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016304-81 — ALUMINUM EXTRUSION FLATBACK

ManufacturerWakefield Thermal Solutions
Harmful substancesRoHS   Lead-free
Found under nameQ4125634A
Analogous by characteristics
PhotoNameManufacturerTechnical parametersPrices (rub.)Buy
287-1ABH287-1ABHWakefield Thermal SolutionsHEATSINK VERT MT HOLE BLK TO-220
Series: 287  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 25.40mm x 12.70mm  ·  Height: 1.18" (29.97mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 4W @ 65°C  ·  Thermal Resistance @ Forced Air Flow: 7.8°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 16.2°C/W
from 0,69Additional information
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537-95ABWakefield Thermal SolutionsHEATSINK DC DC 1/4 BRICK VERT
Series: 537  ·  Attachment Method: Bolt On  ·  Outline: 57.91mm x 36.83mm  ·  Height: 0.95" (24.13mm)  ·  Material: Aluminum  ·  Thermal Resistance @ Forced Air Flow: 2.1°C/W @ 300 LFM
from 3,64Additional information
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658-45ABT2Wakefield Thermal SolutionsHEATSINK CPU 28MM SQ BLK W/TAPE
Series: 658  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 27.94mm x 27.94mm  ·  Height: 0.45" (11.43mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 3W @ 50°C  ·  Thermal Resistance @ Forced Air Flow: 6.0°C/W @ 200 LFM
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291-H36AB291-H36ABWakefield Thermal SolutionsHEATSINK TO-220 CLIP-ON BLK
Series: 291  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On  ·  Outline: 27.94mm x 9.14mm  ·  Height: 0.86" (21.84mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 68°C  ·  Thermal Resistance @ Forced Air Flow: 16.0°C/W @ 600 LFM  ·  Thermal Resistance @ Natural: 34°C/W
from 0,32
from 0,88		Additional information
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624-45ABWakefield Thermal SolutionsHEATSINK CPU 21MM SQ W/OUT ADH
Series: 624  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Not Included)  ·  Outline: 21.00mm x 21.00mm  ·  Height: 0.45" (11.43mm)  ·  Material: Aluminum
from 1,20Additional information
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658-35ABT3658-35ABT3Wakefield Thermal SolutionsHEATSINK CPU 28MM SQ BLK W/TAPE
Series: 658  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 27.94mm x 27.94mm  ·  Height: 0.35" (9mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 50°C
from 1,36
from 3,27		Additional information
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265-118ABH-22Wakefield Thermal SolutionsHEATSINK VERT ALUM BLACK TO-220
Series: 265  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 25.40mm x 12.70mm  ·  Height: 1.18" (29.97mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 4W @ 56°C  ·  Thermal Resistance @ Forced Air Flow: 7.0°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 14°C/W
from 0,23Additional information
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630-45ABWakefield Thermal SolutionsHEATSINK FOR BGAS FIN HGT .45
Series: 630  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Not Included)  ·  Outline: 35.00mm x 35.00mm  ·  Height: 0.45" (11.43mm)  ·  Material: Aluminum  ·  Thermal Resistance @ Forced Air Flow: 4°C/W @ 400 LFM
from 1,26Additional information
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624-35ABT4Wakefield Thermal SolutionsHEATSINK CPU 25MM SQUARE W/TAPE
Series: 624  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 25.00mm x 25.00mm  ·  Height: 0.35" (9mm)  ·  Material: Aluminum
from 2,00Additional information
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658-60ABT1658-60ABT1Wakefield Thermal SolutionsHEATSINK CPU 28MM SQ BLK W/TAPE
Series: 658  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 27.94mm x 27.94mm  ·  Height: 0.6" (15.24mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2.5W @ 30°C  ·  Thermal Resistance @ Forced Air Flow: 3°C/W @ 300 LFM
from 1,36
from 3,27		Additional information
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634-20ABP634-20ABPWakefield Thermal SolutionsHEATSINK TO-220 VERT MT BLK 2.0
Series: 634  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 16.25mm x 16.25mm  ·  Height: 2" (50.8mm)  ·  Material: Aluminum
from 1,11
from 3,05		Additional information
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274-2AB274-2ABWakefield Thermal SolutionsHEATSINK LOW HEIGHT BLK TO-220
Series: 274  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On  ·  Outline: 19.05mm x 12.70mm  ·  Height: 0.5" (12.7mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 50°C  ·  Thermal Resistance @ Forced Air Flow: 7.0°C/W @ 400 LFM  ·  Thermal Resistance @ Natural: 25°C/W
from 0,13
from 0,35		Additional information
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5079-72Wakefield Thermal SolutionsHEAT SINK EXTRUSION 6 FOOTfrom 71,98Additional information
