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Part #: K4H560838E-GCB3 ; Manufacturer: Samsung Semiconductor Division ; Description: DDR1 DRAM, 32MX8, 0.7ns, CMOS, PBGA60 ; Access Mode, FOUR BANK PAGE BURST.
K4H560838E-GCB3 from www.alldatasheet.com
Part #: K4H560838E-GCB3. Download. File Size: 244Kbytes. Page: 24 Pages. Description: 256Mb E-die DDR SDRAM Specification 60Ball FBGA (x4/x8).
Details, datasheet, quote on part number: K4H560838E-TCCC ; Bits per Word, 8 bits ; Package Type, FBGA-60 ; Pins, 60 ; Logic Family, CMOS ; Supply Voltage, 2.5V.
The K4H560838E-GCB3 electronic component is brought into production by SAMSUNG, included in Processors / Microcontrollers. Each device is available in a ...
Details, datasheet, quote on part number: K4H560838E-TCB3 ; Memory Category, DRAM Chip ; Density, 268435 kbits ; Number of Words, 32000 k ; Bits per Word, 8 bits.
K4H560838E-GCB3 - Datasheet AI, DatasheetGPT, ChatPDF, Datasheet, Manuals, User Guides, Cross Reference, Circuit and Application Notes.
K4H560838E-GCB3. Search Result 1. Category, DRAM. Class, DDR 333. Description, DDR-333 32Mx8 BGA. Market Description. Part No. K4H560838E-GCB3. Brand, Samsung.
Here is our current list of Electronic Components available from Samsung Semiconductor. Please click on the link to the part you are looking for to go to the ...
Part #: K4H560838E-VCB3. Download. File Size: 297Kbytes. Page: 23 Pages. Description: 256Mb E-die DDR SDRAM Specification 54 sTSOP-II with Pb-Free (RoHS ...
Missing: GCB3 | Show results with:GCB3
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The K4H561638F-UCB3 parts are 256Mb F-die DDR SDRAM Specification, a member of the K4H561638F family manufactured by SAMSUNG are available for purchase at ...