  Height: 1.25" (31.75mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 5W @ 30°C  ·  Thermal Resistance @ Forced Air Flow: 2.5°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 5.4°C/W
from 5,10
from 10,00		Additional information
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529801B02500G529801B02500GAavid ThermalloyHEATSINK TO-218 W/PINS 1.5"TALL
Package Cooled: TO-218  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 41.91mm x 25.40mm  ·  Height: 1.5" (38.1mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 10W @ 50°C  ·  Thermal Resistance @ Forced Air Flow: 2.0°C/W @ 500 LFM  ·  Thermal Resistance @ Natural: 5°C/W
from 0,86
from 1,68		Additional information
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HF20GAavid ThermalloyBOARD LEVEL HEAT SINK
Package Cooled: TO-220  ·  Attachment Method: Clip and PC Pin  ·  Outline: 20.07mm x 20.00mm  ·  Height: 1.1" (28mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 1W @ 20°C  ·  Thermal Resistance @ Forced Air Flow: 6.0°C/W @ 400 LFM  ·  Thermal Resistance @ Natural: 13.1°C/W
from 2,01Additional information
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