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Fans, Thermal Management  ·  Heat Sinks
 

013224 — HEATSINK EXTRUSION ALUM 8FT

ManufacturerWakefield Thermal Solutions
Harmful substancesRoHS   Lead-free
MaterialAluminum
Found under nameQ4146974
Analogous by characteristics
PhotoNameManufacturerTechnical parametersPrices (rub.)Buy
641K641KWakefield Thermal SolutionsHEATSINK TO-3 HORZ MT NO HOLES
Series: 641  ·  Package Cooled: TO-3  ·  Attachment Method: Bolt On  ·  Outline: 104.77mm x 76.20mm  ·  Height: 1" (25.4mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 15W @ 36°C  ·  Thermal Resistance @ Forced Air Flow: 0.9°C/W @ 250 LFM  ·  Thermal Resistance @ Natural: 2.4°C/W
from 4,54
from 10,89		Additional information
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527-24AB-MS4Wakefield Thermal SolutionsHEATSINK BXB50,75,100,150.24"HRZ
Series: 527  ·  Package Cooled: Half Brick DC/DC Converter  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 60.96mm x 57.91mm  ·  Height: 0.24" (6.10mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 5W @ 60°C  ·  Thermal Resistance @ Forced Air Flow: 5.8°C/W @ 300 LFM
from 6,44Additional information
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625-25ABT-4EWakefield Thermal SolutionsBGA HEATSINK 25MM
Series: 625  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Not Included)  ·  Outline: 25.00mm x 25.00mm  ·  Height: 0.25" (6.35mm)  ·  Material: Aluminum
from 1,33Additional information
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695-1B695-1BWakefield Thermal SolutionsHEATSINK FOR STUD MT DIODE BLACK
Series: 695  ·  Package Cooled: Stud Mounted Diode  ·  Attachment Method: Bolt On  ·  Outline: 33.80mm Dia  ·  Height: 0.531" (13.49mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 4W @ 72°C  ·  Thermal Resistance @ Forced Air Flow: 5.2°C/W @ 400 LFM  ·  Thermal Resistance @ Natural: 18°C/W
from 0,73
from 2,00		Additional information
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658-25AB658-25ABWakefield Thermal SolutionsHEATSINK CPU 28MM SQ BLK
Series: 658  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Not Included)  ·  Outline: 27.94mm x 27.94mm  ·  Height: 0.25" (6.35mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 40°C  ·  Thermal Resistance @ Forced Air Flow: 5°C/W @ 500 LFM
from 0,57
from 1,58		Additional information
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624-45AB-T4EWakefield Thermal SolutionsHEATSINK CPU 21MM SQ
Series: 624  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: SMD Pad  ·  Outline: 21.00mm x 21.00mm  ·  Height: 0.45" (11.43mm)  ·  Material: Aluminum
from 1,95Additional information
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290-1AB290-1ABWakefield Thermal SolutionsHEATSINK TO-220 VERT/HORZ BLK
Series: 290  ·  Package Cooled: TO-218, TO-202, TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 30.00mm x 25.40mm  ·  Height: 0.5" (12.7mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 44°C  ·  Thermal Resistance @ Forced Air Flow: 35.0°C/W @ 400 LFM  ·  Thermal Resistance @ Natural: 22°C/W
from 0,22
from 0,60		Additional information
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658-25ABT2658-25ABT2Wakefield Thermal SolutionsHEATSINK CPU 28MM SQ BLK W/TAPE
Series: 658  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 27.94mm x 27.94mm  ·  Height: 0.25" (6.35mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 4W @ 70°C  ·  Thermal Resistance @ Forced Air Flow: 5°C/W @ 500 LFM
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658-60ABT4E658-60ABT4EWakefield Thermal SolutionsHEATSINK CPU 27.9MM SQ W/ADH BLK
Series: 658  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 27.94mm x 27.94mm  ·  Height: 0.6" (15.24mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2.5W @ 30°C  ·  Thermal Resistance @ Forced Air Flow: 3°C/W @ 300 LFM
from 1,53
from 4,20		Additional information
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609-50ABS3609-50ABS3Wakefield Thermal SolutionsHEATSINK FOR POWERPC CPU BLK
Series: 609  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Clip  ·  Outline: 73.53mm x 50.80mm  ·  Height: 0.5" (12.7mm)  ·  Material: Aluminum  ·  Thermal Resistance @ Forced Air Flow: 2°C/W @ 400 LFM
from 4,44
from 10,65		Additional information
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642-35ABT3Wakefield Thermal SolutionsHEAT SINK WITH THERMAL TAPE
Series: 642  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 35.00mm x 35.00mm  ·  Height: 0.35" (9mm)  ·  Material: Aluminum
from 1,84Additional information
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528-45AB528-45ABWakefield Thermal SolutionsHEATSINK DC/DC HALF BRICK VERT
Series: 528  ·  Package Cooled: Half Brick DC/DC Converter  ·  Attachment Method: Bolt On  ·  Outline: 61.00mm x 57.90mm  ·  Height: 0.45" (11.43mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 7W @ 60°C  ·  Thermal Resistance @ Forced Air Flow: 3.2°C/W @ 300 LFM
from 1,41
from 3,39		Additional information
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658-60ABT2658-60ABT2Wakefield Thermal SolutionsHEATSINK CPU 28MM SQ BLK W/TAPE
Series: 658  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 27.94mm x 27.94mm  ·  Height: 0.6" (15.24mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2.5W @ 30°C  ·  Thermal Resistance @ Forced Air Flow: 3°C/W @ 300 LFM
