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Fans, Thermal Management  ·  Heat Sinks
 

2262R — BOARD LEVEL HEAT SINK

ManufacturerAavid Thermalloy
Found under name034119
Analogous by characteristics
PhotoNameManufacturerTechnical parametersPrices (rub.)Buy
7109DG7109DGAavid ThermalloyBOARD LEVEL HEATSINK .45" D-PAK
Package Cooled: D²Pak  ·  Attachment Method: SMD Pad  ·  Outline: 25.40mm x 19.40mm  ·  Height: 0.45" (11.43mm)  ·  Power Dissipation @ Temperature Rise: 2W @ 30°C  ·  Thermal Resistance @ Forced Air Flow: 3°C/W @ 300 LFM  ·  Thermal Resistance @ Natural: 11°C/W
from 0,77
from 1,51		Additional information
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533002B02500GAavid ThermalloyBOARD LEVEL HEAT SINK
Package Cooled: TO-218, TO-247  ·  Attachment Method: Clip and PC Pin  ·  Outline: 34.92mm x 12.70mm  ·  Height: 1" (25.4mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 30°C  ·  Thermal Resistance @ Forced Air Flow: 4°C/W @ 400 LFM
from 0,88Additional information
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550202D00000GAavid ThermalloyBOARD LEVEL HEAT SINKfrom 2,38Additional information
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593202B03400GAavid ThermalloyBOARD LEVEL HEAT SINK
Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 35.05mm x 12.20mm  ·  Height: 2" (50.8mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 6W @ 60°C  ·  Thermal Resistance @ Forced Air Flow: 4°C/W @ 300 LFM  ·  Thermal Resistance @ Natural: 10.4°C/W
from 0,65Additional information
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7148DGAavid ThermalloyBOARD LEVEL HEAT SINK
Attachment Method: Clip and PC Pin  ·  Outline: 23.24mm x 9.65mm  ·  Height: 0.795" (20.19mm)  ·  Material: Copper  ·  Power Dissipation @ Temperature Rise: 1W @ 30°C  ·  Thermal Resistance @ Forced Air Flow: 6°C/W @ 600 LFM  ·  Thermal Resistance @ Natural: 16°C/W
from 1,58Additional information
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507302B00000G507302B00000GAavid ThermalloyHEATSINK TO-220 2.5W LOW PROFILE
Package Cooled: TO-220  ·  Attachment Method: Bolt On  ·  Outline: 19.05mm x 9.65mm  ·  Height: 0.75" (19.05mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2.5W @ 60°C  ·  Thermal Resistance @ Forced Air Flow: 10.0°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 24°C/W
from 0,12
from 0,32		Additional information
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7038BGAavid ThermalloyBOARD LEVEL HEAT SINK
Attachment Method: Clip  ·  Outline: 23.24mm x 9.65mm  ·  Height: 0.62" (15.75mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 1.5W @ 40°C  ·  Thermal Resistance @ Forced Air Flow: 6°C/W @ 600 LFM  ·  Thermal Resistance @ Natural: 16°C/W
from 0,55Additional information
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6398BGAavid ThermalloyBOARD LEVEL HEAT SINK
Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 41.91mm x 25.40mm  ·  Height: 1.5" (38.1mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 4W @ 30°C  ·  Thermal Resistance @ Forced Air Flow: 2°C/W @ 400 LFM  ·  Thermal Resistance @ Natural: 4.4°C/W
from 1,25Additional information
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6225B-MTGAavid ThermalloyBOARD LEVEL HEAT SINK
Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 26.01mm x 8.00mm  ·  Height: 1.07" (27.18mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 40°C  ·  Thermal Resistance @ Forced Air Flow: 3°C/W @ 700 LFM  ·  Thermal Resistance @ Natural: 15°C/W
from 0,48Additional information
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531100B02500GAavid ThermalloyBOARD LEVEL HEAT SINKfrom 0,90Additional information
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374924B00032374924B00032Aavid ThermalloyHEATSINK BGA W/ADHESIVE TAPE
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 40.00mm x 40.00mm  ·  Height: 0.394" (10mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 4W @ 80°C  ·  Thermal Resistance @ Forced Air Flow: 6.5°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 20.3°C/W
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575903B00000GAavid ThermalloyBOARD LEVEL HEAT SINK
Package Cooled: TO-3  ·  Attachment Method: Bolt On  ·  Outline: 41.40mm x 32.77mm  ·  Height: 1.25" (31.75mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 7W @ 70°C  ·  Thermal Resistance @ Forced Air Flow: 3°C/W @ 300 LFM  ·  Thermal Resistance @ Natural: 9.8°C/W
from 1,52Additional information
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TV-265Aavid ThermalloyBOARD LEVEL HEAT SINK
