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016304-81 — ALUMINUM EXTRUSION FLATBACK

ManufacturerWakefield Thermal Solutions
Harmful substancesRoHS   Lead-free
Found under nameQ4125634A
Analogous by characteristics
PhotoNameManufacturerTechnical parametersPrices (rub.)Buy
231-69PAB-15VWakefield Thermal SolutionsHEATSINK
Series: 231  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On  ·  Outline: 21.21mm x 10.16mm  ·  Height: 0.69" (17.53mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 45°C  ·  Thermal Resistance @ Forced Air Flow: 8.0°C/W @ 400 LFM
from 0,27Additional information
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421K421KWakefield Thermal SolutionsHEATSINK POWER NO MNT HOLES BLK
Series: 421  ·  Package Cooled: TO-3  ·  Attachment Method: Press Fit  ·  Outline: 120.65mm x 76.20mm  ·  Height: 2.62" (66.55mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 50W @ 58°C  ·  Thermal Resistance @ Forced Air Flow: 0.7°C/W @ 250 LFM  ·  Thermal Resistance @ Natural: 1.16°C/W
from 6,38
from 15,30		Additional information
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651-B651-BWakefield Thermal SolutionsHEATSINK 14-16PIN DIP BLK
Series: 651  ·  Package Cooled: 14-DIP and 16-DIP  ·  Attachment Method: Thermal Tape, Adhesive (Not Included)  ·  Outline: 19.05mm x 10.54mm  ·  Height: 0.24" (6.10mm)  ·  Material: Aluminum
from 0,71
from 1,96		Additional information
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218-40CT3218-40CT3Wakefield Thermal SolutionsHEATSINK ALUM BLACK SMD
Series: 218  ·  Package Cooled: SMD  ·  Attachment Method: SMD Pad  ·  Outline: 22.86mm x 8.12mm  ·  Height: 0.4" (10.16mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 52°C  ·  Thermal Resistance @ Forced Air Flow: 21°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 31°C/W
from 0,36Additional information
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4559-72Wakefield Thermal SolutionsHEATSINK EXTRUSION BLACKAdditional information
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628-40AB628-40ABWakefield Thermal SolutionsHEATSINK CPU 43MM SQ BLK H=.4
Series: 628  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Not Included)  ·  Outline: 44.45mm x 43.18mm  ·  Height: 0.4" (10.16mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2.5W @ 30°C  ·  Thermal Resistance @ Forced Air Flow: 4°C/W @ 300 LFM
from 0,97
from 2,66		Additional information
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288-1AB288-1ABWakefield Thermal SolutionsHEATSINK TO-220/202 VERT W/TABS
Series: 288  ·  Package Cooled: TO-220, TO-202  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 22.22mm x 5.46mm  ·  Height: 1.25" (31.75mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 4W @ 85°C  ·  Thermal Resistance @ Forced Air Flow: 12.0°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 21.2°C/W
from 0,62
from 1,72		Additional information
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262-75AB-01Wakefield Thermal SolutionsHEATSINK VERT/HORIZ BLACK TO-220
Series: 262  ·  Package Cooled: TO-220  ·  Attachment Method: Press Fit and PC Pin  ·  Outline: 13.46mm x 12.70mm  ·  Height: 0.75" (19.05mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 3W @ 80°C  ·  Thermal Resistance @ Forced Air Flow: 10.0°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 26.7°C/W
from 0,37Additional information
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272-AB272-ABWakefield Thermal SolutionsHEATSINK TO-220 SM FOOTPRINT BLK
Series: 272  ·  Package Cooled: TO-220, TO-202  ·  Attachment Method: Bolt On  ·  Outline: 44.45mm x 36.83mm  ·  Height: 0.375" (9.53mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 4W @ 42°C  ·  Thermal Resistance @ Forced Air Flow: 3.6°C/W @ 400 LFM  ·  Thermal Resistance @ Natural: 10.5°C/W
from 0,24
from 0,67		Additional information
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624-25ABT4624-25ABT4Wakefield Thermal SolutionsHEATSINK CPU 21MM SQ W/DBL TAPE
Series: 624  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 21.00mm x 21.00mm  ·  Height: 0.25" (6.35mm)  ·  Material: Aluminum  ·  Thermal Resistance @ Forced Air Flow: 25°C/W @ 200 LFM
from 1,20
from 3,29		Additional information
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658-25ABT1658-25ABT1Wakefield Thermal SolutionsHEATSINK CPU 28MM SQ BLK W/TAPE
Series: 658  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 27.94mm x 27.94mm  ·  Height: 0.25" (6.35mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 4W @ 70°C  ·  Thermal Resistance @ Forced Air Flow: 5°C/W @ 500 LFM
from 1,22
from 3,36		Additional information
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528-24AB-MS4Wakefield Thermal SolutionsHEATSINK BXB50,75,100,150.24"VRT
Series: 528  ·  Package Cooled: Half Brick DC/DC Converter  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 61.00mm x 57.90mm  ·  Height: 0.24" (6.10mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 5W @ 60°C  ·  Thermal Resistance @ Forced Air Flow: 5.8°C/W @ 300 LFM