Additional information
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624-25ABT4E624-25ABT4EWakefield Thermal SolutionsHEATSINK CPU 21MM SQ W/DBL TAPE
Series: 624  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 21.00mm x 21.00mm  ·  Height: 0.25" (6.35mm)  ·  Material: Aluminum  ·  Thermal Resistance @ Forced Air Flow: 20°C/W @ 350 LFM
from 1,18
from 2,82		Additional information
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287-1AB287-1ABWakefield Thermal SolutionsHEATSINK TO-220 VERT W/TABS BLK
Series: 287  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 25.40mm x 12.70mm  ·  Height: 1.18" (29.97mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 4W @ 65°C  ·  Thermal Resistance @ Forced Air Flow: 7.8°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 16.2°C/W
from 0,69
from 1,89		Additional information
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677-10ABPWakefield Thermal SolutionsHEATSINK MULTIWATT 1.0" BLK
Series: 677  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 41.91mm x 25.40mm  ·  Height: 1" (25.4mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 6W @ 76°C  ·  Thermal Resistance @ Forced Air Flow: 5.8°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 8.7°C/W
from 1,43Additional information
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680-125A680-125AWakefield Thermal SolutionsHEATSINK POWER TO-3 BLK
Series: 680  ·  Package Cooled: TO-3  ·  Attachment Method: Bolt On  ·  Outline: 45.97mm x 45.97mm  ·  Height: 1.25" (31.75mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 8W @ 45°C  ·  Thermal Resistance @ Forced Air Flow: 1.5°C/W @ 400 LFM  ·  Thermal Resistance @ Natural: 6°C/W
from 5,18
from 12,42		Additional information
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637-20ABP637-20ABPWakefield Thermal SolutionsHEATSINK TO-220 VERT MT BLK 2
Series: 637  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 34.92mm x 12.70mm  ·  Height: 2" (50.8mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 6W @ 55°C  ·  Thermal Resistance @ Forced Air Flow: 4.7°C/W @ 200 LFM  ·  Thermal Resistance @ Natural: 9.2°C/W
from 1,03
from 2,84		Additional information
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270-AB270-ABWakefield Thermal SolutionsHEATSINK TO-220 SM FOOTPRINT BLK
Series: 270  ·  Package Cooled: TO-220, TO-202  ·  Attachment Method: Bolt On  ·  Outline: 44.45mm x 17.78mm  ·  Height: 0.375" (9.53mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 4W @ 70°C  ·  Thermal Resistance @ Forced Air Flow: 6.0°C/W @ 400 LFM  ·  Thermal Resistance @ Natural: 17.5°C/W
from 0,18
from 0,49		Additional information
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230-75AB230-75ABWakefield Thermal SolutionsHEATSINK TO-220 VERT/HORZ BLK
Series: 230  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On  ·  Outline: 14.48mm x 12.70mm  ·  Height: 0.75" (19.05mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 57°C  ·  Thermal Resistance @ Forced Air Flow: 7.5°C/W @ 400 LFM  ·  Thermal Resistance @ Natural: 28.5°C/W
from 0,20
from 0,56		Additional information
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233-60ABWakefield Thermal SolutionsHEATSINK TO-220 VERT/HORZ BLK
Series: 233  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On  ·  Outline: 14.48mm x 12.70mm  ·  Height: 0.600" (15.20mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 2W @ 58°C  ·  Thermal Resistance @ Forced Air Flow: 11.0°C/W @ 400 LFM  ·  Thermal Resistance @ Natural: 29°C/W
from 0,22Additional information
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658-35ABT4E658-35ABT4EWakefield Thermal SolutionsHEATSINK CPU 28MM SQ BLK W/TAPE
Series: 658  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 27.94mm x 27.94mm  ·  Height: 0.35" (9mm)  ·  Material: Aluminum  ·  Thermal Resistance @ Forced Air Flow: 8.0°C/W @ 200 LFM
from 1,39
from 3,33		Additional information
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657-20ABPE657-20ABPEWakefield Thermal SolutionsHEATSINK TO-220 W/PINS BLK 2
Series: 657  ·  Package Cooled: TO-220  ·  Attachment Method: Bolt On and PC Pin  ·  Outline: 41.91mm x 25.40mm  ·  Height: 2" (50.8mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 6W @ 32°C  ·  Thermal Resistance @ Forced Air Flow: 2.9°C/W @ 200 LFM
from 1,19Additional information
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528-45AB-MS4528-45AB-MS4Wakefield Thermal SolutionsHEATSINK BXB50,75,100,150.45"VRT
Series: 528  ·  Package Cooled: Half Brick DC/DC Converter  ·  Attachment Method: Thermal Tape, Adhesive (Included)  ·  Outline: 61.00mm x 57.90mm  ·  Height: 0.45" (11.43mm)  ·  Material: Aluminum  ·  Power Dissipation @ Temperature Rise: 7W @ 60°C  ·  Thermal Resistance @ Forced Air Flow: 3.2°C/W @ 300 LFM
from 6,94Additional information
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642-45AB642-45ABWakefield Thermal SolutionsHEATSINK CPU 35MM SQ H=.45" BLK
Series: 642  ·  Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)  ·  Attachment Method: Thermal Tape, Adhesive (Not Included)  ·  Outline: 35.00mm x 35.00mm  ·  Height: 0.45" (11.43mm)  ·  Material: Aluminum
from 0,83
from 2,28		Additional information
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