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Photo | Name | Manufacturer | Technical parameters | Prices (rub.) | Buy |
217-36CTE6 | Wakefield Thermal Solutions | HEATSINK DPAK SMT TIN PLATED Series: 217 · Package Cooled: D²Pak · Attachment Method: SMD Pad · Outline: 18.80mm x 15.20mm · Height: 0.36" (9.14mm) · Material: Copper · Power Dissipation @ Temperature Rise: 1W @ 55°C · Thermal Resistance @ Forced Air Flow: 16.0°C/W @ 200 LFM · Thermal Resistance @ Natural: 55°C/W | from 0,19 from 0,45 | Additional information Find at suppliers |
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