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Fans, Thermal Management  ·  Heat Sinks

 

2263R — BOARD LEVEL HEAT SINK

ManufacturerAavid Thermalloy
Found under name034126
Analogous by characteristics
PhotoNameManufacturerTechnical parametersPrices (rub.)Buy
578622B00000GAavid ThermalloyBOARD LEVEL HEAT SINK
Package Cooled: TO-220  ·  Attachment Method: Bolt On  ·  Outline: 37.59mm x 12.70mm  ·  Height: 1.03" (26.16mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 1.5W @ 20°C  ·  Thermal Resistance @ Forced Air Flow: 4°C/W @ 400 LFM  ·  Thermal Resistance @ Natural: 13.2°C/W
from 0,51Additional information
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574402B00000GAavid ThermalloyBOARD LEVEL HEAT SINK
Package Cooled: TO-220  ·  Attachment Method: Clip  ·  Outline: 21.84mm x 10.03mm  ·  Height: 0.75" (19.05mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 3W @ 60°C  ·  Thermal Resistance @ Forced Air Flow: 6°C/W @ 600 LFM  ·  Thermal Resistance @ Natural: 23.2°C/W
from 0,36Additional information
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563002B00000G563002B00000GAavid ThermalloyHEATSINK TO-220 VERT MNT 1.18
Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 25.40mm x 12.70mm  ·  Height: 1.18" (29.97mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 1W @ 20°C  ·  Thermal Resistance @ Forced Air Flow: 7.0°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 13°C/W
from 0,21
from 0,49
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520103B00000GAavid ThermalloyBOARD LEVEL HEAT SINK
Package Cooled: TO-3  ·  Attachment Method: Bolt On  ·  Outline: 48.26mm x 39.37mm  ·  Height: 1.23" (31.12mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 5W @ 30°C  ·  Thermal Resistance @ Forced Air Flow: 3.0°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 5.4°C/W
from 3,20Additional information
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67260U36000Aavid ThermalloyEXTRUSION UNFINISHED 3"X.45" 3FT
Attachment Method: Thermal Tape, Adhesive (Not Included)  ·  Outline: 914.40mm x 76.20mm  ·  Height: 0.45" (11.43mm)  ·  Power Dissipation @ Temperature Rise: 4W @ 30°C  ·  Thermal Resistance @ Forced Air Flow: 2°C/W @ 400 LFM
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501403B00100G501403B00100GAavid ThermalloyHEATSINK TO-3 9W .75" W/MNT BLK
Package Cooled: TO-3  ·  Attachment Method: Bolt On  ·  Outline: 47.75mm x 35.56mm  ·  Height: 0.75" (19.05mm)  ·  Power Dissipation @ Temperature Rise: 4W @ 40°C  ·  Thermal Resistance @ Forced Air Flow: 3°C/W @ 400 LFM  ·  Thermal Resistance @ Natural: 10°C/W
from 2,82
from 5,53
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573100D00010GAavid ThermalloyBOARD LEVEL HEAT SINK
Package Cooled: D³Pak  ·  Attachment Method: Clip  ·  Outline: 22.86mm x 8.00mm  ·  Height: 0.4" (10.16mm)  ·  Material: Copper  ·  Power Dissipation @ Temperature Rise: 1.5W @ 50°C  ·  Thermal Resistance @ Forced Air Flow: 12.5°C/W @ 600 LFM  ·  Thermal Resistance @ Natural: 15°C/W
from 0,60Additional information
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531102B02500G531102B02500GAavid ThermalloyHEATSINK TO-220 W/PINS 1.5"TALL
Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 34.92mm x 12.70mm  ·  Height: 1.5" (38.1mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 7W @ 70°C  ·  Thermal Resistance @ Forced Air Flow: 3°C/W @ 500 LFM  ·  Thermal Resistance @ Natural: 10.4°C/W
from 0,70
from 1,37
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563002T00000G563002T00000GAavid ThermalloyHEATSINK TO-220 VERT MNT 1.18
Package Cooled: TO-220  ·  Attachment Method: Bolt On  ·  Outline: 25.40mm x 12.70mm  ·  Height: 1.18" (29.97mm)  ·  Power Dissipation @ Temperature Rise: 1W @ 20°C  ·  Thermal Resistance @ Forced Air Flow: 4°C/W @ 600 LFM  ·  Thermal Resistance @ Natural: 13°C/W
from 12,75
from 25,00
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531202C00000531202C00000Aavid ThermalloyHEATSINK TO-220 PWR GOLD
Package Cooled: TO-220  ·  Attachment Method: Bolt On  ·  Outline: 34.92mm x 12.70mm  ·  Height: 2" (50.8mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 5W @ 40°C  ·  Thermal Resistance @ Forced Air Flow: 4°C/W @ 600 LFM
from 0,80
from 1,56
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533422B02552GAavid ThermalloyBOARD LEVEL HEAT SINK
Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 41.91mm x 25.40mm  ·  Height: 1.5" (38.1mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 10W @ 50°C  ·  Thermal Resistance @ Forced Air Flow: 3.0°C/W @ 200 LFM
from 1,82Additional information
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533521B02552GAavid ThermalloyBOARD LEVEL HEAT SINK
Package Cooled: TO-220  ·  Attachment Method: Clip and PC Pin  ·  Outline: 41.91mm x 25.40mm  ·  Height: 2" (50.8mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 6W @ 30°C  ·  Thermal Resistance @ Forced Air Flow: 1.5°C/W @ 500 LFM  ·  Thermal Resistance @ Natural: 4.5°C/W
from 1,82Additional information
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569003B00000G569003B00000GAavid ThermalloyCOOLER FOR TO-3 20 WATTS
