Standard EIA Chip Size: 0408. ✓ Weight 0.73 milligrams (Approximate). ✓ Available in Lead-Free Plating. ✓ Solder Reflow Temperature:.
U0408FC3.3C Datasheet - 3.3V; 200W; unbumped flip chip array ...
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Description: 3.3V; 200W; unbumped flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards ; Manufacturer:.
24.0V; 200W; unbumped flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards
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U0408FC3.3C 数据表- Specifications: Configuration: Array ...
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U0408FC3.3C Specifications: Configuration: Array ; Direction: Bidirectional ; Package: ROHS COMPLIANT, FLIP CHIP-8 ; Pin Count: 8 ; Number of Diodes: 8 ...
U0408FC3.3C, 3.3V; 200W; unbumped flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards, Protek ...
U0408FC3.3C-LF-T7-1 · U05-M-17 · U01100A0007 · U040-C03-C · U06C · U001-0471-103-Z · U/BJ26GF-3 · U002-0400-114-Z · U003-T650-223-Z2 · U0402FC36C-LF-T710-1
U0408FC3.3C, 3.3V; 200W; unbumped flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards, Protek ...
€0 to €1
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FEATURES ✓ ESD Protection > 25 kilovolts ✓ Available in Multiple Voltage Types Ranging From 3.3V to 36V ✓ 250 Watts Peak Pulse Power Dissipation per Line ...