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10-6327-01 REV B-G — HEATSINK BGA W/PUSH PINS
Manufacturer | Aavid Thermalloy |
Harmful substances | RoHS Lead-free |
| Package Cooled | Assorted (BGA, LGA, CPU, ASIC...) |
Attachment Method | Push Pin |
Outline | 28.50mm x 28.50mm |
Height | 0.394" (10mm) |
Material | Aluminum |
Power Dissipation @ Temperature Rise | 2W @ 60°C |
Thermal Resistance @ Forced Air Flow | 9.3°C/W @ 200 LFM |
Thermal Resistance @ Natural | 30.6°C/W |
Found under name | 10-6327-01, HS306 |
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