Fans, Thermal Management  ·  Heat Sink Pads

Q3-67 — HEATPAD POWER MODULE .005" Q3

Manufacturer	Bergquist
Harmful substances	RoHS   Lead-free
Series	Q-Pad® 3
Usage	SIP, Power Module
Shape	Rectangular
Outline	38.10mm x 22.86mm
Thickness	0.005" (0.127mm)
Material	Graphite Elastomer
Thermal Resistivity	0.35°C/W
Thermal Conductivity	2 W/m-K
Found under name	BER136