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624-45ABT3624-45ABT3Wakefield Thermal SolutionsHEATSINK CPU 21MM SQ W/ADH BLK
Series: 624  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 21.00mm x 21.00mm  ·  Height: 0.45" (11.43mm)  ·  Material: Aluminum  ·  Thermal Resistance @ Forced Air Flow: 15.0°C/W @ 200 LFM
from 1,20
from 3,29		Additional information
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634-10ABP634-10ABPWakefield Thermal SolutionsHEATSINK TO-220 VERT MT BLK 1
Series: 634  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 16.25mm x 16.25mm  ·  Height: 1" (25.4mm)  ·  Material: Aluminum
from 0,98
from 2,70		Additional information
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243-3PAB243-3PABWakefield Thermal SolutionsHEATSINK TO-220 CLIP-ON BLK
Series: 243  ·  Package Cooled: TO-220  ·  Attachment Method: Clip  ·  Outline: 20.32mm x 6.86mm  ·  Height: 0.8" (20.32mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 78°C  ·  Thermal Resistance @ Forced Air Flow: 8.2°C/W @ 400 LFM  ·  Thermal Resistance @ Natural: 39°C/W
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476W476WWakefield Thermal SolutionsHEATSINK NATURAL CONVECTIONC2025
Series: 476  ·  Attachment Method: Bolt On  ·  Outline: 152.40mm x 127.00mm  ·  Height: 5" (127 mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 50W @ 25°C  ·  Thermal Resistance @ Forced Air Flow: 0.2°C/W @ 500 LFM  ·  Thermal Resistance @ Natural: 0.50°C/W
from 62,25Additional information
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657-15ABPN657-15ABPNWakefield Thermal SolutionsHEATSINK TO-220 W/PINS BLK 1.5
Series: 657  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 41.91mm x 25.40mm  ·  Height: 1.5" (38.1mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 6W @ 38°C  ·  Thermal Resistance @ Forced Air Flow: 3.3°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 6.3°C/W
from 0,89
from 2,45		Additional information
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423K423KWakefield Thermal SolutionsHEATSINK POWER NO MNT HOLES BLK
Series: 423  ·  Package Cooled: TO-3  ·  Attachment Method: Press Fit  ·  Outline: 139.70mm x 120.65mm  ·  Height: 2.62" (66.55mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 50W @ 47°C  ·  Thermal Resistance @ Forced Air Flow: 0.5°C/W @ 250 LFM  ·  Thermal Resistance @ Natural: 0.96°C/W
from 9,66
from 19,33		Additional information
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233-60AB-10Wakefield Thermal SolutionsHEATSINK TO-220 VERT BLK W/TABS
Series: 233  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On  ·  Outline: 14.48mm x 12.70mm  ·  Height: 0.725" (18.415mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 58°C  ·  Thermal Resistance @ Forced Air Flow: 11.0°C/W @ 400 LFM  ·  Thermal Resistance @ Natural: 29°C/W
from 0,33Additional information
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658-60ABT4658-60ABT4Wakefield Thermal SolutionsHEATSINK CPU 27.9MM SQ W/ADH BLK
Series: 658  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 27.94mm x 27.94mm  ·  Height: 0.6" (15.24mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2.5W @ 30°C  ·  Thermal Resistance @ Forced Air Flow: 3°C/W @ 300 LFM
from 1,50
from 3,60		Additional information
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667-10ABPP667-10ABPPWakefield Thermal SolutionsHEATSINK TO-220 W/PINS
Series: 667  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 34.92mm x 12.70mm  ·  Height: 1" (25.4mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 6W @ 76°C  ·  Thermal Resistance @ Forced Air Flow: 5.8°C/W @ 200 LFM
from 1,15
from 3,15		Additional information
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518-95AB518-95ABWakefield Thermal SolutionsHEATSINK DC/DC HALF BRICK VERT
Series: 518  ·  Package Cooled: Half Brick DC/DC Converter  ·  Attachment Method: Bolt On  ·  Outline: 61.00mm x 57.90mm  ·  Height: 0.95" (24.13mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 11W @ 60°C  ·  Thermal Resistance @ Forced Air Flow: 2.0°C/W @ 300 LFM
from 1,65
from 3,96		Additional information
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D10850-40D10850-40Wakefield Thermal SolutionsHEATSINK 128PQFP COMPOSITE
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Not Included)  ·  Outline: 21.60mm x 21.60mm  ·  Height: 0.4" (10.16mm)  ·  Material: Composite  ·  Power Dissipation @ Temperature Rise: 2W @ 80°C  ·  Thermal Resistance @ Forced Air Flow: 10°C/W @ 500 LFM
from 0,92
from 2,52		Additional information
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647-10ABP647-10ABPWakefield Thermal SolutionsHEATSINK TO-220 W/PINS BLK 1
Series: 647  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 41.91mm x 25.40mm  ·  Height: 1" (25.4mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 6W @ 42°C  ·  Thermal Resistance @ Forced Air Flow: 3.8°C/W @ 200 LFM
from 0,98
from 2,70		Additional information
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