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2-1542006-2 — HEATSINK BGA 5 FIN RADIAL
Manufacturer | Tyco Electronics |
Harmful substances | RoHS Lead-free |
| Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method | Clip |
Outline | 34.93mm Dia |
Height | 0.678" (17.22mm) |
Material | Aluminum |
Thermal Resistance @ Forced Air Flow | 4.4°C/W @ 200 LFM |
Thermal Resistance @ Natural | 9.9°C/W |
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