Package Cooled: TO-220, TO-218  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 30.00mm x 12.70mm  ·  Height: 1.77" (45.06mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2.5W @ 40°C  ·  Thermal Resistance @ Natural: 13°C/W
from 1,81Additional information
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530400B00100GAavid ThermalloyBOARD LEVEL HEAT SINK
Package Cooled: TO-220  ·  Attachment Method: Bolt On  ·  Outline: 44.45mm x 12.45mm  ·  Height: 1.75" (44.45mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 4W @ 30°C  ·  Thermal Resistance @ Forced Air Flow: 2°C/W @ 400 LFM  ·  Thermal Resistance @ Natural: 6.3°C/W
from 1,83Additional information
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532602B00000Aavid ThermalloyBOARD LEVEL HEAT SINK
Package Cooled: TO-220  ·  Attachment Method: Bolt On  ·  Outline: 41.91mm x 25.40mm  ·  Height: 1.5" (38.1mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 6W @ 40°C  ·  Thermal Resistance @ Forced Air Flow: 2°C/W @ 400 LFM  ·  Thermal Resistance @ Natural: 5.5°C/W
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566010B04500GAavid ThermalloyBOARD LEVEL HEAT SINKfrom 2,10Additional information
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326005B00000G326005B00000GAavid ThermalloyHEATSINK TO-5 1W H=.375" BLK
Package Cooled: TO-5  ·  Attachment Method: Press Fit  ·  Outline: 12.70mm Dia  ·  Height: 0.375" (9.53mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 1.8W @ 90°C  ·  Thermal Resistance @ Forced Air Flow: 30°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 57°C/W
from 0,65
from 1,28		Additional information
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566010B03400G566010B03400GAavid ThermalloyHEATSINK TO-218 W/TAB BLACK
Attachment Method: Clip and PC Pin  ·  Outline: 25.40mm x 12.70mm  ·  Height: 1.22" (30.99mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 30°C  ·  Thermal Resistance @ Forced Air Flow: 5.0°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 11.5°C/W
from 0,78
from 1,53		Additional information
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2285BAavid ThermalloyBOARD LEVEL HEAT SINKfrom 5,84Additional information
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519803B00000GAavid ThermalloyBOARD LEVEL HEAT SINK
Package Cooled: TO-3  ·  Attachment Method: Bolt On  ·  Outline: 48.26mm x 39.37mm  ·  Height: 1.75" (44.45mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 10W @ 50°C  ·  Thermal Resistance @ Forced Air Flow: 2°C/W @ 400 LFM  ·  Thermal Resistance @ Natural: 4.5°C/W
from 3,98Additional information
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504102B00000G504102B00000GAavid ThermalloyHEATSINK TO-220 PWR CLR .700"6W
Package Cooled: TO-220  ·  Attachment Method: Bolt On  ·  Outline: 21.59mm x 19.80mm  ·  Height: 0.7" (17.8mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 40°C  ·  Thermal Resistance @ Forced Air Flow: 6°C/W @ 300 LFM  ·  Thermal Resistance @ Natural: 15.6°C/W
from 0,16
from 0,45		Additional information
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594302B02853G594302B02853GAavid ThermalloyHEATSINK TO-220 W/KOOL CLIP BLK
Package Cooled: TO-220  ·  Attachment Method: Clip and PC Pin  ·  Outline: 35.05mm x 12.20mm  ·  Height: 2" (50.8mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 6W @ 60°C  ·  Thermal Resistance @ Forced Air Flow: 3°C/W @ 500 LFM
from 1,39
from 2,73		Additional information
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593101B00000GAavid ThermalloyBOARD LEVEL HEAT SINK
Package Cooled: TO-218  ·  Attachment Method: Bolt On  ·  Outline: 43.18mm x 12.70mm  ·  Height: 1.64" (41.66mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 6W @ 50°C  ·  Thermal Resistance @ Forced Air Flow: 4°C/W @ 300 LFM  ·  Thermal Resistance @ Natural: 8.6°C/W
from 0,83Additional information
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508222B00000Aavid ThermalloyBOARD LEVEL HEAT SINK
Package Cooled: TO-220  ·  Attachment Method: Bolt On  ·  Outline: 45.21mm x 45.21mm  ·  Height: 1" (25.4mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 9W @ 50°C  ·  Thermal Resistance @ Forced Air Flow: 1°C/W @ 900 LFM  ·  Thermal Resistance @ Natural: 7.4°C/W
from 2,08Additional information
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573400D00010573400D00010Aavid ThermalloyHEATSINK D-PAK3 TIN PLATED SMD
Package Cooled: D³Pak  ·  Attachment Method: SMD Pad  ·  Outline: 30.99mm x 12.70mm  ·  Height: 0.4" (10.16mm)  ·  Power Dissipation @ Temperature Rise: 1W @ 20°C  ·  Thermal Resistance @ Forced Air Flow: 4°C/W @ 600 LFM  ·  Thermal Resistance @ Natural: 14°C/W
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