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HF115TAAC-58

- Dimensional Drawing

HF115TAAC-58 — HEATPAD TO-220 W/ADH HI-FLOW

ManufacturerBergquist
Harmful substancesRoHS   Lead-free
SeriesHi-Flow 115 AC
UsageTO-220
ShapeRectangular
Outline19.05mm x 12.70mm
Thickness0.005" (0.127mm)
MaterialFiberglass
Thermal Resistivity0.2°C/W
Thermal Conductivity0.8 W/m-K
Found under nameBER168, HF115AC-58
Analogous by characteristics
PhotoNameManufacturerTechnical parametersPrices (rub.)Buy
HF115TAAC-54HF115TAAC-54BergquistHEATPAD TO-220 W/ADH HI-FLOW
Series: Hi-Flow 115 AC  ·  Usage: TO-220  ·  Shape: Rectangular  ·  Outline: 19.05mm x 12.70mm  ·  Thickness: 0.005" (0.127mm)  ·  Material: Fiberglass  ·  Thermal Resistivity: 0.2°C/W  ·  Thermal Conductivity: 0.8 W/m-K
from 0,04
from 0,10		Additional information
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