Package Cooled: TO-3  ·  Attachment Method: Press Fit  ·  Outline: 46.48mm x 46.48mm  ·  Height: 1.31" (33.27mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 12W @ 60°C  ·  Thermal Resistance @ Forced Air Flow: 1.5°C/W @ 500 LFM  ·  Thermal Resistance @ Natural: 5.5°C/W
from 1,55
from 3,04
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568103B00000G568103B00000GAavid ThermalloyHEATSINK TO-3 12W H=.75" BLK
Package Cooled: TO-3  ·  Attachment Method: Bolt On  ·  Outline: 45.97mm x 45.97mm  ·  Height: 0.75" (19.05mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 5W @ 40°C  ·  Thermal Resistance @ Forced Air Flow: 1°C/W @ 500 LFM  ·  Thermal Resistance @ Natural: 6.7°C/W
from 4,21
from 8,26
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578902B03200GAavid ThermalloyBOARD LEVEL HEAT SINK
Package Cooled: TO-220  ·  Attachment Method: Clip and PC Pin  ·  Outline: 21.84mm x 10.03mm  ·  Height: 0.69" (17.53mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 3W @ 60°C  ·  Thermal Resistance @ Forced Air Flow: 12.0°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 21.6°C/W
from 0,90Additional information
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364424B00032G364424B00032GAavid ThermalloyHEATSINK BGA W/ADHESIVE TAPE
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 40.00mm x 40.00mm  ·  Height: 0.45" (11.43mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 40°C  ·  Thermal Resistance @ Forced Air Flow: 6.0°C/W @ 200 LFM
from 2,43
from 4,76
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374524B60023G374524B60023GAavid ThermalloyHEATSINK BGA W/O SOLDER ANCHORS
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Solder Anchor  ·  Outline: 27.00mm x 27.00mm  ·  Height: 0.984" (24.99mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 1W @ 20°C  ·  Thermal Resistance @ Forced Air Flow: 5.5°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 16.5°C/W
from 2,43
from 4,76
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529801B02100GAavid ThermalloyBOARD LEVEL HEAT SINK
Package Cooled: TO-218  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 41.91mm x 38.10mm  ·  Height: 1" (25.4mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 5W @ 30°C  ·  Thermal Resistance @ Forced Air Flow: 3.0°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 5°C/W
from 1,17Additional information
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513301B02500GAavid ThermalloyBOARD LEVEL HEAT SINK
Package Cooled: TO-218  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 63.50mm x 34.92mm  ·  Height: 0.5" (12.7mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 6W @ 50°C  ·  Thermal Resistance @ Forced Air Flow: 4.0°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 8°C/W
from 0,75Additional information
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374724B00032374724B00032Aavid ThermalloyHEATSINK BGA W/ADHESIVE TAPE
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 35.00mm x 35.00mm  ·  Height: 0.709" (18mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 3W @ 50°C  ·  Thermal Resistance @ Forced Air Flow: 5.2°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 15.3°C/W
from 1,95
from 3,83
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6322BAavid ThermalloyBOARD LEVEL HEAT SINKfrom 2,02Additional information
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534302B03553G534302B03553GAavid ThermalloyHEATSINK TO-220 W/TAB-KOOLCLIP
Package Cooled: TO-220  ·  Attachment Method: Clip and PC Pin  ·  Outline: 35.05mm x 12.20mm  ·  Height: 2" (50.8mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 6W @ 60°C  ·  Thermal Resistance @ Forced Air Flow: 5.0°C/W @ 200 LFM
from 1,04
from 2,04
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532602B02500GAavid ThermalloyBOARD LEVEL HEAT SINK
Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 41.91mm x 25.40mm  ·  Height: 1.5" (38.1mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 6W @ 40°C  ·  Thermal Resistance @ Forced Air Flow: 2°C/W @ 400 LFM  ·  Thermal Resistance @ Natural: 5.5°C/W
from 1,12Additional information
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533102B02551GAavid ThermalloyBOARD LEVEL HEAT SINK
Package Cooled: TO-218, TO-247  ·  Attachment Method: Clip and PC Pin  ·  Outline: 34.92mm x 12.70mm  ·  Height: 1.5" (38.1mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 8W @ 80°C  ·  Thermal Resistance @ Forced Air Flow: 6.0°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 11°C/W
from 1,25Additional information
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530001B02100GAavid ThermalloyBOARD LEVEL HEAT SINK
Package Cooled: TO-218  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 63.50mm x 41.91mm  ·  Height: 1" (25.4mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 20W @ 60°C  ·  Thermal Resistance @ Forced Air Flow: 2.0°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 8°C/W
from 1,26Additional information
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