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2-1542006-2 — HEATSINK BGA 5 FIN RADIAL

ManufacturerTyco Electronics
Harmful substancesRoHS   Lead-free
Package CooledAssorted (BGA, LGA, CPU, ASIC...)
Attachment MethodClip
Outline34.93mm Dia
Height0.678" (17.22mm)
MaterialAluminum
Thermal Resistance @ Forced Air Flow4.4°C/W @ 200 LFM
Thermal Resistance @ Natural9.9°C/W
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