from 6,80Additional information
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D10650-40D10650-40Wakefield Thermal SolutionsHEATSINK 100PQFP COMPOSITE
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Not Included)  ·  Outline: 16.51mm x 16.51mm  ·  Height: 0.4" (10.16mm)  ·  Material: Composite  ·  Power Dissipation @ Temperature Rise: 2W @ 40°C  ·  Thermal Resistance @ Forced Air Flow: 25°C/W @ 350 LFM
from 0,74
from 2,03		Additional information
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628-65ABT5Wakefield Thermal SolutionsHEATSINK CPU 43MM SQ BLK H=.65
Series: 628  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 44.45mm x 43.18mm  ·  Height: 0.65" (16.5mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 4.5W @ 30°C  ·  Thermal Resistance @ Forced Air Flow: 1.5°C/W @ 400 LFM
from 2,43Additional information
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518-95AB-MS4518-95AB-MS4Wakefield Thermal SolutionsHEATSINK DC/DC HALF BRICK VERT
Series: 518  ·  Package Cooled: Half Brick DC/DC Converter  ·  Attachment Method: Bolt On  ·  Outline: 61.00mm x 57.90mm  ·  Height: 0.95" (24.13mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 11W @ 60°C  ·  Thermal Resistance @ Forced Air Flow: 2.0°C/W @ 300 LFM
from 3,14
from 7,53		Additional information
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680-125220680-125220Wakefield Thermal SolutionsHEATSINK TO-220 OMNIDIRECT BLK
Series: 680  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On  ·  Outline: 45.97mm x 45.97mm  ·  Height: 1.25" (31.75mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 8W @ 45°C  ·  Thermal Resistance @ Forced Air Flow: 1.5°C/W @ 400 LFM
from 9,93Additional information
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LTN20069-T5LTN20069-T5Wakefield Thermal SolutionsHEAT SINK BGA/PGA 16.5X16.5X8.9
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 16.51mm x 16.51mm  ·  Height: 0.35" (9mm)  ·  Material: Aluminum
from 0,85
from 2,35		Additional information
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630-60ABWakefield Thermal SolutionsHEATSINK FOR BGA 35MM
Series: 630  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Not Included)  ·  Outline: 35.00mm x 35.00mm  ·  Height: 0.6" (15.24mm)  ·  Material: Aluminum
from 1,58Additional information
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1327Wakefield Thermal SolutionsALUM EXTR - 6FT LENGTH
Material: Aluminum
from 23,40Additional information
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657-15ABP657-15ABPWakefield Thermal SolutionsHEATSINK TO-220 W/PINS BLK 1.5
Series: 657  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 41.91mm x 25.40mm  ·  Height: 1.5" (38.1mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 6W @ 38°C  ·  Thermal Resistance @ Forced Air Flow: 3.3°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 6.3°C/W
from 0,89
from 2,45		Additional information
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287-1ABH287-1ABHWakefield Thermal SolutionsHEATSINK VERT MT HOLE BLK TO-220
Series: 287  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 25.40mm x 12.70mm  ·  Height: 1.18" (29.97mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 4W @ 65°C  ·  Thermal Resistance @ Forced Air Flow: 7.8°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 16.2°C/W
from 0,69Additional information
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658-45ABT2Wakefield Thermal SolutionsHEATSINK CPU 28MM SQ BLK W/TAPE
Series: 658  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 27.94mm x 27.94mm  ·  Height: 0.45" (11.43mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 3W @ 50°C  ·  Thermal Resistance @ Forced Air Flow: 6.0°C/W @ 200 LFM
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537-95ABWakefield Thermal SolutionsHEATSINK DC DC 1/4 BRICK VERT
Series: 537  ·  Attachment Method: Bolt On  ·  Outline: 57.91mm x 36.83mm  ·  Height: 0.95" (24.13mm)  ·  Material: Aluminum  ·  Thermal Resistance @ Forced Air Flow: 2.1°C/W @ 300 LFM
from 3,64Additional information
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291-H36AB291-H36ABWakefield Thermal SolutionsHEATSINK TO-220 CLIP-ON BLK
Series: 291  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On  ·  Outline: 27.94mm x 9.14mm  ·  Height: 0.86" (21.84mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 68°C  ·  Thermal Resistance @ Forced Air Flow: 16.0°C/W @ 600 LFM  ·  Thermal Resistance @ Natural: 34°C/W
from 0,32
from 0,88		Additional information
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624-45ABWakefield Thermal SolutionsHEATSINK CPU 21MM SQ W/OUT ADH
Series: 624  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Not Included)  ·  Outline: 21.00mm x 21.00mm  ·  Height: 0.45" (11.43mm)  ·  Material: Aluminum
from 1,20Additional information
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